HEAT TRANSFER Search Results

Contextual Info: CHEMTRONICS CW7250 Technical Data Sheet CircuitWorks Boron Nitride Heat Sink Grease PRODUCT DESCRIPTION CircuitWorks Boron Nitride Heat Sink Grease facilitates heat transfer away from electrical/electronic components and into heat sinks. The material

Contextual Info: CHEMTRONICS Technical Data Sheet CW7270 CircuitWorks Silicone Free Heat Sink Grease PRODUCT DESCRIPTION CircuitWorks Silicone Free Heat Sink Grease facilitates heat transfer away from electrical/electronic components and into heat sinks. This silicone-free compound

Contextual Info: Extruded Heat Sinks for DC/DC Converters 14 Heat sinks for “Full-Brick” DC/DC Converters Heat sinks for “Full-Brick” DC/DC Converters Standard mounting slots mate with Vicor DC/DC converters. Optimized aluminum extruded fin construction transfers heat efficiently

j 692

Abstract: calibration certificate heat sensors 27160 heat flow sensor 400J
Contextual Info: Heat Flux Sensor Type 27160 Heat Flow sensors allow precision measurements of heat transfer through any surface material. They are cemented onto a surface like strain gauges, and will give an accurate measurement of heat transfer using a DVM as an indicator.

MATERIAL SAFETY DENATURED ALCOHOL

Abstract: TC-2707
Contextual Info: Technical Data November 2011 3M Thermally Conductive Interface Pads 5591 and 5591S Product Description 3M™ Thermally Conductive Interface Pads 5591 and 5591S are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices.

Contextual Info: Technical Data July, 2010 3M Thermally Conductive Interface Pads 5592 and 5592S Product Description 3M™ Thermally Conductive Interface Pads 5592 and 5592S are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices.

Contextual Info: Technical Data July, 2010 3M Thermally Conductive Interface Pads 5595 and 5595S Product Description 3M™ Thermally Conductive Interface Pads 5595 and 5595S are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices.

Contextual Info: Technical Data December 2013 3M Thermally Conductive Silicone Interface Pads 5519 and 5519S Product Description 3M™ Thermally Conductive Silicone Interface Pads 5519 and 5519S are designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. These

Contextual Info: CHEMTRONICS TDS # CT40 Technical Data Sheet CircuitWorks Heat Sink Grease PRODUCT DESCRIPTION CircuitWorks Heat Sink Grease silicone compound facilitates heat transfer away from electrical/electronic components. This heavy consistency material is thickened

QTM-500

Abstract: 5519S 5519
Contextual Info: Technical Data February 2012 3M Thermally Conductive Silicone Interface Pads 5519 and 5519S Product Description 3M™ Thermally Conductive Silicone Interface Pads 5519 and 5519S are designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. These products consist

MIL-C-47113

Contextual Info: CHEMTRONICS TDS # CT40 Technical Data Sheet CircuitWorks Heat Sink Grease PRODUCT DESCRIPTION CircuitWorks Heat Sink Grease silicone compound facilitates heat transfer away from electrical/electronic components. This heavy consistency material is thickened with

High Heat Transfer

Abstract: MIL-R-18546C tepro TM 50
Contextual Info: TEPRO TYPE “TMG” ELECTRO TECHNIK ALUMINUM HOUSED, HIGH HEAT TRANSFER CORES FEATURES: Molded construction High purity cores for optimum heat dissipation Even heat distribution curve Extremely high stability at conventional power ratings DERATING CURVE VARIATIONS:

Contextual Info: Technical Data June 2011 3M Thermally Conductive Silicone Interface Pad 5515-20 and 5515-25 Product Description 3M™ Thermally Conductive Silicone Interface Pads 5515-20 and 5515-25 are designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. The 3M Pad

EHTCP01K

Abstract: RPH-R heat transfer
Contextual Info: 10405 - NON-SILICON HEAT TRANSFER COMPOUND REVISION DATE:MAY 2003 SAFETY DATA SHEET NON-SILICON HEAT TRANSFER COMPOUND 1. IDENTIFICATION OF THE SUBSTANCE/PREPARATION AND THE COMPANY: PRODUCT NAME: NON-SILICON HEAT TRANSFER COMPOUND PART No.: EHTCP01K SUPPLIER:

UL-224 vw-1

Abstract: H150X MIL-M-81531 H200X H200X034H1T H200X025H H200X064H H100X034H
Contextual Info: Military Grade Heat Shrink Labels SPECIFICATION SHEET specifications Military grade heat shrink labels shall be pre-cut, heat-shrinkable flattened polyolefin and shall readily accept thermal transfer print. The product shall meet the material requirements and physical properties of

Contextual Info: Silicone Heat Transfer Compound Page 1 of 1 Silicone Heat Transfer Compound 860 z High thermal conductivity High dielectric constant High dissipation factor Use with heat sinks or metal chassis Will not dry or harden z Contains zincs oxides and polydimenthyl siloxane

chasis L 03.1

Contextual Info: TEPRO •>A ' M EUX TYPE "TMG' BO TEC -frJIK ALUMINUM HOUSED HIGH HEAT TRANSFER CORE TYPE "TMG" ALU M INUM HOUSED - HIGH HEAT TRANSFER CORES FEATURES Molded construction Exceeds MIL - R - 18546 C, MIL - R - 39009 High purity cores for optimum heat dissipation

TES1-3202T125

Abstract: 431W
Contextual Info: TES1-3202T125 TECHNICAL DATA Micro-Thermoelectric Cooling Module QCmax=4.31 W Thermoelectric cooling uses the Peltier effect to create a heat flux between the junction of two different types of materials. A Peltier cooler is a solid-state active heat pump which transfers heat

TEC1-00705T125

Contextual Info: TEC1-00705T125 TECHNICAL DATA Thermoelectric Cooler, Qc=2.8 W Thermoelectric cooling uses the Peltier effect to create a heat flux between the junction of two different types of materials. A Peltier cooler is a solid-state active heat pump which transfers heat from one side of the

Contextual Info: Heat Transfer Compounds Page 1 of 2 Non-Silicone Heat Transfer Compound 8610 z Special synthetic base, fortified with metal oxides and compounded to a paste-like consistency for ease of application z High efficient thermal conductive properties { Means more rapid transfer of heat for longer component life

Contextual Info: TYPE "TMG" ELECTRO TECHNIK TYPE "TMG" A L U M IN U M HOUSED, H IG H HEAT TRANSFER CORES FEATURES: Molded construction Exceeds MIL - R - 18546 C, MIL - R - 39009 High purity cores for optimum heat dissipation Even heat distribution curve Exlremely high stability at conventional power ratings

Contextual Info: presented in Figures 4 and 5 [3]. Figure 4 shows the temperature difference between evaporator and condenser at different power levels when the heat pipes are vertical. Compared to small diameter heat pipes, large diameter heat pipes transport more heat with

Contextual Info: Technical Data September, 2010 3M Thermally Conductive Adhesive Transfer Tapes 9882 • 9885 • 9890 Product Description 3M™ Thermally Conductive Adhesive Transfer Tapes 9882, 9885, and 9890 are designed to provide a preferential heattransfer path between heat-generating components and heat sinks or other cooling devices e.g., fans, heat spreaders or

Contextual Info: pushPIN Heat Sink Assembly ATS Part#: ATS-H1-88-C3-R0 Description: pushPIN™ HS ASMBLY,FINE-PITCH,STRAIGHT, HOLE PATTERN:RIGHT-TABBED,BLUE,T412 Heat Sink Type: pushPIN™ Heat Sink Assembly Heat Sink Attachment: pushPIN™ / Spring Kit Features & Benefits