INSTALLATION PRECAUTIONS LEAD FORMING AVOID BEND Search Results

Installation Precautions Lead Forming Avoid bend

Abstract: LA-301
Contextual Info: Installation Precautions 1. Lead Forming 1 Avoid bending the leads at the base and ensure that the leads are fixed in place. (2) Bend the leads at a point at least 2mm away from the base. (3) Form the leads before soldering. Bending tool Clinch the lead

DO48 diode

Abstract: GL6ZJ27
Contextual Info: PREPARED BY: DATE: /?7’ ZJ-dtx /t6 T. cleda ELECTRONIC COMPONENTS GROUP SHARP CORPORATION s PEC~CATION DEVICE SPECIFICATION 1 Opto-Electronic Devices Division FOR Light Emitting Diode MODEL No. I 1 GL6ZJ27 I 1. These specification sheets include materials protected under the copyright of Sharp Corporation “Sharp” .

GL5ZJ302BOS

Contextual Info: PREPARED BY: DATE: TTti / 6/?7 *_I;,* DATE: /I&/ 7-I LLdLl APPROVED BY: 97, ~E~TRONIC COMPONENTS GROUP SHARP CORPORATION SPEC~CATIO~J DEVICE SPECIFICATION 1 Opto-Electronic Devices Division FOR Light Emitting Diode MODEL No. GL5ZJ302BOS A 1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp” .

GL5ZJ43

Contextual Info: PREPARED BY: DATE: suln/tO/?q ruQ.ds. APPROVED BY: <J-un DATE: lik e5 .T qKJ7~s-e ELECTROMC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATION SPECNo. DG996036 ISSUE J&16/99 PAGE REPRESENTATIVE 10 pages DIVISION: Opto-Electronic Devices Division

A510c

Abstract: DG396 GL5ZR302BOS ix99
Contextual Info: PREPARED BY: T&n DATE: / c 6/ qY A 4Cl& APPROVED BY: J&l DATE: / /b/P9 ELECTRONIC HARP COMPONENTS GROUP CORPORATION SPECIFICATION mq&za DEVICE SPECIFICATION SPECNo. Ix5996031 ISSUE Jun/16/99 PAGE REPRESENTAlIVE 10 pages DIVISION: Opto-Ekctronic Devices Division

GL5ZV44

Contextual Info: PREPARED BY: DATE: /I6 /sq xm 7-a Usda APPROVED BY: DATE: 1 /t/ PS Ji”! FKL.,+ w ELECTRO~C coh4PONENTS GROUP . SHARP CORPORATION DEVICE SPECIFICATION DG99f5040 ISSUE J&16/99 PAGE REPRESENTATIVE 10 Pages DIVISION: Opto-Electronic Devices Division SPECIFICATION

GL6ZS27

Contextual Info: PREPARED BY: DATE: I 1 SPEC.No. ELECTRONIC COMPONENTS GROUP SHARPCORPORATION I SPiXIFICATION DEVICE SPECIFICATION Ix996047 Opto-Ekctronic Devices Division FOR Light Emitting Diode MODEL No. GL6ZS27 1 1. These specification sheets include materials protected under the copyright of Sharp Corporation “Sharp” .

GL5ZS44

Contextual Info: ELECTRONIC x ', / /d / $5 . I 777 .wrza* f COMPONENTS GROUP SHARPCORPORATION Opto-Electronic SPECIFICATION DEVICE SPECIFICATION Devices Division FOR Emitting Diode MODEL No. GL5ZS44 1. These specification sheets include materials protected under the copyright of Sharp Corporation “Sharp” .

GL5ZV43

Contextual Info: PREPARED BY: Ln DATE: /dJfS ‘ 7 IAh DATE: QtV’1, ti eds APPROVED BY: 37 ELECTRON-X COMPONENTS GROUP SHARP CORPORATION SPECIFICATION KLA3-E DEVICE SPECIFICATION 1 SPECNo. Do996034 ISSUE Jun/16/99 PAGE REPRESENTATIVE 10 pages Opto-Electronic Devices Division

Contextual Info: How To Handle Transistors Although SANYO makes ail possible efforts to assure quality and reliability in its development and production of transistor products, transistor reliability depends not only on the inherent factors in the transistors but also on the conditions under which the transistors are used. These

GL5ZS302BOS

Abstract: J100
Contextual Info: PREPARED BY: Lvl -7’- . tieda APPROVED BY: Jk 3-F SPECNo. DATE: DC396029 J&16/99 -WI DATE: / ,t/97 ELECTRONIC COMPONENTS GROUP SHARP CORPOFNI’ION SPlkIFICATION “LAS DEVICE SPECIFICATION : REPRESENTATIVE 10 Pages DIVISION: Opto-Electronic Devices Division

Contextual Info: How To Handle Transistors Although SAN YO makes all possible efforts to assure quality and reliability in its development and production of transistor products, transistor reliability depends not only on the inherent factors in the transistors but also on the

Ultrasonic humidifier circuit

Abstract: SHIP UNLOADER Ultrasonic humidifier ultrasonic humidifier driver circuit surge suppressor circuit Ultrasonic humidifier unit G746 MIL-P-28809 100MW QFN Shipping Trays
Contextual Info: HITACHI POWER SEMICONDUCTOR DEVICES No.IC-0601E Precautions for Use of Hitachi High-Voltage Monolithic ICs Be sure to read this information before use. Hitachi, Ltd. Power Systems Power & Industrial Systems Division Power Device Division Management Department

GL6ZR27

Contextual Info: PREPARED BY: DATE: S,m /16/4? I I -UAW30 ELECTRONIC a- COMFWENTS LUKruKn lx994049 GROUP 1 lUl-4 Opto-Electronic SPiKIFICATION DEVICE SPECIFICATION SPEC.No. Devices Division FOR Light Emitting Diode MODEL No. GL6ZR27 1. These specification sheets include materials protected under the copyright of Sharp Corporation “Sharp” .

Handling Instructions

Abstract: 80060
Contextual Info: Handling Instructions Vishay Semiconductors Handling Instructions PROTECTION DAMAGE AGAINST ELECTROSTATIC Although electrostatic breakdown is most often associated with IC semiconductor devices, optoelectronic devices are also prone to electrostatic damage. Miniaturized and highly

Contextual Info: VISHAY Vishay Semiconductors Handling Instructions Protection against Electrostatic Damage Although electrostatic breakdown is most often associated with IC semiconductor devices, optoelectronic devices are also prone to electrostatic damage. Miniaturized and highly integrated components are particularly sensitive.

GL6ZV27

Contextual Info: PREPARED BY: I I DATE: Sdt3 I &M Jti‘, DATE: / /Myy 7 (/Ledc APPROVED BY: SPECNo. Ix996046 ISSUE hut/l 6/99 ELECTRO~c CObiPONENTS GROUP SHARP CORPORATION SPECIJWATION 33’ J L&S& DEVICE SPECIFICATION FOR Light Emitting Diode MODEL No. \ GL6ZV27 1. Thesespecificationsheetsinclude materialsprotectedunderthe copyright of SharpCorporation (“Sharp” .

EN100015

Abstract: Photointerrupter metal CECC00802
Contextual Info: Vishay Semiconductors Assembly Instructions General Soldering Instructions Optoelectronic semiconductor devices can be mounted in any position. Connection wires may be bent provided the bend is not less than 1.5 mm from the bottom of the case. During bending, no forces must

SES5401C-SES5404C

Abstract: SES5403C
Contextual Info: UNITRODE CORP 9347963 DÌT| ^ 3 4 7 ^ 3 UNITRODË"CORP 920 RECTIFIERS D O l C H â 1» 1 ° 9 8 t- z C 7 SES5401C-SES5404C High Efficiency, 16A Center-Tap FEATURES • Low Forward Voltage • Fast Recovery Tim es « Economical, Convenient TO-220AB Package

Contextual Info: UNITRODE CORP 9347963 TB UNITRODE DE | T 3 4 O D l l O b T 92D CORP 11069 DUAL POWER SCHOTTKY RECTIFIERS 12A Av, up to 45V T -03-11 FEATURES • Very Low Forward Voltage • Reverse Transient Capability • Economical Convenient Plastic Package • Mechanically Rugged

GL5ZJ44

Abstract: diode LT6
Contextual Info: PREPARED BY: Ln 7-t uedl APPROVED BY: F SPEC.No. DATE: lt6/4Y DATE: ‘T qkc / /t/sf s#@#ARp J&16/99 i ISSUE ELECTRONIC COMPONENTS GROUP SHARP coRPORATION PAGE 10 Pages REPRESENTATIVE DIVISIOON: Opto-Electronic Devices Division SPECIFICATION sd.A* DG996042

TO-126LP

Contextual Info: Precautions when handling transistors 1. Lead forming and cutting Sanyo transistor products are available in a range of lead configurations and lengths. As required, however, you can form or cut package leads to meet the needs of specific applications. As a general precaution, you should always handle

MDST3

Abstract: plastic capacitors RCR-2350C
Contextual Info: NOTABILIA FOR USE OF FILM CAPACITORS Make sure as follows before use to ensure the safety. ・Make sure to require our specifications before use and if you have any further questions or concerns, please contact us. Confirm your use condition that is within our specifications and this notabilia in use.

US0735

Abstract: USD720 USD745c usd740 unitrode
Contextual Info: U NI T R OD E TBMTTfciB QQ11D71 b CORP 9347963 UN IT ROD E CORP 92D 11071 POWER SCHOTTKY RECTIFIERS ^ 1 3 n 16A Pk, up to 45V USD720 USD735 USD740 USD745 FEATURES DESCRIPTION • • • • • The USD700 series of Schottky power rectifiers is ideally suited for output