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    HY 2004 Search Results

    HY 2004 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CO-316RASMAX2-004 Amphenol Cables on Demand Amphenol CO-316RASMAX2-004 RG316 High Temperature Teflon Coaxial Cable - SMA Right Angle Male to SMA Right Angle Male 4ft Datasheet
    CO-058RABNCX2-004 Amphenol Cables on Demand Amphenol CO-058RABNCX2-004 BNC Right Angle Male to BNC Right Angle Male (RG58) 50 Ohm Coaxial Cable Assembly 4ft Datasheet
    M2004-01I640.0000T Renesas Electronics Corporation Frequency Translation PLL Visit Renesas Electronics Corporation
    M2004-02-400.0000T Renesas Electronics Corporation Frequency Translation PLL Visit Renesas Electronics Corporation
    M2004-02-644.5313T Renesas Electronics Corporation Frequency Translation PLL Visit Renesas Electronics Corporation

    HY 2004 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    HY2004 ILP Electronics 120 WATT POWER AMP Original PDF

    HY 2004 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    smd code wKX

    Abstract: samsung nc110 samsung nc108 AR5112 TP2322 ELM7S08WS TP2320 smd zG sot 23 TP2323 GND194
    Text: [ Z zhtz|unGwyvwypl{hy€ Y X {opzGkvj|tlu{Gjvu{hpuzGjvumpklu{phs wyvwypl{hy€Gpumvyth{pvuG{oh{Gpz zhtz|unGlslj{yvupjzGjvNzGwyvwly{€U kvGuv{GkpzjsvzlG{vGvyGk|wspjh{lGmvyGv{olyz ljlw{GhzGh|{ovyplkGi€Gzhtz|unU k k jpjospk j i jw|GGGGGGaG ihuphzVkv{ohu j—GzŒ›GaG tjoTtGvkltR


    Original     		PDF wziG2893-3017F ELM7S08WS 100nF MMBD41 PGB001 smd code wKX samsung nc110 samsung nc108 AR5112 TP2322 ELM7S08WS TP2320 smd zG sot 23 TP2323 GND194

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of SSOP20 package SOT266-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF SSOP20 OT266-1 OT266-1

    Untitled

    Abstract: No abstract text available
    Text: December 2006 HYB18L512320BF-7.5 HYE18L512320BF-7.5 DRAMs for Mobile Applications 512-Mbit DDR Mobile-RAM Internet Data Sheet Rev.1.21 Internet Data Sheet HY[B/E]18L512320BF-7.5 512-Mbit Mobile-RAM Revision History: 2006-12-20, Rev. V1.21 All Updated Qimonda template


    Original     		PDF HYB18L512320BF-7 HYE18L512320BF-7 512-Mbit 18L512320BF-7 changed2005-03-01 strength2004-09-13

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP8 package SOT530-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF OT530-1 OT530-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of VSO40 package SOT158-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF VSO40 OT158-1 OT158-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP80 package SOT647-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF TSSOP80 OT647-1 OT647-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP16 package SOT403-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF TSSOP16 OT403-1 OT403-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of VSO56 package SOT190-2 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF VSO56 OT190-2 OT190-2

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP10 package SOT552-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF TSSOP10 OT552-1 OT552-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP38 package SOT510-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF TSSOP38 OT510-1 OT510-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of VSO56 package SOT190-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF VSO56 OT190-1 OT190-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP8 package SOT505-2 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF OT505-2 OT505-2

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA183 package SOT825-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF LFBGA183 OT825-1 OT825-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA180 package SOT640-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF TFBGA180 OT640-1 OT640-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HBGA596 package SOT635-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF HBGA596 OT635-1 OT635-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LQFP32 package SOT358-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF LQFP32 OT358-1 OT358-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP44 package SOT803-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF QFP44 OT803-1 OT803-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LQFP176 package SOT506-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF LQFP176 OT506-1 OT506-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA72 package SOT761-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF TFBGA72 OT761-1 OT761-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HBGA329 package SOT714-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF HBGA329 OT714-1 OT714-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA208 package SOT631-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF LFBGA208 OT631-1 OT631-1

    hy 010

    Abstract: JISC7021 LA201
    Text: LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LIGITEK O FFICE:7F.,NO.208,SEC.3,JHONGYANG Rd.,Tucheng City Taipei Hsien.Taiwan R.O.C TEL: 02 22677686(REP) FAX: (02)22675286, (02)22695616 LED ARRAY LA201W/HY DATA SHEET DOC. NO : QW0905-LA201W/HY REV.


    OCR Scan     		PDF LA201W/HY QW0905-LA201 07-Jul 54TYP LHY2043-1 10min) MIL-STD-202: hy 010 JISC7021 LA201

    JISC7021

    Abstract: HY 1005
    Text: LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only L IG IT E K O FFIC E:7F.,N O .208,SEC.3,JH O N G YA N G Rd.,Tucheng City Taipei Hsien,Taiwan R.O.C TEL: 02 22677686(REP) FAX:(02)22675286,(02)22695616 LED ARRAY LA131B/HY DATA SHEET DOC. NO : QW0905-LA131/HY


    OCR Scan     		PDF LA131B/HY QW0905-LA131 Apr-2004 54TYP LH2640-1 LY2640-1 sub103B 10min) JISC7021 HY 1005

    Untitled

    Abstract: No abstract text available
    Text: 14.3 u ri 1-• ■-■ h -._ ,— ■_ _ ,-,_ hY rV CO CNl SPECIFICATIONS: 1.RATING: 6VDC. 0.3A. 2.CONTACT RESISTANCE: 70m Q MAX. 3.INSULATION RESISTANCE: 500VDC-100M Q MIN. 4.WITHSTAND VOLTAGE: 500VAC-1 MINUTE 5.OPERATING FORCE: 200±150gf


    OCR Scan     		PDF 500VDC-100M 500VAC-1 150gf ffi10 10-100mm 100mm SS-LR4202