HYBRID MEMORY PRODUCTS Search Results

BH3543F

Abstract: BH4127 ba6482 bu2880 BA6898FP BA7762AFS ba7242f BH3543 ba6257 ba6138
Contextual Info: Memory / standard ICs Memory / standard ICs products list Memory / standard ICs products list The data for Rohm monolithic and hybrid ICs are published in seven different volumes separated by classification. / standard ICs •Memory Regulator / motor driver ICs

U4051B

Abstract: BA6302 BA10358FV ba6896fp BA-4116 BH3540A bu4066 BA4116 BA6919FP-Y A728F
Contextual Info: Memory/Standard ICs Memory/Standard ICs Products List Memory/Standard ICs Products List The data for Rohm monolithic and hybrid ICs are pub­ lished in seven different volumes separated by classification. •Memory/Standard ICs •Regulator/Motor driver ICs

EEPROM retention testing

Abstract: flash "high temperature data retention" mechanism ANH005 P1005 flash Activation Energy
Contextual Info: Hybrid Memory Products Ltd Floating Gate Memory Arrays Retention Issues Introduction This document reviews the nature of Data Retention, and presents approaches to its specification and verification based upon procedures defined in the following IEEE publication:

56800E

Abstract: 56F8300 CG56800E DSP56800 DSP56800E M56800E
Contextual Info: Freescale Semiconductor, Inc. Freescale Semiconductor, Inc. 56800E Coding Guidlines for Small Data Memory Model and 56F8300 Large Data Memory Model Hybrid Controller CG56800E Rev. 0, 06/2004 MOTOROLA.COM/SEMICONDUCTORS For More Information On This Product,

56F826

Abstract: 56F827 DSP56800 D1474
Contextual Info: Freescale Semiconductor, Inc. DSP56F826/D Rev. 11.0, 02/2004 56F826 Technical Data Freescale Semiconductor, Inc. 56F826 16-bit Hybrid Controller • Up to 64K x 16-bit words each of external memory expansion for Program and Data memory Hardware DO and REP loops

ionograph

Abstract: 32256LK KM681001AJ SYS32128LK-020 ANH004 KM641001AJ
Contextual Info: Hybrid Memory Products Ltd SRAM Module Mean Time Between Failure Analysis MTBF Introduction In general terms, the reliability of any plastic module assembly can be assessed by dividing the assembly into 4 critical areas - active devices, passive devices,

Contextual Info: DSP56F826/D Rev. 11.0, 02/2004 56F826 Technical Data 56F826 16-bit Hybrid Controller • Up to 64K x 16-bit words each of external memory expansion for Program and Data memory Hardware DO and REP loops • One Serial Port Interface SPI MCU-friendly instruction set supports both

56F826

Abstract: 56F827 DSP56800 DSP56F826 Xtal 8Mhz crystal
Contextual Info: DSP56F826/D Rev. 9.0, 04/2003 56F826 Technical Data 56F826 16-bit Hybrid Controller • Up to 64K x 16-bit words each of external memory expansion for Program and Data memory Hardware DO and REP loops • One Serial Port Interface SPI MCU-friendly instruction set supports both

D15-50

Abstract: 56F826 56F827 DSP56800 JESD51-2 A839
Contextual Info: DSP56F826/D Rev. 10.0, 08/2003 56F826 Technical Data 56F826 16-bit Hybrid Controller • Up to 64K x 16-bit words each of external memory expansion for Program and Data memory Hardware DO and REP loops • One Serial Port Interface SPI MCU-friendly instruction set supports both

IEC749

Abstract: Hybrid Memory Products Krypton-85 202F leak
Contextual Info: Hybrid Memory Products Ltd Hermeticity Testing TECHNICAL NOTE Summary A large portion of the failure mechanisms which are most active in electronic packages are either initiated or accelerated by the presence of moisture. In hermetic packages ceramic or metal this moisture can be locked inside the case during

MLP8 package

Abstract: micro sd card circuit diagram for spi mode MICRO SD card footprint PCB EMIF06-SD02F3 micro sd card circuit diagram L6741 MLP8 FOOTPRINT micro SD card CARD PCB FOOTPRINT STP16CPS05 constant current power led driver schematic diagram
Contextual Info: 2. EMIF06-SD02F3 Space Saving Single Chip IPAD Memory Card Transceiver in Flip-chip 3. Tiny EEPROMs M24 and M95 Series: Market’s First Low Density Serial EEPROMs in 2x3 mm Package 4. L674x For CPU Supply AMD Hybrid Platform: The Complete Solution for Power Management

MOTOROLA brushless dc controller

Abstract: 56F801 56F803 56F807 DSP56800 DSP56F803
Contextual Info: DSP56F803/D Rev. 11.0, 04/2003 56F803 Technical Data 56F803 16-bit Hybrid Controller • Up to 40 MIPS at 80MHz core frequency • • DSP and MCU functionality in a unified, C-efficient architecture Up to 64K x 16-bit words each of external Program and Data memory

56F807

Abstract: quadrature decoder 4X 56F801 56F803 56F805 DSP56800 DSP56F807
Contextual Info: DSP56F807/D Rev. 10.0, 04/2003 56F807 Technical Data 56F807 16-bit Hybrid Processor • Up to 40 MIPS at 80MHz core frequency • • DSP and MCU functionality in a unified, C-efficient architecture Up to 64K x 16- bit words each of external Program and Data memory

MOTOROLA brushless dc controller

Abstract: isa0 56F801 56F803 56F805 56F807 DSP56800 DSP56F805
Contextual Info: DSP56F805/D Rev. 10.0, 04/2003 56F805 Technical Data 56F805 16-bit Hybrid Controller • Up to 40 MIPS at 80MHz core frequency • • DSP and MCU functionality in a unified, C-efficient architecture Up to 64K x 16-bit words each of external Program and Data memory

Contextual Info: XPressArray-II 0.15mm Structured ASIC Data Sheet 1.0 Key Features • Next-generation 0.15mm hybrid structured ASIC • Initializable distributed memory at speeds up to 210MHz • Platform for high-performance 1.5V/1.2V ASICs and FPGAto-ASIC conversions • Configurable signal, core and I/O power supply pin locations

Contextual Info: DSP56F803/D Rev. 13.0, 02/2004 56F803 Technical Data 56F803 16-bit Hybrid Controller • Up to 40 MIPS at 80MHz core frequency • • DSP and MCU functionality in a unified, C-efficient architecture Up to 64K x 16-bit words each of external Program and Data memory

ANB0

Abstract: 56F807
Contextual Info: DSP56F807/D Rev. 12.0, 02/2004 56F807 Technical Data 56F807 16-bit Hybrid Processor • Up to 40 MIPS at 80MHz core frequency • • DSP and MCU functionality in a unified, C-efficient architecture Up to 64K x 16- bit words each of external Program and Data memory

ra1613

Abstract: FB360 HSTL18 XC2V3000-BG728 XC3S1000-FT256 XC3S200-ft256 X2P376 X2P528 X2P680 BGA 728 35x35 1.27
Contextual Info: XPressArray-II 0.15mm Structured ASIC Data Sheet 1.0 Key Features • Next-generation 0.15mm hybrid structured ASIC • Initializable distributed memory at speeds up to 210MHz • Platform for high-performance 1.5V/1.2V ASICs and FPGAto-ASIC conversions • Configurable signal, core and I/O power supply pin locations

isa0

Abstract: MOTOROLA brushless dc controller PWMA circuit diagram of smart home alarm system transistor motorola b11 56F801 56F803 56F805 56F807 DSP56800
Contextual Info: DSP56F807/D Rev. 11.0, 08/2003 56F807 Technical Data 56F807 16-bit Hybrid Processor • Up to 40 MIPS at 80MHz core frequency • • DSP and MCU functionality in a unified, C-efficient architecture Up to 64K x 16- bit words each of external Program and Data memory

MOTOROLA brushless dc controller

Abstract: 56F801 56F803 56F805 56F807 DSP56800
Contextual Info: DSP56F805/D Rev. 11.0, 08/2003 56F805 Technical Data 56F805 16-bit Hybrid Controller • Up to 40 MIPS at 80MHz core frequency • • DSP and MCU functionality in a unified, C-efficient architecture Up to 64K x 16-bit words each of external Program and Data memory

56F805 PWM

Contextual Info: DSP56F805/D Rev. 12.0, 02/2004 56F805 Technical Data 56F805 16-bit Hybrid Controller • Up to 40 MIPS at 80MHz core frequency • • DSP and MCU functionality in a unified, C-efficient architecture Up to 64K x 16-bit words each of external Program and Data memory

LOG TX2 1108

Abstract: mu-2f ST 78L05A LM386 speaker mu2f 89C024 C14S4 intel PLD LM386 LOW POWER AUDIO AMPLIFIER IC- BLOCK DIAGRAM AND PINOUT 89c026
Contextual Info: INTEL CORP MEMORY/PLD/ bfiE D • MÔ2bl7b DDÔSDST Sfi2 ■ ITL2 in t e l 89C124FX DATA/FAX MODEM CHIP SET ■ 9600 bps Send and Receive FAX ■ On-Chip Hybrid ■ V.29 and V.27ter Compatible ■ DTMF and Pulse Dialing ■ Supports Communicating Applications

ADI334

Contextual Info: A N A LO G D EVICES □ Four-Channel 12-Bit Sampling A/D Converter for Digital Signal Processing ADI334 1.1 Scope. This specification covers the detail requirements for a hybrid, 12-bit analog-to-digital converter including quad sample-and-hold, multiplexer, reference, timing circuitry and FIFO memory.

nuclear radiation detector

Abstract: Semiconductor Nuclear Radiation Detector HSN-1000 pin diodes radiation detector gamma radiation pin detector radiation hybrid HSN-1000F HSN-1000L 062700
Contextual Info: SPACE ELECTRONICS INC. NUCLEAR EVENT DETECTOR S PACE PRODUCTS HSN-1000 VB 8 9 Threshold Adjust VH VL 14 1 10 kΩ NED 2 Detector Pin Diode BIT 6 Amplifier Pulse Timer LED 7 5 C 4 RC Memory GND FEATURES : DESCRIPTION: • • • • • • • • • Space Electronics’ HSN-1000 radiation-hardened Hybrid Nuclear Event