HEAT SLUG Search Results

TB499

Contextual Info: Technical Brief 499 PCB Thermal Land Design for Ceramic Packages with Bottom Metal or Heat Sinks Introduction Certain Intersil ceramic packages include bottom metal or bottom heat sinks also called heat slugs . When present, these features will be noted on Intersil’s product datasheet

Contextual Info: Package Outlines 8-LEAD SMALL OUTLINE PACKAGE WITH HEAT SLUG SG 0.1935 +/- 0.0035 (4.915 +/- 0.085) 0.1 +/- 0.01 (2.54 +/- 0.25) Heat Slug 0.1535 +/- 0.0035 0.236 +/- .008 (3.9) (+/- 0.09) (5.995) (+/- 0.205) 0.0165 +/- 0.0035 (0.42 +/- 0.09) 0.14 +/- 0.01

mps 442

Abstract: mps 0737 SOIC20W SOIC-20W MF-PO-D-0004 0040
Contextual Info: PACKAGE OUTLINE DRAWING SOIC20W Wide Body / Heat Slug MF-PO-D-0004 revision 0.1 TM Monolithic Power Systems TM 0.280 (7.11) 0.300 (7.62) 0.010(0.254) x 45o 0.029(0.737) HEAT SLUG EXPOSED AREA GATE PLANE 0.195 0.215 (4.95) (5.46) 0.016 0.050 (0.406) (1.270)

749 013 020

Abstract: mps 299
Contextual Info: TM Monolithic Power Systems TM PACKAGE OUTLINE DRAWING SOIC24WR Wide Body / Heat Slug / Reverse Lead Bend MF-PO-D-0027 revision 0.0 HEAT SLUG EXPOSED AREA on Top surface of package .614(15.59) .600 (15.24) .490 (12.45) .470 (11.94) .299 (7.59) .295 (7.49)

mps 442

Abstract: mps 643 7595
Contextual Info: TM Monolithic Power Systems TM PACKAGE OUTLINE DRAWING SOIC20WR Wide Body / Heat Slug / Reverse Lead Bend MF-PO-D-0021 revision 0.0 0.280 (7.11) 0.300 (7.62) 0.010(0.254) x 45o 0.029(0.737) HEAT SLUG EXPOSED AREA on Top surface of package GATE PLANE 0.195

afb0712hhb

Abstract: AFB0712HHB fan DELTA fan 3P-2510 AMD Processor Power and Thermal amd3000 K8 specific
Contextual Info: AMD AthlonTM 64 K8 Processor Fan Heat Sink ACTIVE HEAT SINK FOR AMD ATHLONTM 64 3000 AND 3200 2.0 GHz PROCESSOR Aavid’s thermal solution for AMD 3000 and 3200 2.0 GHz AthlonTM 64 (K8) processor. The heat sink is designed for engineers seeking a cost effective solution for mainstream

heat slug

Abstract: heat sink
Contextual Info: HEATSINK ISSUES FOR MICROPROCESSOR PRODUCTS WITH INTEGRAL SLUG TECHNICAL NOTE TN-25 Integrated Device Technology, Inc. SUMMARY: Designing in highly integrated, high clock rate microprocessors such as the R4600 requires careful consideration of thermal management. To ease this burden IDT utilizes an integral heat slug technology in its pin grid array packages. This heat slug

JESD51-2

Abstract: exposed QFP 144 100L JESD51-7 Techpoint
Contextual Info: MQFP-ed Exposed Drop-in Heat Slug Metric Quad Flat Pack • 14 x 20mm to 32 x 32mm • 100 to 240 lead count • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 14 x 20mm to 32 x 32mm STATS ChipPAC’s Exposed Drop-In Heat Slug Metric Quad

RUJ 17 33

Abstract: 3145
Contextual Info: AMI A M I S E M IC O N D U C T O R %s PQ2 Packaging Capabilities . . Description Surface Mount The Power Quad II is a molded plastic quad flatpack with improved thermal performance. The Power Quad II isconstruced using a copper lead frame which is directly attached to a copper heat slug. The heat slup increases the thermal

AMI 602

Abstract: amis 339 IC 406 1AMI
Contextual Info: % s AMI AMI WE M l C O N D U C T O R Packaging Capabilities PS0P2 . . Description Surface Mount The PowerSOP 2 package has an exposed, copper heat slug which significantly increases the thermal efficiency of power-constrained SOICs. The PSOP2 improves the Theta JA greater than 50% over a standard SOIC. The increased ability to dissipate heat is via a large integrated

BAI-003

Contextual Info: RF Coaxial Connectors AI-90, AI-237, AI-773 & BBAI-1212 HEAT SHRINKABLE TUBING Assembly Instructions SMA & MCX Right Angle Connectors, Crimp Type for Braided Cable CRIMP FERRULE CAP BODY ASSEMBLY 1. Slide ferrule and if supplied heat shrinkable tubing on to cable.

Contextual Info: Technical Note AN-00-017 Heat Sinking High-Power Surface Mount Components Heat Sinking of Surface Mount Components or High-Power Operation in Case Style AH1647 Purpose: Method for Heat Sinking: The purpose of this application note is to describe a

luxeon 1w RED

Abstract: Luxeon luxeon 1w Luxeon 2002 IEC825 IEC825-Class ROYAL high voltage resistor
Contextual Info: Electrical Drive Information Luxeon Emitter, Star, Star/C & Star/O TM Driving a single Luxeon TM Fig.1 Luxeon Star light source LEDs should be driven at a constant current. The power dissipation causes the LED to heat up. Excessive heat destroys the LED. Please

honeywell pcm45

Abstract: CEK 550 PCM45F G751 thermal test vehicle -intel
Contextual Info: Heat Sink for Intel Xeon Potomac MP and Nocona DP Processors in 4U Servers PASSIVE HEAT SINK FOR INTEL® XEON™ POTOMAC MP AND NOCONA DP PROCESSORS Aavid’s solution for Xeon™ Potomac MP and Nocona DP processors is designed specifically for thermal engineers

Contextual Info: CRECTROM SEMICONDUCTOR TECHNICAL SPECIFICATION AUTOMOTIVE RECTIFIER VOLTAGE RANGE-50 to 1000 Volts CURRENT-25 Amperes FEATURES * Low cost * Low leakage * Low forward voltage drop * High current capability MECHANICAL DATA * Copper heat sink * Tin-plated slug easy for soldering

S70GB7C

Abstract: ae1004
Contextual Info: HEAT SLUG Part No. S70GB7C Features Highest Flux BLUE High reliability and Very long operating life up to 100K hours Low voltage DC operated More Energy Efficient than Incandescent and most Halogen lamps Superior ESD protection Typical Applications Decorative

K 2645 transistor

Abstract: k 2645 GRM36COG470J50 bk2125 K 2645 schematic circuit FR411 1431 T AWT921 AWT921S11 SSOP-28
Contextual Info: AWT921 Integrated High Power Amp 900 MHz PRELIMINARY DATA SHEET - Rev 1.1 FEATURES • • • • • • High output power levels High Efficiency True Surface Mount Package with Integrated Heat Slug Internal Bias Circuit Requiring Nominal Input Voltages +10%

2502 marking

Abstract: AR2500 AR2510
Contextual Info: AR2500 THRU AR2510 AUTOMOTIVE RECTIFIER Reverse Voltage - 50 to 1000 Volts Forward Current - 25.0 Amperes Features Low cost Low leakage Low forward voltage drop High current capability Mechanical Data DIM ENSIONS Copper heat sink Tin-plated slug easy for soldering

S70NW6C

Contextual Info: HEAT SLUG Part No. S70NW6C Features Highest Flux White High reliability and Very long operating life up to 100K hours Low voltage DC operated More Energy Efficient than Incandescent and most Halogen lamps NO UV Superior ESD protection Typical Applications

led flashlight

Abstract: S30NW6C
Contextual Info: HEAT SLUG Part No. S30NW6C Features Highest Flux White High reliability and Very long operating life up to 100K hours Low voltage DC operated More Energy Efficient than Incandescent and most Halogen lamps NO UV Superior ESD protection Typical Applications

led flashlight

Abstract: S70GR2C
Contextual Info: HEAT SLUG Part No. S70GR2C Features Highest Flux RED High reliability and Very long operating life up to 100K hours Low voltage DC operated More Energy Efficient than Incandescent and most Halogen lamps NO UV Superior ESD protection Typical Applications

S30EB7C

Contextual Info: HEAT SLUG Part No. S30EB7C Features Highest Flux Blue High reliability and Very long operating life up to 100K hours Low voltage DC operated More Energy Efficient than Incandescent and most Halogen lamps NO UV Superior ESD protection Typical Applications

RA351

Abstract: RA352 RA353 RA354 RA355 RA356 RA357
Contextual Info: RA351 THRU RA357 AUTOMOTIVE RECTIFIER Reverse Voltage - 50 to 1000 Volts Forward Current - 35.0 Amperes Features Low cost Low leakage Low forward voltage drop High current capability Mechanical Data DIM ENSIONS Copper heat sink Tin-plated slug easy for soldering

Contextual Info: C RECTRON SEMICONDUCTOR TECHNICAL SPECIFICATION AUTOMOTIVE RECTIFIER VOLTAGE RANGE-50 to 1000 Volts CURRENT-25 Amperes FEATURES * Low cost * Low leakage * Low forw ard voltage drop * High current capability RA MECHANICAL DATA * Copper heat sink * Tin-plated slug easy for soldering