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    IGP-28111 Search Results

    IGP-28111 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54112-811102500LF
    Amphenol Communications Solutions BergStikĀ®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    10114828-11114LF
    Amphenol Communications Solutions 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions Visit Amphenol Communications Solutions
    10114828-11113LF
    Amphenol Communications Solutions 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 13 Positions Visit Amphenol Communications Solutions
    10114828-11102LF
    Amphenol Communications Solutions 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions Visit Amphenol Communications Solutions
    10114828-11107LF
    Amphenol Communications Solutions 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 7 Positions Visit Amphenol Communications Solutions

    IGP-28111 Datasheets (4)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    IGP-28111J
    Bookham Technology SFP Optical Transceivers for 2.7Gb/s 180km DWDM Applications Original PDF 1.18MB 17
    IGP-28111J-07
    Bookham Technology SFP Optical Transceivers for 2.7Gb/s 180km DWDM Applications Original PDF 1.18MB 17
    IGP-28111J-08
    Bookham Technology SFP Optical Transceivers for 2.7Gb/s 180km DWDM Applications Original PDF 1.18MB 17
    IGP-28111J-09
    Bookham Technology SFP Optical Transceivers for 2.7Gb/s 180km DWDM Applications Original PDF 1.18MB 17