GOLD METAL DETECTORS Search Results

photodiode demodulation

Abstract: gold metal detectors gold detectors circuit bond wire gold fiber optic detector fibre optic laser ceramic package PDB-C122
Contextual Info: PHOTONIC Silicon Photodiode, Blue Enhanced Photoconductive Monitor Photodiode Type PDB-C122 DETECTORS INC. PACKAGE DIMENSIONS INCH [mm] GOLD METAL THIS SIDE CL .040 [1.02] ACTIVE AREA CL .030 [0.76] .060 [1.52] ANODE METALIZATION TOP VIEW CATHODE METALIZATION

Contextual Info: PHOTONIC Silicon Photodiode, Blue Enhanced Photoconductive Monitor Photodiode Type PDB-C122 DETECTORS INC. PACKAGE DIMENSIONS INCH [mm] GOLD METAL THIS SIDE CL .040 [1.02] ACTIVE AREA C L .030 [0.76] .060 [1.52] ANODE METALIZATION TOP VIEW CATHODE METALIZATION

avr 102

Contextual Info: BEAM LEAD SCHOTTKY DIODES FOR MIXERS AND DETECTORS 1-26 GHZ HSCH-5300 SERIES Features PLATINUM TRI-METAL SYSTEM High Temperature Stability * CATHODE / 130(6) ICO (4) SILICON NITRIDE PASSIVATION Stable, Reliable Performance <jU1 _U LCAUil GOLD LEADS t Zir-piTO

AD9686BH

Abstract: AD9686TQ AD9686 AD9686BQ AD9686TE AD9686TH Q-16
Contextual Info: High-Speed TTL Voltage Comparator ANALOG DEVICES □ AD9686 AD9686 FUNCTIONAL BLOCK DIAGRAM FEATURES 7ns Propagation Delay Complementary TTL Outputs 85dB CMRR + 5V, —6V Supply Voltages + 5 .0 V APPLICATIONS High-Speed Triggers High-Speed Line Receivers Peak Detectors

AD9686

Abstract: AD9686BH AD9686BQ AD9686TE AD9686TH AD9686TQ Q-16
Contextual Info: High-Speed TTL Voltage Comparator ANALOG DEVICES □ AD9686 AD9686 FUNCTIONAL BLOCK DIAGRAM FEATURES 7ns Propagation Delay Complementary TTL Outputs 85dB CMRR + 5V, —6V Supply Voltages + 5 .0 V APPLICATIONS High-Speed Triggers High-Speed Line Receivers Peak Detectors

cdb7619

Contextual Info: DATA SHEET Silicon Schottky Barrier Diodes: Packaged, Bondable Chips and Beam Leads Applications • Detectors  Mixers Features  Available in both P-type and N-type low barrier designs  Low 1/f noise  Large bond pad chip design  Planar passivated beam-lead and chip construction

diode RL 207

Abstract: gold metal detectors gold detector circuit free x band diode detector waveguide CDB7620-207 ka-band mixer DDB2503-250 DDB2504-000 DDB2504-230 DDB2265-000
Contextual Info: DATA SHEET Silicon Schottky Barrier Diodes: Packaged, Bondable Chips and Beam Leads Applications x Detectors Features x Available in both P-type and N-type low barrier silicon x Low 1/f noise x Bonded junctions for reliability x Planar passivated beam-lead and chip construction

Scans-051

Abstract: AD9686TH
Contextual Info: High-Speed TTLVoltage Comparator AD9686 ANALOG DEVICES □ AD9686 FUNCTIONAL BLOCK DIAGRAM FEATURES 7ns Propagation Delay Complementary TTL Outputs 85dB CMRR + 5V, —6V Supply Voltages APPLICATIONS High-Speed Triggers High-Speed Line Receivers Peak Detectors

311 comparator pin diagram

Abstract: 9685BH AD9687BD AD9685
Contextual Info: ANALOG DEVICES □ High-Speed Comparators AD9685/AD9687 FEATURES AD9685/AD9687 FUNCTIONAL BLOCK DIAGRAMS 2.7ns Propagation Delay 0.5ns Latch Setup Time 90dB CMRR + 5V, -5 .2 V Supply Voltages APPLICATIONS High-Speed Triggers High-Speed Line Receivers Peak Detectors

gold metal detectors

Abstract: epoxy adhesive paste cte table 28 pin ic base socket round pin type lead spot welding schematics soft solder die bonding electrical three phase schematic riser DIAGRAM CERAMIC PIN GRID ARRAY wire lead frame ausi die attach thin silicon die soft solder wire dispensing 10 k ntc thermistor
Contextual Info: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity

Alumina ceramic AI203

Abstract: ausi die attach gold metal detectors AI203 gold melting furnace pressure low die attach spot welding schematics ausi die attach thin silicon die Dissolve Oxygen ceramic pin grid array package wire bond
Contextual Info: Alumina & Leaded Molded Technology 3 3.1 Introduction The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity

solid solubility

Abstract: chemical control process block diagram
Contextual Info: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity

Ultrasonic Cleaning Transducer

Abstract: Ultrasonic welding circuit diagram gold metal detectors ultrasonic transducer cleaning bath Ultrasonic nozzle schematic ultrasonic motion detector gold detectors circuit INCOMING RAW MATERIAL INSPECTION soft solder wire dispensing soft solder die bonding
Contextual Info: CHAPTER 3 IC ASSEMBLY TECHNOLOGY INTRODUCTION The material and process technology steps used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter The package families described in Chapter 1 provide the functional specialization and diversity required by our customers Material and construction attributes of individual family

gold metal detectors

Abstract: soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008
Contextual Info: 2 3 Component Assembly Technology 1/22/97 9:49 AM CH03WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 3 COMPONENT ASSEMBLY TECHNOLOGY 3.1. INTRODUCTION The packaging technologies used to manufacture or assemble Intel’s three basic types of

MAX8211CPA

Abstract: MAX8211 MAX8212 MAX8216 MAX8211EJA MAX8211MJA ICL8212 MAX8211EPA
Contextual Info: Maxim > Products > [Timekeeping, Timers, and Counters] [Military/Aerospace] MAX8211, MAX8212 Microprocessor Voltage Monitors with Programmable Voltage Detection Description Maxim's MAX8211 and MAX8212 are CMOS micropower voltage detectors that warn microprocessors µPs of power failures. Each contains a comparator, a

2455R

Abstract: 2455RM 2450rc 3455rm 2455Rc 2455r honeywell 2455rbv 3455r 3450rc thermostats 3455rm
Contextual Info: THERMOSTATS - COMMERCIAL Thermostats - Commercial Commercial thermostats include products for use in a wide array of small and major appliances, automotive applications, office copy machines, heat and smoke detectors and HVAC equipment. These snap-action thermostats include automatic or manual reset options, phenolic or

Microwave zero bias detector diodes

Contextual Info: W hol H EW LETT 1"EM P A C K A R D Schottky Barrier Diodes for Stripline, Microstrip Mixers and Detectors Technical Data Features • Small Size • Low Noise Figure 6 dB Typical at 9 GHz • Rugged Design • High Uniformity • High Burnout Rating 1 VVRF Pulse Power Incident

5082-2200

Contextual Info: W fip t H E W LE T T rnLKÄ PACKARD Schottky Barrier Diodes for Stripline, Microstrip Mixers and Detectors 5082-2200/01/02/03 5082-2207/08/09/10 5082-2765/66 5082-2774/75 5082-2785/86 5082-2794/95 Technical Data Features • Small Size • Low Noise Figure

Contextual Info: HMC363G8 v00.0203 FREQUENCY DIVIDERS & DETECTORS - SMT 5 SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 12.0 GHz Typical Applications Features Prescaler for DC to X Band PLL Applications: Ultra Low SSB Phase Noise: -153 dBc/Hz • Point-to-Point / Multi-Point Radios

Contextual Info: What EW LETT* miltm HPACKARD Schottky Barrier Diodes for Stripline, Microstrip Mixers and Detectors Technical Data Features • Small Size • Low Noise Figure 6 dB Typical at 9 GHz • Rugged Design • High Uniformity • High Burnout Rating 1 W RF Pulse Power Incident

gold metal detectors

Abstract: gold detectors circuit "Frequency Dividers" Corning 7052 PF 1002 HMC364G8
Contextual Info: HMC364G8 v00.1002 FREQUENCY DIVIDERS & DETECTORS - SMT 6 SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 13 GHz Typical Applications Features Prescaler for DC to X Band PLL Applications: Ultra Low SSB Phase Noise: -145 dBc/Hz • Point-to-Point / Multi-Point Radios Wide Bandwidth

Contextual Info: HMC365G8 v02.0410 FREQUENCY DIVIDERS & DETECTORS - SMT 4 SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 13 GHz Typical Applications Features Prescaler for DC to Ku Band PLL Applications: Ultra Low SSB Phase Noise: -151 dBc/Hz • Point-to-Point / Multi-Point Radios Wide Bandwidth

Contextual Info: HMC364G8 v00.1002 SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 13.0 GHz FREQ. DIVIDERS & DETECTORS - SMT 10 Typical Applications Features Prescaler for DC to X Band PLL Applications: Ultra Low SSB Phase Noise: -145 dBc/Hz • Point-to-Point / Multi-Point Radios Wide Bandwidth

gold metal detectors

Abstract: gold detectors circuit corning tantalum "Frequency Dividers" Corning 7052 HMC365G8
Contextual Info: HMC365G8 v00.1002 FREQUENCY DIVIDERS & DETECTORS - SMT 6 SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 13 GHz Typical Applications Features Prescaler for DC to Ku Band PLL Applications: Ultra Low SSB Phase Noise: -151 dBc/Hz • Point-to-Point / Multi-Point Radios Wide Bandwidth