JEDEC FBGA 11 Search Results

MO-205

Abstract: TAPE AND REEL BGA 54-BALL
Contextual Info: Revised May 2001 BGA Tape and Reel Specifications Tape and Reel Quantities Package Code GX Package Description Package Drawing Number Tape and Reel Container Quantity 54-Ball Fine-Pitch Ball Grid Array FBGA , JEDEC MO-205, 5.5mm Wide BGA54A 2500 96-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide

K4W1G1646D-EC15

Abstract: K4W1G1646D-EJ11 K4W1G1646D-EC gDDR3-1800 DDR3 DIMM 240 pinout GDDR3 SDRAM 256Mb JESD51-2 VIH150 SAMSUNG GDDR3 K4W1G1646D
Contextual Info: 1Gb gDDR3 SDRAM K4W1G1646D 1Gb gDDR3 SGRAM D-die 100 FBGA with Lead-Free & Halogen-Free RoHS Compliant CAUTION : * This document includes some items still under discussion in JEDEC. * Therefore, those may be changed without pre-notice based on JEDEC progress.

K4W1G1646E

Abstract: samsung K4W1G1646E-HC11
Contextual Info: 1Gb gDDR3 SDRAM K4W1G1646E 1Gb gDDR3 SDRAM E-die 96 FBGA with Lead-Free & Halogen-Free RoHS Compliant CAUTION : * This document includes some items still under discussion in JEDEC. * Therefore, those may be changed without pre-notice based on JEDEC progress.

K4W1G1646D-EC15

Abstract: K4W1G1646D
Contextual Info: 1Gb gDDR3 SDRAM K4W1G1646D 1Gb gDDR3 SGRAM D-die 100 FBGA with Lead-Free & Halogen-Free RoHS Compliant CAUTION : * This document includes some items still under discussion in JEDEC. * Therefore, those may be changed without pre-notice based on JEDEC progress.

k4b1g1646

Abstract: k4b1g08 samsung ddr3 DDR3-1066 JESD79-3B
Contextual Info: 1Gb DDR3 SDRAM K4B1G04 08/16 46D 1Gb D-die DDR3 SDRAM Specification 82 / 100 FBGA with Lead-Free & Halogen-Free (RoHS Compliant) CAUTION : * This document includes some items still under discussion in JEDEC. * Therefore, those may be changed without pre-notice based on JEDEC progress.

samsung ddr3

Abstract: DDR3 DIMM 240 pinout DDR3-1066 DDR3-1333 K4B1G16 Design Guide for DDR3-1066 k4b1g08 K4B1G0846D K4B1G0446D DDR3-800-666
Contextual Info: 1Gb DDR3 SDRAM K4B1G04 08/16 46D 1Gb D-die DDR3 SDRAM Specification 82 / 100 FBGA with Pb-free & Halogen-Free (RoHS Compliant) CAUTION : * This document includes some items still under discussion in JEDEC. * Therefore, those may be changed without pre-notice based on JEDEC progress.

K4B2G1646B-HCH9

Abstract: "2Gb DDR3 SDRAM" k4B2G1646 k4b2g1646b 128mx16 ddr3 K4B2G0846B-HCH9 samsung DDR3 SDRAM 2GB K4B2G16 DDR3 DRAM 2GB 128Mx16 96BALL FBGA K4B2G0846B-HCF7
Contextual Info: 2Gb DDR3 SDRAM K4B2G04 08/16 46B 2Gb B-die DDR3 SDRAM Specification 78 / 96 FBGA with Lead-Free & Halogen-Free (RoHS Compliant) CAUTION : * This document includes some items still under discussion in JEDEC. * Therefore, those may be changed without pre-notice based on JEDEC progress.

Contextual Info: 1Gb DDR3 SDRAM K4B1G04 08/16 46D 1Gb D-die DDR3 SDRAM Specification 82 / 100 FBGA with Pb-free & Halogen-Free (RoHS Compliant) CAUTION : * This document includes some items still under discussion in JEDEC. * Therefore, those may be changed without pre-notice based on JEDEC progress.

Contextual Info: V826765G24SA 1GB 200-PIN DDR UNBUFFERED SODIMM 128M x 64 Features Description • JEDEC 200 Pin DDR Unbuffered Small-Outline, Dual In-Line memory module SODIMM ; 134,217,728 x 64 bit organization. ■ Utilizes High Performance 64M x 8 DDR SDRAM in FBGA Packages

Contextual Info: V826765G24SB 1GB 200-PIN DDR UNBUFFERED SODIMM 128M x 64 Features Description • JEDEC 200 Pin DDR Unbuffered Small-Outline, Dual In-Line memory module SODIMM ; 134,217,728 x 64 bit organization. ■ Utilizes High Performance 64M x 8 DDR SDRAM in FBGA Packages

ddr4

Contextual Info: V826765G24SB 1GB 200-PIN DDR UNBUFFERED SODIMM 128M x 64 Features Description • JEDEC 200 Pin DDR Unbuffered Small-Outline, Dual In-Line memory module SODIMM ; 134,217,728 x 64 bit organization. ■ Utilizes High Performance 64M x 8 DDR SDRAM in FBGA Packages

Contextual Info: V826765G24SA 1GB 200-PIN DDR UNBUFFERED SODIMM 128M x 64 Features Description • JEDEC 200 Pin DDR Unbuffered Small-Outline, Dual In-Line memory module SODIMM ; 134,217,728 x 64 bit organization. ■ Utilizes High Performance 64M x 8 DDR SDRAM in FBGA Packages

S144

Abstract: S144S1-YKC JEDEC FBGA 11
Contextual Info: Mounting Pad Packing JEDEC Tray Name FBGA 13x13×1.46 144 pin FBGA 13 × 13 A W S B B B 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A C D P NM L K J HG F E DC B A P Index mark Q W S A J I Y1 S H R S K S E F φM L M G S A B NOTES 1. Controlling dimension millimeter.

DRAM 2164

Abstract: 168-PIN MT36LSDF6472G-13E PC133 registered reference design
Contextual Info: 512MB/1GB x72, ECC 168-PIN REGISTERED FBGA SDRAM DIMM SYNCHRONOUS DRAM MODULE MT36LSDF6472G - 512MB MT36LSDF12872G - 1GB For the latest data sheet, please refer to the Micron Web site: www.micron.com/datasheets FEATURES 168-Pin DIMM • JEDEC-standard, 168-pin, dual in-line memory

Contextual Info: 512MB/1GB x72, ECC 168-PIN REGISTERED FBGA SDRAM DIMM SYNCHRONOUS DRAM MODULE MT36LSDF6472G - 512MB MT36LSDF12872G - 1GB For the latest data sheet, please refer to the Micron Web site: www.micron.com/datasheets FEATURES 168-Pin DIMM • JEDEC-standard, 168-pin, dual in-line memory

PC133 registered reference design

Contextual Info: ADVANCE 64 MEG x 72 REGISTERED FBGA SDRAM DIMM SYNCHRONOUS DRAM MODULE MT36LSDF6472 For the latest data sheet, please refer to the Micron Web site: www.micron.com/mti/msp/html/datasheet.html PIN ASSIGNMENT Front View 168-Pin DIMM FEATURES • JEDEC-standard, 168-pin, dual in-line memory

transistor r 606 j

Abstract: f 630
Contextual Info: Packing JEDEC Tray Name FBGA 16x16×1.26 224 pin FBGA 16 × 16 A W S B B B 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A C D V U T R P NM L K J HG F E D C B A P Index mark Q W S A J I R H S K F S L E φM M G S A B NOTES 1. Controlling dimension millimeter.

Contextual Info: Mounting Pad Packing JEDEC Tray Name FBGA 15x15×1.46 176 pin FBGA 15 × 15 A W S B B B 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A C D U T RP NM L K J H G F E D C B A P Index mark Q W S A J I Y1 S H R S K S F L E φM M G S A B NOTES 1. Controlling dimension

Contextual Info: PRELIMINARY‡ 512MB/1GB x72, ECC 168-PIN REGISTERED FBGA SDRAM DIMM SYNCHRONOUS DRAM MODULE MT36LSDF6472G - 512MB MT36LSDF12872G - 1GB For the latest data sheet, please refer to the Micron Web site: www.micron.com/datasheets FEATURES 168-Pin DIMM • JEDEC-standard, 168-pin, dual in-line memory

transistor 6c

Abstract: 6c s transistor y1
Contextual Info: Mounting Pad Packing JEDEC Tray Name FBGA 19x19×1.46 304 pin FBGA 19 × 19 A W S B B B 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A C D AA W U R N L J G E C A AB Y V T P M K H F D B P Index mark Q W S A J I Y1 S H R S K S F L E φM M G S A B

b 108 b

Contextual Info: Mounting Pad Packing JEDEC Tray Name FBGA 11x11×1.46 108 pin FBGA 11 × 11 A W S B B B 12 11 10 9 8 7 6 5 4 3 2 1 A C D M L K J H G F E D C B A P Index mark Q W S A J I Y1 S H R S K S E F φM L M G S A B NOTES 1. Controlling dimension millimeter. 2. Each ball centerline is located within φ 0.08 mm of

MO-205

Contextual Info: Revised June 2001 BGA114A 114-Ball Fine-Pitch Ball Grid Array FBGA , JEDEC MO-205, 5.5mm Wide Package Number BGA114A Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.

KVR667D2

Abstract: SCK 102
Contextual Info: Memory Module Specifications KVR667D2S4F5/2G 2GB 256M x 72-Bit PC2-5300 CL5 ECC 240-Pin FBDIMM DESCRIPTION This document describes ValueRAM’s 2GB 256M x 72-bit SPECIFICATIONS • FBDIMM Module 240-pin · JEDEC Standard R/C H eighteen 256M x 4-bit 667MHz DDR2 FBGA components.

DDR2 DIMM 240 pinout

Abstract: 1G DDR2 667 DDR DIMM SPD JEDEC KVR667D2S8F5
Contextual Info: Memory Module Specifications KVR667D2S8F5/1G 1GB 128M x 72-Bit PC2-5300 CL5 ECC 240-Pin FBDIMM DESCRIPTION SPECIFICATIONS This document describes ValueRAM’s 1GB 128M x 72-bit FBDIMM Module 240-pin JEDEC Standard R/C A nine 128M x 8-bit 667MHz DDR2 FBGA components. The mod-