54112-811102500LF
|
|
Amphenol Communications Solutions
|
BergStikĀ®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch. |
|
|
10114828-11114LF
|
|
Amphenol Communications Solutions
|
1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions |
|
|
10114828-11113LF
|
|
Amphenol Communications Solutions
|
1.25mm Wire to Board Wafer,Vertical, Surface Mount, 13 Positions |
|
|
10114828-11102LF
|
|
Amphenol Communications Solutions
|
1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions |
|
|
10114828-11107LF
|
|
Amphenol Communications Solutions
|
1.25mm Wire to Board Wafer,Vertical, Surface Mount, 7 Positions |
|
|