IC GOLD PLATED SERIES Search Results

Contextual Info: 2011 SERIES □upiin PIN HEADER 2.54mmX2.54mm 0.100"X0.100" M aterial: Housing: 30% Glass filled PBT UL94-V-0. Contacts: Brass Plating: Gold plated: 5 /J,' over 50/T nickel. Tin plated: 150^’ over 7 0 j l nickel. E le c t r ic a l C h a r a c t e r i s t ic s :

Contextual Info: 2049 SERIES □ m \r\ P.C.B. SOCKET 2.54mm 0.100" M ate ria l: Housing: 30% Glass filled PBT U L94V—0. Contacts: Phosphor Bronze. Plating: Gold plated: 5 / ! ' over 5 0 /x nickel. Tin plated: 150/i' over 70/i' nickel. E le c t r ic a l C h a r a c t e r is t ic s :

Contextual Info: IC-E CONNECTOR SYSTEM .100” 2.54mm SIP Socket (screw machine pin) CONTACT: INNER CLIP-BERYLLIUM COPPER OUTER SLEEVE-BRASS INSULATOR. PBT & 30% G.F. PLATING: OUTER SHIELD : TIN PLATED INNER CONTACT : GOLD OR NI PLATED CURRENT RATING : 1A WITHSTANDING VOLTAGE : 1000VAC(1 MIN)

trk ps

Abstract: Board to Board 2row 2.54mm
Contextual Info: P.C. BOARD SOCKET DOUBLE ROW 2.54 * 2.54 nun MATERIAL •Insulator : PBT 01 PPS (UL94V-0) •Contici : Copper Alloy •Contact Plated : G = All Gold Plated T = All Tin Plated S P E C IF IC A T IO N • C u r r e n t R a lr : lA m p LX! •Contact Rcsistancc : 30m £2 Max

Contextual Info: 2114 SERIES □ur in PIN HEADER 2.0mmX2.0mm 0.079"X0.079" M aterial: Housing: 30% Glass filled PBT U L94V- 0. Contacts: Brass Plating: Gold plated: 5// over 50 // nickel. Tin plated: 150// over 70// nickel. E le c t r i c a l C h a r a c t e r i s t ic s :

UL940V-0

Abstract: UL940V0 z003 USB MINI 5P
Contextual Info: □upun 8969 Series Mini USB B Type 5P SMD F em a le S lim Type M aterial: Housing: 30% Glass filled LCP UL940v-0. Contacts: Phosphor Bronze Shell: Brass, Nickel Plated. Plating: Selective Gold Plated. E le c tr ic a l C h a r a c te r istic s: Current Rating: 1 AMP.

UL940V-0

Abstract: USB MINI 5P 8969-B
Contextual Info: 8969 Series □upun Mini USB B Type 5P SMD F e m a le S lim Type M aterial: Housing: 30% Glass filled LCP UL940v-0. Contacts: Phosphor Bronze Shell: Brass, Nickel Plated. Plating: Selective Gold Plated. E le c tr ic a l C h a r a c te r istic s: Current Rating: 1 AMP.

Contextual Info: 2045 SERIES □upi in P.C.B. SOCKET 2.54mm 0.100" M aterial: Housing: 30% Glass filled PBT UL94V -0. Contocts: Phosphor Bronze. Plating: Gold plated: 5/1' over 50/1' nickel. Tin plated: 150/l! over 70j l ‘ nickel. E le c tr ic a l C h a r a c te r is tic s :

Contextual Info: 2047 SERIES □upk in ELEVATED P.C.B. SOCKET 2.54mmX2.54mm 0.100>/X0.100" M aterial: Housing: 30% Glass filled PBT U L94V -0. Contacts: Phosphor Bronze. Plating: Gold plated: 5/7 over 50/7 nickel. Tin plated: 150/7 over 70/7 nickel. E le c tr ic a l C h a r a c te r is tic s :

Contextual Info: 2042 SERIES □upnn P.C.B. SOCKET 2.54mmX2.54mm 0.100"X 0.100" M ate ria l: Housing: 30% Glass filled PBT UL94V -0. Contacts: Phosphor Bronze. Plating: Gold plated: 5 / 1' over 50 / 1' nickel. Tin plated: 150 / 1' over 70 / 1' nickel. E le c t r ic a l C h a r a c te r is tic s :

Contextual Info: 10 TECHNICAL S P E C IF IC A T IO N S ; PART NUMBER TOOLED I- MATERIAL: HOUSING: LCP G.F. UL94V0 COLOR : BLACK TERMINAL : PHOSPHOR BRONZE PLATED WITH BASE FINISH: NICKEL CONTACT SURFACE FINISH: GOLD OR GOLD FLASH OVER PALLADIUM NICKEL EXCEEDS PRODUCT REQUIREMENTS BASED ON PS-85508-001

Contextual Info: 2112 SERIES □upi in PIN HEADER 2.0mmX2.0mm 0.079"X0.079" M aterial: Housing: 30% Glass filled Contacts: Brass Plating: Gold plated: 5 1 50 1 / Tin plated: 1 PBT U L94V—0. ' / ' over 5 0 / ! ' nickel. over 70/T nickel. E le c t r i c a l C h a r a c t e r i s t ic s :

Contextual Info: ECN, ERN NO. DATE P R O P O S AL T H IS M EC H AN IC AL SPEC IFICATIO N S: C ENTRE C ENTRE N IC K E L CONTACT: PLATED C APACITANCE: BRASS DIELECTRIC PH O S P H O R B R O N ZE , 1 0 julN C H E S [ 0 . 2 5 M IC R O N S ] GOLD PLATED BR ASS, TIN 1 0 ,0 0 0 pF

Contextual Info: 2041 S e r ie s □upiin P.C.B. Socket 2.54m m 0.100” M aterial: Housing: 30% Glass filled PBT UL94V-0. Contacts: Phosphor Bronze. Plating: Gold plated over nickel. Tin plated over nickel. E le c tr ic a l C h a r a c te r is tic s: Current Rating: 1 AMP.

Contextual Info: 2 1 1 7 SERIES □umn BOX HEADER 2.0m m X2.0m m 0.079"X0.079" Material: Housing: 30% Glass filled PBT U L 9 4 V - 0 . C o n ta cts: Brass P lating: Gold plated: 5 ¡1' over 5 0 ¡ 1' nickel. Tin plated: 1 5 0 ^ ' over 70 /1' nickel. E le c tr ic a l C h a r a c te r is tic s :

Contextual Info: REV. ECN NO. DATE A RELEASE Jun 2 4 ,2 0 0 4 B 0 4 *0 6 4 5 Jun 2 5 ,2 0 0 4 MATERIALS 1. HOUSING: H I.-TE M P .P LA S T IC U L 9 4 V -0 ,B L U E . 2. TERMINAL: COPPER A L L O Y .t= 0 .3 0 m m GOLD PLATED ON CONTACT AREA, TIN PLATED ON SOLDER TAIL, UNDER NICKEL PLATED.

Contextual Info: SMA SERIES 10 & 15 WATTS C o a x ia l M ic r o w a v e 20 IN 0.645 1.25 1.88 1.90 1.97 2.00 MECHANICAL SPECIFICATIONS Nut Contact H ousing Insulator W eight as m CFT-10 SM ELECTRICAL SPECIFICATIONS Stainless Steel. Beryllium, Copper, Gold Plated. Aluminum,

Contextual Info: 2049 SERIES □ m kn P.C.B. SOCKET 2.5 4 m m 0 .1 0 0 " M aterial: H ousing: 30% Glass filled PBT UL94V— 0. C o n ta cts: P hospho r Bronze. P lating: Gold plated: 5 /I' over 5 0 /x nickel. Tin plated: 15 0 /i' over 70¡i nickel. E le c tric a l C h a r a c t e r is t ic s :

Contextual Info: I FEATURES I • Specially designed to accept the ELK socket. ■ Standard 0.100" 2.54mm IC pitch, easy to mount in PC board. ■ All plastic are UL 94V-0 grade fire retardant. ■ Gold plated contact to ensure low contact resistance and long operation life.

BA 5974

Abstract: lm 14D
Contextual Info: 5974 Series □ u p i in C e n tr o n ic C o n n e c to r S o ld e r Type M aterial: Housing: PET, UL94V-0 Rated. Contacts: Brci99. Plating:Selective gold plated on contact area nickel. Shell: Cold Roller Steel. E lectrica l C h aracteristics: Current Rating:! AMP.

AMP PBT connector

Abstract: CENTRONIC 36 pin
Contextual Info: 5973 Series □upi in C en tron ic C on n ector E ig h t Angle Type M aterial: Housing: PBT, UL94V-0 Rated. C ontacts: Phosphor Bronze. Platin g:Se le ctive gold plated on contact area nickel. Shell: Cold Roller Steel. E le c tric a l C h a ra c te r istic s:

Contextual Info: 7902 SERIES □upi in SUM D-SUB RIGHT ANGLE TYPE M aterial: Housing: High tem pe ra ture housing U L94V -0 withstands IR and VPR soldering m ethods. Contacts: Phosphor Bronze. Plating: Selective Gold plated. E le c tr ic a l C h a r a c te r is tic s : Current Rating: 1 AMP.

Contextual Info: n 0.05" 0.05” j Pin Header 2 7mm Dual Row 06 to 100 Contact'' 0.4mm {0JJ157" Square Pori A P P L IC A T IO N AND l<05:>[} Scries FEATURES S P E C IF IC A T IO N S 1. Side stackable (on unbroken edges). 2. Variable pin length, gold or tin plated. 3 . Standoffs facilitate post solder cleaning.

Contextual Info: 7901 SERIES □upi in D-SUB I.D.C TYPE M aterial: Housing: 30% Gloss filled PBT U L94V -0. C ontacts: Phosphor Bronze. Plating: Gold plated. E le c t r i c a l C h a r a c t e r i s t ic s : Current Rating: 1 AMP. Insulator Resistance: 5000M 0 min. at DC 500V.