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    IC SHIPPING TRAY Search Results

    IC SHIPPING TRAY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    74HC4053FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    74HC4051FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL1G07FU Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Non-Inverter Buffer (Open Drain), USV, -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation

    IC SHIPPING TRAY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    56mm carrier tape

    Abstract: 28 pin ic TM 1628
    Text: u Chapter 13 Packing Methods and Labels CHAPTER 13 PACKING METHODS AND LABELS Introduction Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Packing for Jewel Boxes Box Labeling Packages and Packing Publication Revision A 3/1/03


    Original     		PDF 3027b 56mm carrier tape 28 pin ic TM 1628

    92HP61B7X5

    Abstract: cxd9872 92HD73 stac9227x5 stac9228x5 ND07071 PEAK tray drawing 92HD73C1X5PRGXC1X TQFP Shipping Trays 92hd73c1x5
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: TB0812-05 DATE: 1/27/2009 Product Affected: 7 mm x 7 mm TQFP-48 shipped in tray Date Effective: Contact: Title: Phone #: Fax #:


    Original     		PDF TB0812-05 TQFP-48 STAC9272D5TAEA2X STAC9272D5TAEB1X STAC9272D5TAEB2X STAC9272D5TAEB4X STAC9272X3TAEA2X STAC9272X3TAEB1X STAC9272X3TAEB2X 92HP61B7X5 cxd9872 92HD73 stac9227x5 stac9228x5 ND07071 PEAK tray drawing 92HD73C1X5PRGXC1X TQFP Shipping Trays 92hd73c1x5

    PEAK MPPO PP6

    Abstract: TRAY MPPO DAEWON tray drawing CABGA-208 daewon PEAK tray drawing IDT70V659S10BFG idt89h DAEWON drawing IDT70V657S12BFI
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: TB0812-03 DATE: 1/27/2009 Product Affected: 15 mm x 15 mm CABGA-196 & 208 shipped in tray Date Effective: Contact: Title: Phone #:


    Original     		PDF TB0812-03 CABGA-196 1515BF IDT70V658S15BFG IDT70V658S15BFI IDT70V659S10BF IDT70V659S10BFG IDT70V659S12BF IDT70V659S12BFG PEAK MPPO PP6 TRAY MPPO DAEWON tray drawing CABGA-208 daewon PEAK tray drawing IDT70V659S10BFG idt89h DAEWON drawing IDT70V657S12BFI

    WNF008

    Abstract: code res pack 8 SO3016 UNE008 spansion tray
    Text: ‹ Chapter 10 Packing Methods and Labels CHAPTER 10 PACKING METHODS AND LABELS Introduction Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Box Labeling Packages and Packing Methodologies Handbook 1 March 2008 10-1 ‹ Chapter 10 Packing Methods and Labels


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    Side Brazed Ceramic Dual-In-Line Packages

    Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year


    Original     		PDF

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


    Original     		PDF

    TSOP 56 socket

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
    Text: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the


    Original     		PDF 68-Pin iMC00XFLKA iNC110XX TSOP 56 socket 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817

    intel packaging

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
    Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than


    Original     		PDF CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays

    4x13

    Abstract: No abstract text available
    Text: DEVICE PACKING 1. SHIPPING CONTAINERS AND HANDLING 1.1 SHIPPING CONTAINER FORMS Figures 1 and 2 illustrate the shipping container forms for ordinary IC devices. Within the outer corrugated cardboard carton there are one or more inner cartons. These inner carton contain


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    Untitled

    Abstract: No abstract text available
    Text: DEVICE PACKING 1 . SHIPPING CONTAINERS AND HANDLING 1 .1 SHIPPING CONTAINER FORMS Figures 1 and 2 illustrate the shipping container forms for ordinary IC devices. Within the outer corrugated cardboard carton there are one or more inner cartons. These inner carton contain


    OCR Scan     		PDF J4444444444444444444444444444

    CP-52

    Abstract: No abstract text available
    Text: DEVICE PACKING 1 . SHIPPING CONTAINERS AND HANDLING 1 .1 SHIPPING CONTAINER FORMS Figures 1 and 2 illustrate the shipping container forms for ordinary IC devices. Within the outer corrugated cardboard carton there are one or more inner cartons. These inner carton contain


    OCR Scan     		PDF

    xn 1203

    Abstract: No abstract text available
    Text: 4 | THIS bftAVM IS UNMJBUSHE6. COPYRIGHT - I RELEASED PAR PUBUSATIiW B Y TYCO ELECTRONICS CORPORATION. ^ 3 I “T — . LOC R E V IS IO N S DW RIGHTS R E SER V E D - 4.30 c o REVISED ECR—08—016575 00.7 TE LOGO Sc DATE CODE J— 1_ o o [ 0 8 0 ] NOTES :


    OCR Scan     		PDF 762/mn 048/rm 27/on 762/im 033OmmX37 350mm 050PCS) 66KG/CART0N. 26KG/CART0N. xn 1203

    Untitled

    Abstract: No abstract text available
    Text: THIS DRAWING IS UNPUBLISHED. COPYRIGHT - -, RELEASED FOR PUBLICATION ALL RIGHTS RESERVED. BY - REVISIONS LOC DW DESCRIPTION LTR c GROUNDING REVISED PER DWN DATE RK HMR 1APR 1 EC O -1 1-005301 APVD PANEL 14.no TE LOGO & DATE CODE 4.00 0 0 .7 0 DETAIL A S C A LE


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    1734866-1

    Abstract: No abstract text available
    Text: 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. REVISIONS LOC ALL RIGHTS RESERVED. DW LTR DESCRIPTION B1 30.82i0.3fi DATE DWN SC WK 090CT08 REVISED ECR—08—024967 APVD D D 31.6±0.38 12.55 # 4 -4 0 SCREW


    OCR Scan     		PDF 090CT08 40UNC-A UL94V-0. 31MAR2000 1734866-1

    Untitled

    Abstract: No abstract text available
    Text: 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT 3 | RELEASED BY TYCO ELECTRONICS CORPORATION. FOR PUBLICATION 2 AUG .20 06. 1 LOC ALL RIGHTS RESERVED. R E V IS IO N S DW P LTR DESCRIPTION B2 GROUNDING PANEL OPTION TE LOGO & DATE CODE 12.80 DATE OWN 09APR09 E C R —0 9 —0 0 1 6 1 2


    OCR Scan     		PDF 09APR09

    990pc

    Abstract: No abstract text available
    Text: THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION ALL RIGHTS RESERVED. BY - REVISIONS LOC DW DESCRIPTION LTR A1 REVISED PER ECO- DATE 07MAR11 -005301 DWN APVD RK HMR NOTES: 1. M ATERIAL : 3 0 .8 0 + 0 . 1.1 HOUSING: TH ER M O P LA STIC , U L 9 4 V - 0


    OCR Scan     		PDF 07MAR11 100ju" 990pc

    Untitled

    Abstract: No abstract text available
    Text: T H IS D R A W IN G IS C O P Y R IG H T U N P U B L IS H E D . 2003 BY ^ C O RELEASED E L E C T R O N IC S FO R ALL C O R P O R A T IO N . P U B L IC A T IO N R IG H T S APR ,2 0 0 3 . R E V IS IO N S RESERVED. NOTES: 1. MATERIAL HOUSING : CONTACTS : SHELL :


    OCR Scan     		PDF 02DEC08 10APR03 31MAR2000 10APR

    d connector screw lock torque

    Abstract: 60JU L465 3-1634218-2
    Text: T H IS D R A W IN G IS C O P Y R IG H T U N P U B L IS H E D . 2003 BY ^ C O RELEASED E L E C T R O N IC S C O R P O R A T IO N . FO R ALL P U B L IC A T IO N R IG H T S APR ,2 0 0 3 . R E V IS IO N S RESERVED. E LTR NOTES: F 1. MATERIAL HOUSING : CONTACTS :


    OCR Scan     		PDF UL94V-0, 10OOMOHMS 500VDC 55DEGC 105RRUGATED 10APR03 31MAR2000 d connector screw lock torque 60JU L465 3-1634218-2

    Untitled

    Abstract: No abstract text available
    Text: 4 3 THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC AUG ,2006. ALL RIGHTS RESERVED. R E V IS IO N S DW p LTR DESCRIPTION B D DATE DWN B.W s .c 1 1 FEB09 REVISED ECR—0 9 - 0 0 2 8 2 1 APVD D NOTES:


    OCR Scan     		PDF FEB09 850PCS) 31MAR2000

    Untitled

    Abstract: No abstract text available
    Text: T H IS D R A W IN G C O P Y R IG H T IS U N P U B L IS H E D . 2003 BY ^ C O REUEASED EU E C TR O N IC S C O R P O R A T IO N . FO R AUU P U B U IC A T IO N R IG H T S APR ,2 0 0 3 - R E V IS IO N S RESERVED. E LTR F NOTES: 1. MATERIAL HOUSING : CONTACTS :


    OCR Scan     		PDF 02DEC08 10APR 31MAR2000 10APR03

    Untitled

    Abstract: No abstract text available
    Text: 4 3 THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. AUG ,2006. LOC ALL RIGHTS RESERVED. REVISIONS DW p LTR DESCRIPTION B DATE DWN 11FEB09 REVISED ECR— 0 9 - 0 0 2 8 2 1 APVD B.W s.c D D NOTES: ROHS 2 0 0 2 /9 5 /E C


    OCR Scan     		PDF 11FEB09 31MAR2000

    Untitled

    Abstract: No abstract text available
    Text: REVISION HISTORY Ky NOTES! U N LESS OTHERWISE SPECIFIED 1. TRAYS MUST MEET ALL REQUIREMENTS OF AMKOR/ANAM § 01 -04-31 - 2 2 B 3 PROCUREMENT SPE C FOR SHIPPING TRAY. 2. BAKEABLE TRAYS ARE INTENDED TO BE CONTINUOUSLY 3. TOTAL USABLE CELL COUNT IS 490. 4. TRAY VACUUM PICKUP METHOD REQUIRES A 28XZ8m m


    OCR Scan     		PDF 28XZ8m A51200 A52135

    Untitled

    Abstract: No abstract text available
    Text: THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION AUG .2006. L0C ALL RIGHTS RESERVED. BY TYCO ELECTRONICS CORPORATION. R E V IS IO N S DW p LTR DESCRIPTION A REVISED ECR—0 8 —0 1 1 7 2 1 DATE DWN APVD 08M AR08 SH WK 12.00 D D 16.1 13.1


    OCR Scan     		PDF 12KG/SHIPPING 31MAR2000

    HU 20001

    Abstract: PBT 30gf
    Text: 4 3 THIS DRAWING IS UNPUBLISHED. COPYRIGHT 2 RELEASED FOR PUBLICATION ALL RIGHTS RESERVED. BY - REVISIONS LOC DW DESCRIPTION LTR REVISED PER ECO- 07MAR11 -005301 D o o C 14.5 PIN 1 1 7.50 APVD RK HMR D 00.90 + 0.08 DIM A 13.10 DWN DATE L0 G 0& DATE CODE


    OCR Scan     		PDF 07MAR11 UL94V-0, 762//m 048//m 27/zm 762/zm 390mm, 165mm, HU 20001 PBT 30gf