HEAT SINK OF SCR Search Results

Contextual Info: Heat Sink SQ50x34 TECHNICAL DATA Heat Sink for DPSS Laser Modules SQ50x34 is a heat sink designed for DPSS laser modules of 12mm diameter. Made of black anodized aluminium it features very good thermal conductivity. The heat sink’s ground plate comes with five M4

pcb board of miniskiip 2

Abstract: miniskiip board MiniSKiiP 1 Package MiniSKiiP MiniSKiiP Package SEMIKRON BOARD Wacker silicone paste p 12 wacker rubber Wacker Silicones
Contextual Info: MiniSKiiP Assembly Instructions 1. Preparation, surface specification 1.2 Heat sink ≤ 20 µm Heat sink > 10 µm ≤ 6,3 µm Fig. 1: Heat sink surface specification ♦ Heat sink must be free from grease and particles ♦ unevenness of heat sink mounting area must be ≤ 20 µm

COHS-50

Abstract: heat sink DOWNLIGHT
Contextual Info: Data sheet Heat Sink for COINlight-OSTAR COHS Highlights ¾ Accessory part for for optimised heat dissipation of COINlight-OSTAR® ¾ Improved life time of the module ¾ Easy mounting by screwing the heat sink on the module ¾ Small diameter adapted to the compact

heat sink

Abstract: din 84
Contextual Info: Data sheet Heat Sink for COINlight-OSTAR COHS Highlights ¾ Accessory part for for optimised heat dissipation of COINlight-OSTAR® ¾ Improved life time of the module ¾ Easy mounting by screwing the heat sink on the module ¾ Small diameter adapted to the compact

wacker silicone paste

Abstract: silicone paste p 12 IEC 326-3 Wacker Silicones P-12 Wacker Silicones pcb board of miniskiip 2 Wacker miniskiip board SEMIKRON BOARD wacker rubber
Contextual Info: MiniSKiiP - Technical Explanations Assembly Instructions 1 Preparation, surface specification To obtain the maximum thermal conductivity of the module, heat sink and module must fulfil the following specifications. 1.1 Heat sink ≤ 20 µm Heat sink > 10 µm

Contextual Info: INSTALLATION INSTRUCTIONS KDI TYPE PPT/PPR HIGH POWER TERMINATIONS AND RESISTORS 2. MOUNTING 1. HEAT SINK REQUIREMENTS: These Devices must be mounted on a Heat Sink of sufficient thermal dissipation to control the mounting flange of the part to a maximum temperature of

G3PA-210B-VD

Abstract: G3PA-210BL-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260BL-VD G3PA-260B-VD G3PA-420B-VD g3pa220bv
Contextual Info: Power Solid-state Relay G3PA- VD Extremely Thin Relays Integrated with Heat Sink Downsizing achieved through optimum design of heat sink. Mounting possible via screws or via DIN rail. Dense mounting possible for linking terminals. (Except for G3PA-260B-VD.)

G32A-A20-VD

Abstract: G32A-A10-VD G3PA-240B-VD G32A-A40-VD G32A-A60-VD G3PA-210BL-VD G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD
Contextual Info: Power Solid-state Relay G3PA- VD Extremely Thin Relays Integrated with Heat Sink Downsizing achieved through optimum design of heat sink. Mounting possible via screws or via DIN rail. Dense mounting possible for linking terminals. (Except for G3PA-260B-VD.)

G32A-A20-VD

Abstract: G32A-A420 G3PA-220B-VD G32A-A10-VD G32A-A430 G3PA-210B-VD DC5-24 G3PA-240B-VD G3PA-260BL-VD G3PA-260B-VD G3PA-420B-VD
Contextual Info: Power Solid-state Relay G3PA- VD Extremely Thin Relays Integrated with Heat Sink Downsizing achieved through optimum design of heat sink. Mounting possible via screws or via DIN rail. Close mounting possible for linking terminals. (Except for G3PA-260B-VD.)

J137

Abstract: nissei capacitor nissei capacitors capacitor list nissei datasheet G32A-A20-VD G32A-A430 capacitor list nissei G3PA-220B-VD i2t graph phototriac
Contextual Info: Power Solid-state Relay G3PA- VD Extremely Thin Relays Integrated with Heat Sink • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. (Except for

miniskiip board

Abstract: MiniSKiiP
Contextual Info: Assembly of MiniSKiiP Heat sink Thermal paste MiniSKiiP power module Your printed circuit board Pressure part Screw 13.06.2006 11

G3PB-225B-2H-VD

Abstract: G3PB525B2NVD
Contextual Info: Solid State Contactors New Heat Sink Construction G3PB-2N/-3N Refer to Safety Precautions for All Solid State Relays. Space and working time saved with new heat sink construction. Series now includes 480-VAC models to allow use in a greater range of applications.

iec 62314

Contextual Info: Solid State Relays with Built-in Heat Sink - RSC Features • Slim design allows for compact DIN rail or panel mounting • Built-in heat sink maximizes current output capability • Epoxy-free design & improved thermal impedance • Choice of 20A, 30A and 45A models

Contextual Info: TÜV Rheinland Breakdown voltage 2,500V Slim profile SSR with heat sink mountable on DIN rail AQ-K (Breakdown voltage 4,000V) AQ-K RELAYS FEATURES APPLICATIONS 1. Combined with heat sink for vertical profile Helps to save space on control panel 2. Dielectric voltage of 2,500V or

torque of 4-40 screw for pcb

Abstract: torque of screw for pcb 44x44 BGA PACKAGE TOP MARK transistor c 6073 SG-BGA-6073
Contextual Info: 82.5mm Top View without heat sink lid Top View of Heat Sink Lid 45.225mmSqr. Ø 3.12mm(x4) Lid mounting hole for 4-40 screw Ø 1.5mm(x3) Dowel pin A 82.5mm A A1 Orientation mark Ø 6.5mm(x4) Counter sunk 82 deg to accept 4-40 Flat head screw 1 2 Elastomer: 40 micron dia gold plated brass

panasonic varistor

Abstract: AQK1211 AQK1231 AQK2211 AQK2231
Contextual Info: TÜV Rheinland Breakdown voltage 2,500V Slim profile with heat sink mountable on DIN rail AQ-K (Breakdown voltage 4,000V) AQ-K RELAYS FEATURES APPLICATIONS 1. Combined with heat sink for vertical profile Helps to save space on control panel 2. Dielectric voltage of 2,500V or

torque of screw for pcb

Abstract: bga socket dowel pin SG-BGA-6074
Contextual Info: Top View without heatsink GHz BGA Socket - Direct mount, solderless Bottom View Holes tapped in backing plate for mounting socket base (x4). 63.245mm 1.91mm 63.245mm Side View 1 Side View (exploded) 42.5mm 2mm 7 1 Heat Sink Lid: Anodized 6061 Aluminum. Single piece construction. Bottom of heat sink has

G3PB-245B-2N/2H-VD

Contextual Info: Solid State Contactors New Heat Sink Construction G3PB-2N/-3N CSM_G3PB-2N_-3N_DS_E_2_1 Space and working time saved with new heat sink construction. Series now includes 480-VAC models to allow use in a greater range of applications. • A comprehensive lineup that now includes 480-VAC models.

1161A1

Contextual Info: TAP600 Series 600 Watt Heat Sinkable Planar Ohmite’s TAP600 delivers 600 watts of reliable power to a variety of power conditioning, power transmission, and power control applications. These resistors can be designed for liquid or air cooled heat sink systems.

Contextual Info: TAP600 Series 600 Watt Heat Sinkable Planar Ohmite’s TAP600 delivers 600 watts of reliable power to a variety of power conditioning, power transmission, and power control applications. These resistors can be designed for liquid or air cooled heat sink systems.

179D

Abstract: SN62
Contextual Info: Application Note for the Mounting of High Power Flange Devices When mounting High Power Flange Devices in a circuit, there are several key issues that should be taken into account. Heat Sink Design: The heat sink the device is mounted to must be designed to maintain the temperature design while it is

G3PA-210BL-VD

Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-450B-VD-2 J-21
Contextual Info: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.

G3PA-210BL-VD

Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-450B-VD-2 J-21
Contextual Info: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.

AC line snubber 3 phase 1000 amp

Abstract: crydom 5942 HS202 H12D2425D d2425d HS301DR-HD6025 hd4850 crydom 240 9622
Contextual Info: 1179-2012.qxp:QuarkCatalogTempNew 9/10/12 5:02 PM Page 1179 13 Heat Sinks and Solid State Relays RoHS HS301DR-D2425 HS201DR-D2450 HS053-D53TP50D Assemblies offer the advantage of eliminating the calculations and heat sink selection during the design phase of a project,