IC TRAY Search Results

OBGA

Contextual Info: iC-LSB, iC-LSC oBGA LS2C PHOTOSENSOR PACKAGE SPECIFICATION Rev B1, Page 1/5 ORDERING INFORMATION Type Package Options Order Designation iC-LSB oBGA LS2C glass lid iC-LSB oBGA LS2C iC-LSB oBGA LS2C reticle iC-LSB oBGA LS2C-LSxR iC-LSC oBGA LS2C glass lid iC-LSC oBGA LS2C

OF2RZ

Contextual Info: iC-OF BLCC OF3C PACKAGE SPECIFICATION Rev C2, Page 1/4 ORDERING INFORMATION Type Package Options Order Designation iC-OF BLCC OF3C none iC-OF BLCC OF3C iC-OF BLCC OF3C reticle iC-OF BLCC OF3C OF2RZ iC-OF BLCC OF3C-ET iC-OF BLCC OF3C-ET reticle Code Disc 1024 PPR, 18 mm

1895 ic

Abstract: tfp 370 TFP-32D 2620D 40DA IC 404
Contextual Info: Packing Specifications 1. Forms of Package Packing The forms of IC delivery include, as shown below, leaving the IC unsealed in a packing box and using an inside box in which there are magazines, trays, or a tape, with the IC being housed inside. In the unsealed

tfp 370

Contextual Info: Packing Specifications 1. Forms of Package Packing The forms of IC delivery include, as shown below, leaving the IC unsealed in a packing box and using an inside box in which there are magazines, trays, or a tape, with the IC being housed inside. In the unsealed

IC 404

Contextual Info: Packing Specifications 1. Forms of Package Packing The forms of IC delivery include, as shown below, leaving the IC unsealed in a packing box and using an inside box in which there are magazines, trays, or a tape, with the IC being housed inside. In the unsealed

Contextual Info: Packing Specifications 1. Forms of Package Packing The forms o f IC delivery include, as shown below, leaving the IC unsealed in a packing box and using an inside box in which there are magazines, trays, or a tape, with the IC being housed inside. In the unsealed

OBGA

Abstract: iC-Haus OF4C analog devices bottom mark
Contextual Info: iC-OF oBGA OF4C PACKAGE SPECIFICATION Rev C1, Page 1/4 ORDERING INFORMATION Type Package Options Order Designation iC-OF optoBGATM OF4C none leaded balls built-in reticle iC-OF oBGA OF4C iC-OF oBGA OF4C-1 iC-OF oBGA OF4C-OF2RY optoBGATM OF4C 5.4 mm x 4.2 mm

diode wg

Abstract: 9958 MMA6
Contextual Info: iC-WG BLCC WGC OPTO ENCODER PACKAGE SPECIFICATION Rev E1, Page 1/5 ORDERING INFORMATION Type Package Options Order Designation iC-WG BLCC WGC Glass Lid iC-WG BLCC WGC-WG1L iC-WG BLCC WGC iC-WG BLCC WGC-WG1R Code Disc 13bit-Gray +2048 PPR A/B, d 44mm - reticle

TSOP II 44 REEL

Abstract: CP-20DA
Contextual Info: Packing Specifications 1. Forms of Package Packing The forms o f IC delivery include, as shown below, leaving the IC unsealed in a packing box and using an inside box in which there is a magazine, a tray, or tape, with the IC being housed inside. In the unsealed mode, the order o f operations should be

Contextual Info: AnaSem Analog Semiconductor IC A7B Series Single-cell Li-ion / Li-polymer Battery Protection IC Rev. E09-06 AnaSem Inc. . Future of the analog world Rev. E09-06 AnaSem Products Data Sheet Analog Semiconductor IC Single-cell Li-ion / Li-polymer Battery Protection IC

corrugated carton

Abstract: FP-32D package IC Packing and Labelling Specification
Contextual Info: Packing Specifications Contents 1. Forms of Package Packing 2. Moistureproof Packing 3. Taping for IC 4. Taping for IC Memorys Packing Specifications 1. Forms of Package Packing The forms of IC delivery include, as shown below, leaving the IC unsealed in a packing box and using

Contextual Info: THE INFORMATION CONTAINED HEREIN IS CONSIDERED 'PROPRIETARY' TO BEL FUSE INC. AND SHALL NOT BE COPIED, REPRODUCED DR DISCLOSED WITHOUT THE WRITTEN APPROVE DF BEL FUSE INC. SCHEMATIC ELECTRICAL TURNS CH ARAC TERISTICS R A T IO IC T IC T IC T IC T TP1 TP2 TP3

Contextual Info: CD-LDE033-0510 T-1437 SMT14mm-width type <IC drive type> Features ・Slim, low-profile design 7.5mm max. and high power. ・Supports reflow soldering. (Supports Pb free soldering) ・Supports automatic mounting. (Tray type) ・High efficiency possible by using separate excitation IC.

Contextual Info: CD-LDE049-0510 T-1437B SMT14mm-width type <IC drive type> Features ・Slim, low-profile design 7.5mm max. and high power. ・Supports reflow soldering. (Supports Pb free soldering) ・Supports automatic mounting. (Tray type) ・High efficiency possible by using separate excitation IC.

1232B

Contextual Info: CD-LDE031-0510 T-1232B SMT12mm-width type <IC drive type> Features ・Slim, low-profile design 7.5mm max. and high power. ・Supports reflow soldering. (Supports Pb free soldering) ・Supports automatic mounting. (Tray type) ・High efficiency possible by using separate excitation IC.

Contextual Info: CD-LDE023-0510 T-0936 SMT9mm-width type <IC drive type> Features ･Slim, low-profile design 3.8mm max. and high power. ･Supports reflow soldering. (Supports Pb free soldering) ･Supports automatic mounting. (Tray type) ･High efficiency possible by using separate excitation IC.

Contextual Info: CD-LDE037-0510 T-0940 SMT9mm-width type <IC drive type> Features ･Slim, low-profile design 4.0mm max. and high power. ･Supports reflow soldering. (Supports Pb free soldering) ･Supports automatic mounting. (Tray type) ･High efficiency possible by using separate excitation IC.

Contextual Info: CD-LDE027-5010 T-1033A SMT10mm-width type <IC drive type> Features ･Slim, low-profile design 4.7mm max. and high power. ･Supports reflow soldering. (Supports Pb free soldering) ･Supports automatic mounting. (Tray type) ･High efficiency possible by using separate excitation IC.

Contextual Info: CD-LDE046-0510 T-1332 SMT13mm-width type <IC drive type> Features ・Slim, low-profile design 7.5mm max. and high power. ・Supports reflow soldering. (Supports Pb free soldering) ・Supports automatic mounting. (Tray type) ・High efficiency possible by using separate excitation IC.

21-inches

Contextual Info: CD-LDE039-0510 T-1034 SMT10mm-width type <IC drive type> Features ･Slim, low-profile design 4.7mm max. and high power. ･Supports reflow soldering. (Supports Pb free soldering) ･Supports automatic mounting. (Tray type) ･High efficiency possible by using separate excitation IC.

1432

Contextual Info: CD-LDE032-0510 T-1432 SMT14mm-width type <IC drive type> Features ・Slim, low-profile design 7.5mm max. and high power. ・Supports reflow soldering. (Supports Pb free soldering) ・Supports automatic mounting. (Tray type) ・High efficiency possible by using separate excitation IC.

ic socket DIP

Abstract: ic base for 40 pin DIP ic
Contextual Info: AXS1 HIGH RELIABILITY IC SOCKET WITH ROUND PIN SEALED TYPE Compliance with RoHS Directive ROUND PIN TYPE SEALED IC SOCKETS (AXS1) FEATURES CONSTRUCTION 1. Sealed IC sockets compatible with ultrasonic cleaning (30 seconds), 3-bath cleaning (boiling, ultrasonic,

ramp generator 555

Abstract: Bluetooth RSSI circuit diagram
Contextual Info: T2901 Bluetooth Single-chip Transceiver IC Description The T2901 is a bipolar IC manufactured using Atmel Wireless & Microcontrollers’ advanced UHF process. This IC includes a transceiver for the 2.45 GHz ISM band especially for Bluetooth applications. Features

ic type diagram

Abstract: 32 QFP PACKAGE thermal resistance marking mitsubishi TSOP 32 thermal resistance QFP PACKAGE thermal resistance TSOP 62 Package ic package LIST OF Serial IC BGA and QFP Package mounting mitsubishi marking
Contextual Info: IC Package Table of Contents 1. GUIDANCE 2. DETAILED DIAGRAM OF PACKAGE OUTLINES 3. PACKAGING FOR SHIPMENT 4. MOUNTING TECHNOLOGY 5. REFERENCE MATERIAL MITSUBISHI ELECTRIC CORPORATION IC Package 1. GUIDANCE 1. FUNCTIONAL REQUIREMENTS 2. IC PACKAGE CLASSIFICATION