IC51-0162-778 Search Results

IC51-0162-778 Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
68016-218HLF		Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 18 Positions, 2.54 mm (0.100) Pitch.
10127820-1622LLF		Amphenol Communications Solutions	Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 16 Positions, LCP, GW Compatible, Tray Packing.
68016-214HLF		Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 14 Positions, 2.54 mm (0.100) Pitch.
10127820-1621GPLF		Amphenol Communications Solutions	Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 16 Positions, GW Compatible Nylon66, Tray Packing, With Pegs.
68016-203HLF		Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 3 Positions, 2.54 mm (0.100) Pitch.

IC51-0162-778 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Datasheet Type	PDF	PDF Size	Page count
IC51-0162-778		Yamaichi Electronics	Shrink Small Outline Package (SSOP)	Original	PDF	101.77KB	4

IC51-0162-778 Price and Stock

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Yamaichi Electronics Co Ltd


Yamaichi Electronics Co Ltd IC51-0162-778 IC & Component Sockets 16 PIN TSOP 0.65 MM PITCH
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Mouser Electronics	IC51-0162-778		8			1 $52.52 10 $44.82 100 $39.36 1000 $39.36 10000 $39.36	Buy Now