IGC109T120T6RL Search Results
IGC109T120T6RL Price and Stock
Infineon Technologies AG IGC109T120T6RLX1SA2- Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC109T120T6RLX1SA2) |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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IGC109T120T6RLX1SA2 | Waffle Pack | 111 Weeks | 33 |
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IGC109T120T6RL Datasheets (1)
Part | ECAD Model | Manufacturer | Description | Curated | Datasheet Type | |
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IGC109T120T6RL |
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IGBT Chips; Technology: IGBT 4 Low Power; VDS (max): 1,200.0 V; IC (max): 110.0 A; VCE(sat) (max): 2.05 V; VGE(th) (min): 5.0 V; | Original |
IGC109T120T6RL Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: IGC109T120T6RL IGBT4 Low Power Chip Features: • 1200V Trench + Field stop technology • low switching losses • positive temperature coefficient • easy paralleling This chip is used for: • low / medium power modules C Applications: • low / medium power drives |
Original |
IGC109T120T6RL L7742C, | |
Contextual Info: IGC109T120T6RL IGBT4 Low Power Chip Features: • 1200V Trench + Field stop technology • low switching losses • positive temperature coefficient • easy paralleling This chip is used for: • low / medium power modules C Applications: • low / medium power drives |
Original |
IGC109T120T6RL IGC109T120T6 L7742C, |