JEDEC DRAWING MO-220 QFN Search Results

Contextual Info: UM3699 Dual DPDT Ultra-Low RON Analog Switch UM3699 QFN16 3x3 General Description The UM3699 is a dual independent ultra low RON DPDT analog switch. This device is designed for low operating voltage, high current switching of speaker output for cell phone applications. It can

phone speaker

Contextual Info: UM3699 Dual DPDT Ultra-Low RON Analog Switch UM3699 QFN16 3x3 General Description The UM3699 is a dual independent ultra low RON DPDT analog switch. This device is designed for low operating voltage, high current switching of speaker output for cell phone applications. It can

TSSOP-20

Abstract: EL1503C EL1508C THS6182
Contextual Info: THS6182 www.ti.com SLLS544 – SEPTEMBER 2002 LOW POWER DISSIPATION ADSL LINE DRIVER FEATURES D Low Power Dissipation Increases ADSL Line D D D D D D D D Card Density Low THD of –88 dBc 100-Ω, 1 MHz Low MTPR Driving +20 dBm on the Line – –76 dBc With High Bias Setting

Contextual Info: CHA4107-QDG RoHS COMPLIANT C-band Medium Power Amplifier GaAs Monolithic Microwave IC in SMD leadless package Description The CHA4107-QDG is a monolithic two-stage GaAs medium power amplifier designed for C-band applications. The MPA provides typically 25.5 dBm output

Contextual Info: CHA4107-QDG RoHS COMPLIANT C-band Medium Power Amplifier GaAs Monolithic Microwave IC in SMD leadless package Description The CHA4107-QDG is a monolithic two-stage GaAs medium power amplifier designed for C-band applications. The MPA provides typically 25.5 dBm output

RGT-16

Abstract: IEC-61000-4-2 TSSOP16 TUSB1105 TUSB1106 s-pqfp-n16
Contextual Info: TUSB1105, TUSB1106 ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVERS www.ti.com SCAS818A – MAY 2006 – REVISED JULY 2006 FEATURES • • • • • • • Comply With Universal Serial Bus Specification Rev. 2.0 Transmit and Receive Serial Data at Both Full-Speed 12-Mbit/s and Low-Speed

LE79Q2281

Abstract: 1N6761-1 2N2369AU 2N2907AUB BR17 datasheet transistor SI 6822 Dimming LED aplications Dimming LED Driver aplications GC4600 IC ZL70572
Contextual Info: Product Portfolio 2013-2014 ng-edge Embed Power Matters. About Microsemi Microsemi Corporation is a leading provider of semiconductor solutions differentiated by power, security, reliability and performance. The company concentrates on providing solutions for applications where power matters, security

Contextual Info: CHA3688aQDG RoHS COMPLIANT 12.5-30GHz Low Noise Amplifier GaAs Monolithic Microwave IC in SMD leadless package Description The CHA3688aQDG is a three-stage self-biased wide band monolithic low noise amplifier monolithic circuit. The circuit is manufactured with a pHEMT

5962-94758

Abstract: em 242 stepper 12V SM 39 Z 2 STEPPER MOTOR 5962-1320101KXC RTAX2000 UT16AD40P GR712RC Metelics 2006 catalog RHD5932 stepper motor em 242
Contextual Info: A passion for performance. Aeroflex Microelectronic Solutions Digital, Analog, Power, RFMW, Motion…Solutions for HiRel Applications Product Short Form January 2014 Aeroflex Microelectronic Solutions Product Short Form Aeroflex Microelectronic Solutions – Colorado Springs, Gaisler, Microwave Filter Components,

UT16AD40P

Abstract: RHD5932 RHD5930
Contextual Info: A passion for performance. Aeroflex Microelectronic Solutions Digital, Analog, Power, RFMW, Motion…Solutions for HiRel Applications Product Short Form January 2014 Aeroflex Microelectronic Solutions Product Short Form Aeroflex Microelectronic Solutions – Colorado Springs, Gaisler, Microwave Filter Components,

GR712RC

Abstract: UT700 melf ZENER diode COLOR CODE 5962R102 smd zener diode color code UT8QNF8M HDMI verilog BCH RTAX2000 UT54ACS164245 "HARMONIC DRIVE"
Contextual Info: A passion for performance. Aeroflex Microelectronic Solutions Digital, Analog, Power, RFMW, Motion…Solutions for HiRel Applications Product Short Form December 2012 Aeroflex Microelectronic Solutions Product Short Form Aeroflex Microelectronic Solutions is comprised of ten divisions – Colorado Springs, Gaisler, Motion

QFN-48 LAND PATTERN

Abstract: QFN PACKAGE thermal resistance QFN-48 footprint qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo FOOTPRINT PCB qfn 48 7x7 stencil AN5060
Contextual Info: Optimum PCB and Stencil Layout for WirelessUSB QFN Package Introduction When designing a system board using the WirelessUSB™ LS/LR QFN chip for wireless product applications, there are several important factors to consider. It is advised to pay critical attention to PCB design and assembly aspects when

ADS7846

Abstract: ADS7846 driver
Contextual Info: ADS7846 ADS7 846 AD S 7846 ® ADS7 846 ® SBAS125F – SEPTEMBER 1999 – REVISED MARCH 2003 TOUCH SCREEN CONTROLLER FEATURES DESCRIPTION ● SAME PINOUT AS ADS7843 The ADS7846 is a next-generation version to the industry standard ADS7843 4-wire touch screen controller. The

TPS74401

Contextual Info: TPS74401 www.ti.com SBVS066B – DECEMBER 2005 – REVISED MAY 2006 3.0A UltraLow-Dropout Linear Regulator • • • • • • • • • • DESCRIPTION Soft-Start SS Pin Provides a Linear Startup with Ramp Time Set by External Capacitor 1% Accuracy Over Line, Load, and

CC430F6137

Abstract: SLAS554F
Contextual Info: ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F – MAY 2009 – REVISED DECEMBER 2011 www.ti.com MSP430 SoC with RF Core FEATURES 1 • 23 • • • True System-on-Chip SoC for Low-Power Wireless Communication Applications

SLAS554F

Abstract: SLAS554 5E002 01a26 Nearson SLAU259 MAX812 lcd 1x16 green OOK ASK receiver 433mhz 433MHz Active RFID tag
Contextual Info: ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F – MAY 2009 – REVISED DECEMBER 2011 www.ti.com MSP430 SoC with RF Core FEATURES 1 • 23 • • • True System-on-Chip SoC for Low-Power Wireless Communication Applications

Contextual Info: ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F – MAY 2009 – REVISED DECEMBER 2011 www.ti.com MSP430 SoC with RF Core FEATURES 1 • 23 • • • True System-on-Chip SoC for Low-Power Wireless Communication Applications

Contextual Info: ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554E – MAY 2009 – REVISED NOVEMBER 2010 www.ti.com MSP430 SoC with RF Core FEATURES 1 • 23 • • • True System-on-Chip SoC for Low-Power Wireless Communication Applications

I2C11

Abstract: DSA0080050
Contextual Info: ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554E – MAY 2009 – REVISED NOVEMBER 2010 www.ti.com MSP430 SoC with RF Core FEATURES 1 • • • • True System-on-Chip SoC for Low-Power Wireless Communication Applications

SLAS554E

Abstract: 1X16 lcd 433MHz Active RFID tag SLAS554 CC1101-based ADC12 CC1101 CC430F6137 MSP430 VCO 5GHz
Contextual Info: ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554E – MAY 2009 – REVISED NOVEMBER 2010 www.ti.com MSP430 SoC with RF Core FEATURES 1 • • • • True System-on-Chip SoC for Low-Power Wireless Communication Applications

SLAS554

Abstract: CC430F5137IRGZ CC11xx
Contextual Info: ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x www.ti.com SLAS554G – MAY 2009 – REVISED FEBRUARY 2013 MSP430 SoC with RF Core FEATURES 1 • 23 • • • True System-on-Chip SoC for Low-Power Wireless Communication Applications

SLAS554F

Abstract: VCO 5GHz SLAU259 RX 433 389MHZ lcd 1x16 green SLAU278 CC1101-based radio module ECCN wafer SLAS554E
Contextual Info: ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F – MAY 2009 – REVISED DECEMBER 2011 www.ti.com MSP430 SoC with RF Core FEATURES 1 • 23 • • • True System-on-Chip SoC for Low-Power Wireless Communication Applications

TLO 721

Abstract: CC430F6137 S11x cc1101, PA SLAS554G ADC12A Master Selection Guide
Contextual Info: ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x www.ti.com SLAS554G – MAY 2009 – REVISED FEBRUARY 2013 MSP430 SoC with RF Core FEATURES 1 • 23 • • • True System-on-Chip SoC for Low-Power Wireless Communication Applications

Contextual Info: ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F – MAY 2009 – REVISED DECEMBER 2011 www.ti.com MSP430 SoC with RF Core FEATURES 1 • 23 • • • True System-on-Chip SoC for Low-Power Wireless Communication Applications