H CHIP LED Search Results

Contextual Info: LC6527C.H 6528C,H CMOS LSI 3007A 4-Bit Single Chip Microcomputer Small-Scale Control, Medium/High-Speed Type, On-Chip LED Driver 'E 1260C General Description The LC6527C/H, LC6528C/H are single-chip 4-bit microcomputers fabricated using CMOS process technology and

KBR1000H

Abstract: EVA800-TB6527 LC6523
Contextual Info: SANYO SEMICONDUCTOR CORP 22E TW QTfa D QOQb Hb 3 T LC6527C,H 6528C.H 3007A 3095 CMOS LSI 4-Bit Single Chip Microcomputer Small-Scale Control, Medium/High-Speed Type, On-Chip LED Driver 2260C General Description The LC6527C/H, LC6528C/H are single-chip 4-bit microcomputers fabricated using CMOS process technology and

Contextual Info: PCB LED Sizes & Packages TRI-LEVEL N/A N/A N/A BI-LEVEL m N/A 1 SINGLES m H % li 1 AXIAL SINGLE CHIP SINGLE CHIP SINGLE CHIP DUAL CHIP 6 MULTICHIP

C5060

Abstract: gm5020 c5020 genesis lcd controller dram GM5060 Genesis Microchip osd samsung lcd monitor circuit diagram genesis 8125 from DVI input to RGB output VGA "Frame rate conversion"
Contextual Info: Genesis Microchip Publication DATA SHEET gm5060/gm5060-H Sections in this document and all other related documentation that mention HDCP refer only to the gm5060-H HDCP-enabled chip. All other sections apply to both the gm5060-H chip and the gm5060 (non-HDCP) chip.

gm5020

Abstract: c5020 DW 01k genesis gm5020 C5020-APN-01D genesis gm5020 s video pinout C5020-APN-01 samsung lcd monitor circuit diagram tft interface with 8051 OSD microcontroller LCD monitor
Contextual Info: Genesis Microchip Publication DATA SHEET gm5020/gm5020-H Sections in this document and all other related documentation that mention HDCP refer only to the gm5020-H HDCP-enabled chip. All other sections apply to both the gm5020-H chip and the gm5020 (non-HDCP) chip.

GENESIS gm5010

Abstract: gm5010 c5020 samsung lcd monitor circuit diagram tft interface with 8051 BT656 gm5020 RGB sog Genesis Microchip osd genesis block diagram
Contextual Info: Genesis Microchip Publication DATA SHEET gm5010/gm5010-H Sections in this document and all other related documentation that mention HDCP refer only to the gm5010-H HDCP-enabled chip. All other sections apply to both the gm5010-H chip and the gm5010 (non-HDCP) chip.

TF012

Contextual Info: • Features INFRARED CHIP LEDs 1. Chip type photo transistor 2. Small, square type with external dimen­ sions of 3.2 L xi.6(W )xi.i(H)m m 3. Automatic mounting on P.C. boards by chip mounter available 4. Reflow soldering available 2. W B ^ âtlM .E (L )x l.e(W )xl.l(H )

SPG1316E-H

Contextual Info: SPG1316E-H Semiconductor High Brightness Chip LED Features • • • • • 1.6mm L x0.8mm(W) small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip LED Emitting light green (530nm)

SPG1316-H

Contextual Info: SPG1316-H Semiconductor Chip LED Lamp Features • • • • • 1.6mm L x0.8mm small size surface mount type Thin package of 0.4mm(H) thickness Transparent clear lens optic Low power consumption type chip LED Emitting light green (525nm) Applications •

Contextual Info: SPG1316E-H Semiconductor High Brightness Chip LED Features • • • • • 1.6mm L x0.8mm(W) small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip LED Emitting light green (530nm)

Contextual Info: SB1316-H Semiconductor Chip LED Features • • • • 1.6mm L x0.8mm small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip LED Applications • • • • LCD backlighting Keypad backlighting

Contextual Info: SB1316-H Chip LED Features • • • • 1.6mm L x0.8mm small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip LED Applications • • • • LCD backlighting Keypad backlighting

SPG1316E-H

Contextual Info: SPG1316E-H Semiconductor High Brightness Chip LED Features • • • • • 1.6mm L x0.8mm(W) small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip LED Emitting light green (530nm)

Contextual Info: SB1316-H Semiconductor Chip LED Features • • • • 1.6mm L x0.8mm small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip LED Applications • • • • LCD backlighting Keypad backlighting

Minolta

Abstract: NSM64-128Y CS1000
Contextual Info: NSM64-128Y FEATURES : 2.0 L X1.25(W)X0.8(H)MM CHIP SIZE (SURFACE MOUNT CHIP LED) DOT PITCH : 4㎜ NO. OF DOTS : 512(16x32) SIZE : 128(W) X 64(H) X 18.5(T)㎜ EMITTING AREA : 128(W)X64(H)㎜ COLOR : YELLOW WEIGHT : 118G DRIVE METHOD : 1/16 DUTY, DYNAMIC SHIFT REGISTER

Contextual Info: SA1316-H Semiconductor High Brightness Chip LED Features • • • • 1.6mm L x0.8mm(W) small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip LED Applications • • • • LCD backlighting

32c33

Abstract: SW1314E-H
Contextual Info: SW1314E-H Semiconductor White Chip LED Features • • • • 1.6mm L x0.8mm small size surface mount type Thin package of 0.4mm(H) thickness Transparent clear lens optic Low power consumption type chip LED • E ; ESD Protected (±2.0kv, 3 times @100pF, 1.5kΩ)

Contextual Info: SW1314E-H Semiconductor White Chip LED Features • • • • 1.6mm L x0.8mm small size surface mount type Thin package of 0.4mm(H) thickness Transparent clear lens optic Low power consumption type chip LED • E ; ESD Protected (±2.0kv, 3 times @100pF, 1.5kΩ)

Contextual Info: SA1316-H High Brightness Chip LED Features • • • • 1.6mm L x0.8mm(W) small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip LED Applications • • • • LCD backlighting Keypad backlighting

SA1316-H

Contextual Info: SA1316-H Semiconductor High Brightness Chip LED Features • • • • 1.6mm L x0.8mm(W) small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip LED Applications • • • • LCD backlighting

Contextual Info: SA1316-H Semiconductor High Brightness Chip LED Features • • • • 1.6mm L x0.8mm(W) small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip LED Applications • • • • LCD backlighting

Contextual Info: SA1316-H Semiconductor Chip LED Lamp Features • • • • 1.6mm L x0.8mm small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip LED Applications • • • • LCD backlighting Keypad backlighting

Contextual Info: LEDTRONICS 3ME D li ë 5423705 00DÜ435 ô BILET BACKLIGHT LCDs, 08 TP/4 B iP olar 6-Chip LEDs LEDTRONICS,Inc 160° H tr a Wide A n gle, 7 -C o lo rs, H i-Flux I n t e n s it y 6-Chip, 3-Parallel, 5.5Vf L E D T R 0 H IC 5 P H B T HO. LIGHTED SWITCHES, ANNUN.

Contextual Info: Part Number: www.SunLED.com XZMY65W 2.1x0.7 mm RIGHT ANGLE SMD CHIP LED LAMP Features H 2.1mmx0.7mm RIGHT ANGLE SMT LED, 1.3mm THICKNESS. H LOW POWER CONSUMPTION. H WIDE VIEWING ANGLE. H IDEAL FOR BACKLIGHT AND INDICATOR. H VARIOUS COLORS AND LENS TYPES AVAILABLE.