JEDEC BOTTOM Search Results

18013

Contextual Info: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

SMD Packages

Contextual Info: IPC/JEDEC J-STD-033A July 2002 Supersedes IPC/JEDEC J-STD-033 April 1999 JOINT INDUSTRY STANDARD Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of

1109814

Contextual Info: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

Reflow

Abstract: JEDEC J-STD-020d.1 JEP-140 JEP140 J-STD-035 JESD22-B112 JEDEC J-STD-020d JESD47 JESD22-B108 IPC-020d-5-1
Contextual Info: IPC/JEDEC J-STD-020D.1 March 2008 Supersedes IPC/JEDEC J-STD-020D August 2007 JOINT INDUSTRY STANDARD Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices Notice IPC and JEDEC Standards and Publications are designed to serve the public

IC 290 8pin

Abstract: C17200
Contextual Info: P/Ns 1109522 and 1109523 DIP-to-JEDEC TO Adapter Socket FEATURES • 8-pin DIP IC Socket on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. ICs now available only in 8-pin DIPs can be readily-mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board.

Contextual Info: P/Ns 1109522 and 1109523 DIP-to-JEDEC TO Adapter Socket FEATURES • 8-pin DIP IC Socket on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. ICs now available only in 8-pin DIPs can be readily-mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board.

Contextual Info: RoHs/WEEE-Compliant SOIC-to-JEDEC TO Adapter FEATURES • Pb-Free RoHs/WEEE-compliant • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

18012

Contextual Info: P/Ns 1109522 and 1109523 DIP-to-JEDEC TO Adapter Socket FEATURES • 8-pin DIP IC Socket on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. ICs now available only in 8-pin DIPs can be readily-mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board.

IPC 4101A

Abstract: IS410 4101A
Contextual Info: RoHs/WEEE-Compliant SOIC-to-JEDEC TO Adapter FEATURES • Pb-Free RoHs/WEEE-compliant • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

AS4C32M16D2

Contextual Info: AS4C32M16D2 512M 32M x 16 bit DDRII Synchronous DRAM (SDRAM) Confidential Advanced (Rev. 1.1, Feb. /2013) Features Overview • JEDEC Standard Compliant  JEDEC standard 1.8V I/O (SSTL_18-compatible)  Power supplies: VDD & VDDQ = +1.8V  0.1V  Supports JEDEC clock jitter specification

Contextual Info: AS4C32M16D2 512M 32M x 16 bit DDRII Synchronous DRAM (SDRAM) Confidential Advanced (Rev. 1.1, Feb. /2013) Features Overview • JEDEC Standard Compliant  JEDEC standard 1.8V I/O (SSTL_18-compatible)  Power supplies: VDD & VDDQ = +1.8V  0.1V  Supports JEDEC clock jitter specification

MS-010

Contextual Info: JEDEC Publication No. 95 Page _ JEDEC Publication No. 95 Page _ SECTION Z - Z DATUM - A - (DATUM — A - ) EVEN NUMBER LEADS (DIMENSIONS IN INCHES) JEDEC SOUD STATE PRODUCT OUTLINES ODD NUMBER LEADS DETAIL A TITLE dual in lin e PLASTIC FAMILY (R -P D IP -T )

PLCC 44 socket layout

Contextual Info: Designed standard JEDEC type “A” PLCC packages PLASTIC LEADED CHIP CARRIER SOCKET PCC05 SERIES G-7 PCC05 SERIES PLCC SOCKET FEATURES For standard JEDEC type "A" PLCC packages Low profile/Compact design Closed bottom design controls solder and flux wicking

jedec ms-024

Abstract: MS-024 368S MS 024
Contextual Info: ZD SEATING PLANE 7 b|)~i)~y~Lrn=n= injnj~y~y~y~y~u^ A ' I [B aaa C A B AA L (N5X) 0.10 c PATENT PENDING JEDEC THIS STANDARD OUTLINE HAS BEEN PREPARED BY JEDEC JC-11 COMMITTEE SOLID STATE PRODUCT AND APPROVED BY THE JEDEC COUNCIL AND REFLECTS A PRODUCT WITH WIDE

12N6LE

Abstract: 12n06rle 12N6L AN9321 AN9322 RFD12N06RLE RFD12N06RLESM RFD12N06RLESM9A RFP12N06RLE TB334
Contextual Info: RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE Data Sheet January 2002 17A, 60V, 0.071 Ohm, N-Channel, Logic Level UltraFET Power MOSFET Packaging Features JEDEC TO-251AA JEDEC TO-252AA SOURCE DRAIN GATE DRAIN FLANGE DRAIN (FLANGE) GATE SOURCE RFD12N06RLE RFD12N06RLESM

AN9321

Abstract: AN9322 HUF76423D3 HUF76423D3S HUF76423D3ST TB334 76423D
Contextual Info: HUF76423D3, HUF76423D3S Data Sheet December 2001 20A, 60V, 0.037 Ohm, N-Channel, Logic Level UltraFET Power MOSFETFairchild Packaging JEDEC TO-251AA DRAIN FLANGE JEDEC TO-252AA DRAIN (FLANGE) SOURCE DRAIN GATE GATE SOURCE HUF76423D3S HUF76423D3 Features

HUFA75623P3

Abstract: 11A ABS AN9321 HUFA75623S3ST TB334
Contextual Info: HUFA75623P3, HUFA75623S3ST Data Sheet November 2000 File Number 4957 22A, 100V, 0.064 Ohm, N-Channel, UltraFET Power MOSFETs Packaging JEDEC TO-220AB JEDEC TO-263AB SOURCE DRAIN GATE DRAIN FLANGE GATE SOURCE DRAIN (FLANGE) HUFA75623P3 HUFA75623S3ST Features

75645P

Abstract: 75645s mosfet 75645p HUFA75645P3 HUFA75645S3S HUFA75645S3ST TB334
Contextual Info: HUFA75645P3, HUFA75645S3S Data Sheet November 2000 File Number 4963 75A, 100V, 0.014 Ohm, N-Channel, UltraFET Power MOSFETs Packaging JEDEC TO-220AB JEDEC TO-263AB Features DRAIN FLANGE SOURCE DRAIN GATE GATE SOURCE DRAIN (FLANGE) HUFA75645P3 HUFA75645S3S

AN9321

Abstract: HUFA75617D3 HUFA75617D3S HUFA75617D3ST TB334
Contextual Info: HUFA75617D3, HUFA75617D3S Data Sheet November 2000 File Number 4956 16A, 100V, 0.090 Ohm, N-Channel, UltraFET Power MOSFETs Packaging JEDEC TO-251AA JEDEC TO-252AA SOURCE DRAIN GATE DRAIN FLANGE GATE SOURCE DRAIN (FLANGE) HUFA75617D3S HUFA75617D3 Features

AN7254

Abstract: AN7260 AN9321 AN9322 HUF75925D3ST HUF75925P3 TB334
Contextual Info: HUF75925P3, HUF75925D3ST Data Sheet December 2000 File Number 5007 11A, 200V, 0.275 Ohm, N-Channel, UltraFET Power MOSFETs Packaging Features JEDEC TO-220AB JEDEC TO-252AA SOURCE DRAIN GATE DRAIN FLANGE GATE SOURCE DRAIN (FLANGE) HUF75925P3 HUF75925D3ST

HUF75829D3S

Abstract: AN9321 AN9322 HUF75829D3 HUF75829D3ST TB334
Contextual Info: HUF75829D3, HUF75829D3S Data Sheet February 2000 File Number 4795.1 18A, 150V, 0.110 Ohm, N-Channel, UltraFET Power MOSFET Packaging JEDEC TO-251AA JEDEC TO-252AA Features DRAIN FLANGE SOURCE DRAIN GATE GATE SOURCE DRAIN (FLANGE) HUF75829D3S HUF75829D3

HUF75842P3

Abstract: HUF75842S3S HUF75842S3ST TB334 75842P 75842S
Contextual Info: HUF75842P3, HUF75842S3S Data Sheet December 2000 File Number 4815.1 43A, 150V, 0.042 Ohm, N-Channel, UltraFET Power MOSFET Packaging JEDEC TO-220AB JEDEC TO-263AB Features DRAIN FLANGE SOURCE DRAIN GATE GATE SOURCE DRAIN (FLANGE) HUF75842P3 HUF75842S3S

AN9321

Abstract: HUFA75829D3 HUFA75829D3S HUFA75829D3ST TB334
Contextual Info: HUFA75829D3, HUFA75829D3S Data Sheet November 2000 File Number 4966 18A, 150V, 0.110 Ohm, N-Channel, UltraFET Power MOSFETs Packaging JEDEC TO-251AA JEDEC TO-252AA Features DRAIN FLANGE SOURCE DRAIN GATE GATE SOURCE DRAIN (FLANGE) HUFA75829D3S HUFA75829D3

Contextual Info: HUF76407D3, HUF76407D3S Data Sheet December 2001 11A, 60V, 0.107 Ohm, N-Channel, Logic Level UltraFET Power MOSFET Packaging JEDEC TO-251AA DRAIN FLANGE JEDEC TO-252AA DRAIN (FLANGE) SOURCE DRAIN GATE GATE SOURCE HUF76407D3S HUF76407D3 Symbol Features