HEAT SYNC Search Results

mosfet transistor 100w amplifier

Abstract: LTC3813 LTC3814-5 LTC3562 Si7850 24v 12v to 5v 20A regulator 24v 12v 20A regulator B1100 BAS19 LTC38145
Contextual Info: DESIGN FEATURES L Synchronous Boost Converters Provide High Voltage without the Heat by Greg Dittmer Introduction The LTC3813 and LTC3814-5 reduce the size of high voltage, high power boost converters by incorporating heat-saving features that eliminate

pt8a3300

Abstract: AC220V Timer Switch circuit diagram of 20 watt led driver for 220v ac 110V AC to 5V DC ic PT0284 PT8A3301
Contextual Info: PT8A330xA/B Ceramic Heat Controller | | |

Contextual Info: PT8A330xA/B Ceramic Heat Controller | | |

LTC4440-5

Abstract: 10V15V DFLS160 equivalent BG1 LED multiphase boost synchronous LT3756 lt3782a BG1 pwm design ideas PD3S160
Contextual Info: DESIGN IDEAS L High Power 2-Phase Synchronous Boost Replaces Hot Diodes with Cool FETs—No Heat Sinks Required by Narayan Raja, Tuan Nguyen and Theo Phillips Introduction For low power designs, non-synchronous boost converters offer a simple solution. However, as power levels increase, the heat dissipated in the boost

PT8A3304

Abstract: pt8a3300
Contextual Info: Data Sheet PT8A330x Ceramic Heat Controller |

circuit diagram of 20 watt led driver for 220v ac

Abstract: aa vb 399 information of D2 1N4007 1 watt led with heat led driver circuit diagram ptc resistor 45 pt8a3300
Contextual Info: Data Sheet PT8A330xA/B Ceramic Heat Controller |

1N4007 BL

Abstract: pt8a3353 VT130H VT220H U2231 PTC 2K sensor PT8A3353A 1N4007+BL VT210
Contextual Info: Data Sheet PT8A335xA/B Ceramic Heat Controller LCD |

hdsc-14

Abstract: HSR103 DRC-10500 API-30602 DRC-10520 SIM-36010 hdsc14
Contextual Info: DIGITAL-TO-SYNCHRO/RESOLVER D/S, D/R CONVERTERS RESOLUTION ACCURACY OUTPUT DRIVE DRC-10520 16 Bit t o ± 1’ 2 VA DRC-11522 16 Bit ± r 2mA-rms DSC-544 14 Bit ±4‘ 4.5 VA 2.6 x 3.1 x 0.8" Module Powered from reference. Has built-in metal heat sink for greater heat

DSP56301

Abstract: DSP56301PW66
Contextual Info: Design Considerations Heat Dissipation Considerations Power, Ground, and Noise Design Considerations Heat Dissipation Considerations The average chip-junction temperature, TJ, in °C can be obtained from: TJ = TA + PD x ΘJA (1) Where: TA = Ambient Temperature, °C

noise cancelling mic circuit

Abstract: DSP56156 DSP56156FE40 DSP56156FE60 DSP56156FV40 DSP56156FV60 T101 T103 SPKP
Contextual Info: Design Considerations Heat Dissipation Power, Ground, and Noise Design Considerations Heat Dissipation The average chip junction temperature, TJ, in °C, can be obtained from: TJ = TA + PD x ΘJA (1) Where: TA = ambient temperature, °C ΘJA = package thermal resistance,

00FF

Abstract: DSP56005 LS09 MBD301 MC68000
Contextual Info: Design Considerations Heat Dissipation Design Considerations outside ambient ΘCA . These terms are related by the equation: Heat Dissipation The average chip junction temperature, TJ, in °C, can be obtained from: TJ = TA + (PD x ΘJA) (1) Where: TA = ambient temperature, °C

DSP56002FC40

Abstract: A0655 00FF DSP56002 LS09 MC68000 DSP56002RC40 01CC00 M52DC BR a94
Contextual Info: Design Considerations Heat Dissipation Design Considerations outside ambient ΘCA . These terms are related by the equation: Heat Dissipation The average chip junction temperature, TJ, in °C, can be obtained from: TJ = TA + (PD x ΘJA) (1) Where: TA = ambient temperature, °C

BD5431

Contextual Info: 1/4 STRUCTURE: PRODUCT: Silicon monolithic integrated circuits Stereo Class-D Power Amplifier For Speaker TYPE: PACKAGE: FEATURES: HTSSOP-A44 BD5431EFS 1 2) 3) 4) 5) 6) Differential Analog / PWM inputs High efficiency and low heat generation eliminates external heat-sinks

r033f

Abstract: MBRS0530 TPSE337M006R100 55380 DN135 LR2010-01-R033 UPL1C152MHH LTC1435 LTC1436 MBRD835L
Contextual Info: advertisement Efficient Processor Power System Needs No Heat Sink Design Note 135 John Seago New designs require more functionality in an ever decreasing package size. Compact, efficient high frequency power supplies are required and there is seldom room for a heat

Contextual Info: N, BNC-TM Series Features ● Wideband/high impedance matching with Hirose Electric unique high frequency matching technique. ● The usable power has been increased to 30W through the use of a heat sink. 5W without heat sink ● Connector types are N and BNC.

Contextual Info: GBPC 12, 15, 25, 35 SERIES Bridge Rectifiers Glass Passivated Features • Integrally molded heat-sink provided very low thermal resistance for maximum heat dissipation. • Surge Overload Ratings from 300 A to 400 A. • Isolated voltage from case to lead over 2500 V.

Contextual Info: GBPC 12, 15, 25, 35 SERIES Bridge Rectifiers Glass Passivated Features • Integrally molded heat-sink provided very low thermal resistance for maximum heat dissipation. • Surge Overload Ratings from 300 A to 400 A. • Isolated voltage from case to lead over 2500 V.

Contextual Info: FEATURES Š High efficiency: 92.0% @3.3V/30A Š Size: 58.4mm x 22.8mm x9.5mm 2.30”x0.90”x0.37” (W/O heat-spreader) 58.4mm x 22.8mm x12.7mm (2.30”x0.90”x0.50”)(With heat-spreader) Š Industry standard pin out Š Fixed frequency operation Š SMD and through-hole versions

Contextual Info: 1/9 STRUCTURE: PRODUCT: Silicon monolithic integrated circuits Stereo Class-D Power Amplifier For Speaker TYPE: BD5427MUV PACKAGE: FEATURES: VQFN048V7070 1 2) High efficiency and low heat generation eliminates external heat-sinks Eliminates pop noise generated when the power supply goes on/off, or when the power supply is

LTC3026

Abstract: design ideas linear voltage regulators 3 to 4 amp 2A 12v Low Dropout Regulator
Contextual Info: DESIGN IDEAS LDO Linear Regulators Rival Switchers for Efficiency Introduction Thermal Limitations While efficiency is always quoted as a benchmark for switching regulators, power loss is often more important. Power loss sets the size of the heat sink, and the size of the heat sink is—more

Contextual Info: 1/7 STRUCTURE: PRODUCT: Silicon monolithic integrated circuits Stereo Class-D Power Amplifier For Speaker TYPE: BD5427EFS PACKAGE: FEATURES: HTSSOP-A44 1 2) High efficiency and low heat generation eliminates external heat-sinks Eliminates pop noise generated when the power supply goes on/off, or when the power supply is

BD5421EFS

Abstract: HTSSOP-A44 BD5421EFS-1 BD5421EFS-1-2 TSZ22111-04 TSZ22111-05
Contextual Info: TYPE PRODUCTS PAGE BD5421EFS SEMICONDUCTOR IC STRUCTURE: Silicon monolithic integrated circuits P R O D U C T: Stereo C lass-D Power Amplifier For Speaker T YPE : BD5421EFS PACKAGE: H T S S O P -A 4 4 1 /4 FEATURES: 1 High efficiency and low heat generation eliminates external heat-sinks

Contextual Info: 1/4 STRUCTURE: PRODUCT: Silicon monolithic integrated circuits Stereo Class-D Power Amplifier For Speaker TYPE: PACKAGE: FEATURES: HTSSOP-A44 BD5424EFS 1 2) 3) 4) 5) 6) 7) High efficiency and low heat generation eliminates external heat-sinks Eliminates pop noise generated when the power supply goes on/off, or when the power supply

AN-7524

Abstract: two switch forward converter
Contextual Info: How to Determine Thermal Resistance for a Power Semiconductor Heat Sink in an SMPS Application Note Title N98 bt ow terne erl sisce a wer minctor at k in MPS utho eyrds ter- August 2000 A practical method for determining the thermal resistance of a heat sink in a power supply is provided. The basic