GOLD RESISTIVITY Search Results
GOLD RESISTIVITY Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| PGA900AYZST |
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Programmable resistive sensing conditioner with digital and analog outputs 36-DSBGA -40 to 150 |
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| SN74LVC2G66YZPR |
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2-Channel, 1:1 Analog Switch with Low On-State Resistance 8-DSBGA -40 to 85 |
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| SN74LVC2G66DCUTG4 |
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2-Channel, 1:1 Analog Switch with Low On-State Resistance 8-VSSOP -40 to 85 |
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| SN74LVC2G66DCTRE4 |
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2-Channel, 1:1 Analog Switch with Low On-State Resistance 8-SM8 -40 to 85 |
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| SN74LVC2G66DCTRG4 |
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2-Channel, 1:1 Analog Switch with Low On-State Resistance 8-SM8 -40 to 85 |
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GOLD RESISTIVITY Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: 13 12 10 MATERIALS AND FINISHES BODY: BRASS PLATED GOLD CENTER CONTACT: BERYLLIUM COPPER PLATED GOLD 15.24 COMPLIANT PINS: BERYLLIUM COPPER 5.08 REF .200 TYP PLATED GOLD 2.54 REF .100 TYP 5.08 _ INSULATOR: UHMW POLYETHYLENE SURFACE RESISTIVITY 10E13 OHM/SO |
OCR Scan |
10E13 10E18 PS-89675-2830 -348A, SD-73251-138 | |
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Contextual Info: CSOM www.vishay.com Vishay Dale Thin Film Sandwich, 25 mil Pitch, Dual In-Line Thin Film Resistor, Surface Mount Network FEATURES • Lead Pb -free gold plated terminals standard • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic |
Original |
2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12 | |
resistivity wire nichromeContextual Info: CSO Vishay Thin Film Sandwich, 50 mil Pitch, Dual In-Line Resistor, Surface Mount Network FEATURES • Lead Pb -free gold plated terminals standard • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no |
Original |
18-Jul-08 resistivity wire nichrome | |
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Contextual Info: CSO Vishay Thin Film Sandwich, 50 mil Pitch, Dual In-Line Resistor, Surface Mount Network FEATURES • Lead Pb -free gold plated terminals standard • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no |
Original |
11-Mar-11 | |
marking 722Contextual Info: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low profile 0.20 Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermocompression bonding (no internal solder) |
Original |
03-May-01 marking 722 | |
resistivity wire nichrome
Abstract: tantalum nitride
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Original |
2002/95/EC 18-Jul-08 resistivity wire nichrome tantalum nitride | |
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Contextual Info: CSD Vishay Thin Film Ceramic Sandwich, Dual-In-Line, Resistor Network Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermocompression bonding (no internal solder). • Monolithic construction |
Original |
27-Apr-01 | |
MC ATAU - PrecisionContextual Info: MC ATAU - Precision www.vishay.com Vishay Beyschlag Precision Gold Terminated Thin Film Chip Resistors for Conductive Gluing FEATURES • Gold terminations for conductive gluing • Superior temperature cycling robustness • Superior moisture resistivity, |R/R| < 0.5 % |
Original |
AEC-Q200 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12 MC ATAU - Precision | |
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Contextual Info: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor, Through Hole Network Low Profile 0.20 Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no |
Original |
18-Jul-08 | |
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Contextual Info: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor, Through Hole Network Low Profile 0.20 Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no |
Original |
2002/95/EC 11-Mar-11 | |
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Contextual Info: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low profile 0.20 Custom FEATURES • Lead (Pb)-Free available • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding |
Original |
05-May-05 | |
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Contextual Info: CSD Vishay Thin Film Ceramic Sandwich, Dual-In-Line, Resistor Network Custom FEATURES • Lead (Pb)-Free available • Gold-to-gold terminations. External leads are Pb-free attached directly to gold pads on the ceramic Available substrate by thermo-compression bonding |
Original |
05-May-05 | |
508E-10Contextual Info: Vishay Thin Film Sandwich, 50 Mil Pitch, Dual-In-Line Resistor Networks FEATURES • Lead Pb -Free available • Gold-to-gold terminations. External leads are Pb-free attached directly to gold pads on the ceramic Available substrate by thermo-compression bonding |
Original |
10-May-05 508E-10 | |
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Contextual Info: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low Profile 0.20 Custom FEATURES • Lead (Pb)-free available • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no |
Original |
18-Jul-08 | |
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Contextual Info: CTSP www.vishay.com Vishay Dale Thin Film Molded, Commercial, Single In-Line Thin Film Resistor, Through Hole Network Custom FEATURES • Lead (Pb)-free gold plated terminals standard • Gold to gold terminations (no internal solder) • Exceptional ratio stability over time and |
Original |
2002/95/EC MIL-PRF-83401 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 | |
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Contextual Info: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low Profile 0.20 Custom FEATURES • Lead (Pb)-free available • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no |
Original |
08-Apr-05 | |
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Contextual Info: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low profile 0.20 Custom FEATURES • Lead (Pb)-Free available • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding |
Original |
08-Apr-05 | |
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Contextual Info: CTSP www.vishay.com Vishay Dale Thin Film Molded, Commercial, Single In-Line Thin Film Resistor, Through Hole Network Custom FEATURES • Lead (Pb)-free gold plated terminals standard • Gold to gold terminations (no internal solder) • Exceptional ratio stability over time and |
Original |
2002/95/EC MIL-PRF-83401 11-Mar-11 | |
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Contextual Info: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low profile 0.20 Custom FEATURES • Lead (Pb)-free available • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no |
Original |
08-Apr-05 | |
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Contextual Info: Vishay Thin Film Sandwich, 50 Mil Pitch, Dual-In-Line Resistor Networks FEATURES • Lead Pb -Free available • Gold-to-gold terminations. External leads are Pb-free attached directly to gold pads on the ceramic Available substrate by thermo-compression bonding |
Original |
08-Apr-05 | |
tantalum nitrideContextual Info: Vishay Thin Film Sandwich, 50 Mil Pitch, Dual-In-Line Resistor Networks FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermocompression bonding no internal solder . • Tighter tolerances than molded standards. |
Original |
27-Apr-01 tantalum nitride | |
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Contextual Info: CSD Vishay Thin Film Ceramic Sandwich, Dual-In-Line, Resistor Network Custom FEATURES • Lead (Pb)-Free available • Gold-to-gold terminations. External leads are Pb-free attached directly to gold pads on the ceramic Available substrate by thermo-compression bonding |
Original |
08-Apr-05 | |
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Contextual Info: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low profile 0.20 Custom FEATURES • Lead (Pb)-free available • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no |
Original |
08-Apr-05 | |
MC ATAU - PrecisionContextual Info: ACAS 0606 ATAU - Precision www.vishay.com Vishay Beyschlag Precision Gold Terminated Thin Film Chip Resistor Array for Conductive Gluing FEATURES • Gold terminations for conductive gluing • Superior moisture resistivity, |R/R| < 0.5 % 85 °C; 85 % RH; 1000 h |
Original |
2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12 MC ATAU - Precision | |