HASL BOARD Search Results

18052

Contextual Info: 5-Pin PLCC Motorola MC68HC11E9-to-56-Pin SDIP Adapter FEATURES • Allows placing an PLCC package on a board laid out for a shrink DIP. GENERAL SPECIFICATIONS • BOARD MATERIAL: 0.062 [1.58] thick FR-4 with 1-oz. Cu traces, both sides • PADS: HASL • PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M

SF-QFE64SE-L-01

Contextual Info: 16.5mm [0.650"] 16.5mm 0.650" 0.8mm typ.[0.031"] 1.3mm typ. 0.050" 0.5mm dia. typ. 0.018" 2 6.4mm 0.250" 1 0.8mm pitch A 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. RoHS HASL plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ"

AMS-QQ-N-290

Contextual Info: 5-Pin PLCC Motorola MC68HC11E9-to-56-Pin SDIP Adapter FEATURES • Allows placing an PLCC package on a board laid out for a shrink DIP. GENERAL SPECIFICATIONS • BOARD MATERIAL: 0.062 [1.58] thick FR-4 with 1-oz. Cu traces, both sides • PADS: HASL • PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M

smd jsp

Abstract: SN100C "IPC-9701" IPC-9701 HASL IPC-A-610C J-STD-002B SN63
Contextual Info: Reflow Soldering of SMD Products To Printed Wiring Boards PWBs Using Lead-Free Solder Jon S. Prokop Vice President, Operations (972) 789-3818 jprokop@rfm.com 1 JSP 111604 Assembly of SMD Products To PWBs Using Pb-Free Solder • Considerations – – –

Contextual Info: VT-RBT SOLDER PASTE INSPECTION SYSTEM Omron’s VT-Rabbit stops defective boards before they multiply Integrate the VT-Rabbit into your PCB production process for an accurate, high-speed solder paste inspection solution. This small 35 inch footprint device operates at production

Contextual Info: TURNKEY PRINTED CIRCUIT BOARD AND FLEX ASSEMBLIES C O M P L E T E V E R T I C A L I N T E G R AT I O N — F R O M C O N N E C T O R S T O B O A R D S T O A S S E M B LY DECEMBER 2014 TURNKEY PCB/Flex Circuit Assemblies Full-service—from concept and design through fabrication,

LP2996

Abstract: AN-1268 EEU-FC0J331S EEU-FC0J680 LP2996LQ LP2996MR HASL 1268 ELECTROLYTIC CAPACITOR 330uF 63V
Contextual Info: National Semiconductor Application Note 1268 Chance Dunlap December 2002 The LP2996 evaluation board is designed to provide the design engineer with a fully functional prototype system in which to evaluate the LP2996 in both a static environment and with a complete memory system. There are two versions

ceramic rework

Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
Contextual Info: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability

motherboard with multimeter

Abstract: LP2995M AN1241 AN-1241 EEU-FC0J331S EEU-FC0J680 LP2995 LP2995LQ so8 ceramic
Contextual Info: National Semiconductor Application Note 1241 Chance Dunlap August 2002 Introduction used. This application note contains information regarding the evaluation board. For more information regarding the LP2995 please refer to the datasheet. The LP2995 evaluation board is designed to provide the

AND8464

Abstract: PNC0106A Soldering guidelines pin in paste reflow profile
Contextual Info: AND8464/D Board Level Application Note for 0402, 0502 and 0603 DSN2 Packages Prepared by: Denise Thienpont, Steve St. Germain ON Semiconductor http://onsemi.com APPLICATION NOTE Introduction Recommendations for each of these items are included in this application note. Figure 2 illustrates the color scheme

Intel reflow soldering profile BGA

Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
Contextual Info: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.

SF-SO28A-J-02F

Contextual Info: 19.05mm [0.750"] RoHS COMPLIANT 5.08mm [0.200"] 11.20mm [0.441"] 0.46mm dia. typ. [0.018"] 2 Top View 9.49mm [0.374"] 3 1 5.25mm [0.207"] 9.93mm [0.391"] 0.43mm typ. [0.017"] 1.27mm typ. [0.050"] Side View Compatible target board land pattern not to scale

LP2996

Contextual Info: User's Guide SNOA429A – May 2004 – Revised May 2013 AN-1268 LP2996 Evaluation Board 1 Introduction The LP2996 evaluation board is designed to provide the design engineer with a fully functional prototype system in which to evaluate the LP2996 in both a static environment and with a complete memory system.

Contextual Info: 20-301590-10 REPLACES NATIONAL SEMICONDUCTOR DP7310J .3 DIP WITH TI SN74ACT564DWJ LEAD PACKAGE FEATURES: • Allows placing an SOIC narrow body on a board laid out for an SOWIC (wide body). • Solder masked top side pads allow user to hand solder devices directly to top side of adapter with fewer problems of solder bridging.

FR4-HTG170

Contextual Info: PRINT CIRCUIT BOARD MECHANICALS CHARACTERISTICS Dimension mm : MATERIAL : X 183 100 Surface (dm²) : FR4-HTG170 1,83 BOARD THICKNESS (mm) : MULTILAYERS DOUBLE SIDE ELECTRICAL TEST 1 SIDE 34 CI 1019 A.PDF µVIA : NO DRILLING PROGRAM NAME : 34 CI 1019 A.EXC

sdip-29

Abstract: amp plcc socket dsip
Contextual Info: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides.

18043

Abstract: IPC600E
Contextual Info: P/N 1110748 Surface Mount-to-DIP JEDEC SOT-25, SOT-23A-6 Adapter FEATURES • Allows for breadboarding or substitution of Microgate SOT-23A-6 and SOT-25 IC and transistor packages into 0.100 [2.54] pitch proto boards or PC boards. • Solder masked top-side pads allow user to hand solder devices directly to topside of

IPC-600E

Abstract: TRANSISTOR SUBSTITUTION
Contextual Info: P/N 1110748 Surface Mount-to-DIP JEDEC SOT-25, SOT-23A-6 Adapter FEATURES • Allows for breadboarding or substitution of Microgate SOT-23A-6 and SOT-25 IC and transistor packages into 0.100 [2.54] pitch proto boards or PC boards. • Solder masked top-side pads allow user to hand solder devices directly to topside of

MC68HC11E9

Contextual Info: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides.

microgate

Contextual Info: Part No. 1110748 - Surface Mount to DIP Adapter for SOT-25, SOT-23A-6 FEATURES: • Allows for breadboarding or substitution of microgate SOT-23A-6 and SOT-25 IC and transistor packages into .100 [2.54] pitch proto boards or PC boards. • Solder masked top-side pads allow user to hand solder

DP7310J

Contextual Info: 20-301590-10 REPLACES NATIONAL SEMICONDUCTOR DP7310J .3 DIP WITH TI SN74ACT564DWJ LEAD PACKAGE FEATURES: • Allows placing an SOIC narrow body on a board laid out for an SOWIC (wide body). • Solder masked top side pads allow user to hand solder devices directly to top side of adapter with fewer problems of solder bridging.

IPC-600E

Abstract: nj TRANSISTOR 610B ASTM-B16-85 TRANSISTOR SUBSTITUTION HASL surface mount to dip adapter
Contextual Info: Part No. 1110748 - Surface Mount to DIP Adapter for SOT-25, SOT-23A-6 FEATURES: • Allows for breadboarding or substitution of microgate SOT-23A-6 and SOT-25 IC and transistor packages into .100 [2.54] pitch proto boards or PC boards. • Solder masked top-side pads allow user to hand solder

Contextual Info: Part No. 1110748 - Surface Mount to DIP Adapter for SOT-25, SOT-23A-6 FEATURES: • Allows for breadboarding or substitution of microgate SOT-23A-6 and SOT-25 IC and transistor packages into .100 [2.54] pitch proto boards or PC boards. • Solder masked top-side pads allow user to hand solder

Contextual Info: Part No. 1110748 - Surface Mount to DIP Adapter for SOT-25, SOT-23A-6 FEATURES: • Allows for breadboarding or substitution of microgate SOT23A-6 and SOT-25 IC and transistor packages into .100 [2.54] pitch proto boards or PC boards. • Solder masked top-side pads allow user to hand solder