JEDEC MO-142 FOOTPRINT Search Results

Q65110A9228

Contextual Info: FIREFLY 0402 Hyper-Bright LED Lead Pb Free Product - RoHS Compliant LB VH9G, LT VH9G Vorläufige Daten / Preliminary Data Besondere Merkmale Features • Gehäusetyp: SMT Gehäuse, Standard SMT Footprint 0402, farbloser diffuser Verguss • Besonderheit des Bauteils: kompakte

LTQH9G

Contextual Info: CHIPLED 0402 Hyper-Bright LED Lead Pb Free Product - RoHS Compliant LB QH9G, LT QH9G Besondere Merkmale Features • Gehäusetyp: SMT Gehäuse, Standard SMT Footprint 0402, farbloser diffuser Verguss • Besonderheit des Bauteils: kompakte Bauform; 1,0 x 0,55 x 0,35 mm (LxBxH)

Q65110A9228

Contextual Info: FIREFLY 0402 Hyper-Bright LED Lead Pb Free Product - RoHS Compliant LB VH9G, LT VH9G Vorläufige Daten / Preliminary Data Besondere Merkmale Features • Gehäusetyp: SMT Gehäuse, Standard SMT Footprint 0402, farbloser diffuser Verguss • Besonderheit des Bauteils: kompakte

LTQH9G

Abstract: QH9G-Q2S2-35-1 LT QH9G-Q2S2-25-2Z4Y
Contextual Info: CHIPLED 0402 Hyper-Bright LED Lead Pb Free Product - RoHS Compliant LB QH9G, LT QH9G Besondere Merkmale Features • Gehäusetyp: SMT Gehäuse, Standard SMT Footprint 0402, farbloser diffuser Verguss • Besonderheit des Bauteils: kompakte Bauform; 1,0 x 0,55 x 0,35 mm (LxBxH)

Contextual Info: FIREFLY 0402 Hyper-Bright LED Lead Pb Free Product - RoHS Compliant LB VH9G, LT VH9G Released Besondere Merkmale Features • Gehäusetyp: SMT Gehäuse, Standard SMT Footprint 0402, farbloser diffuser Verguss • Besonderheit des Bauteils: kompakte Bauform mit seitlicher Abstahlrichtung

LT VH9G-Q2S2-35-R18

Abstract: Ltvh9g
Contextual Info: FIREFLY 0402 Hyper-Bright LED Lead Pb Free Product - RoHS Compliant LB VH9G, LT VH9G Released Besondere Merkmale Features • Gehäusetyp: SMT Gehäuse, Standard SMT Footprint 0402, farbloser diffuser Verguss • Besonderheit des Bauteils: kompakte Bauform mit seitlicher Abstahlrichtung

Contextual Info: CHIPLED 0402 Hyper-Bright LED Lead Pb Free Product - RoHS Compliant LB QH9G, LT QH9G Besondere Merkmale Features • Gehäusetyp: SMT Gehäuse, Standard SMT Footprint 0402, farbloser diffuser Verguss • Besonderheit des Bauteils: kompakte Bauform; 1,0 x 0,55 x 0,35 mm (LxBxH)

LTQH9G

Abstract: Q65110A9219
Contextual Info: CHIPLED 0402 Hyper-Bright LED Lead Pb Free Product - RoHS Compliant LB QH9G, LT QH9G Besondere Merkmale Features • Gehäusetyp: SMT Gehäuse, Standard SMT Footprint 0402, farbloser diffuser Verguss • Besonderheit des Bauteils: kompakte Bauform; 1,0 x 0,55 x 0,35 mm (LxBxH)

FEPROM

Abstract: YL41 10B60 LM 10841 7v71 10B28 U131-1-2
Contextual Info: PRELIM INARY VF1 FPGA Family B EY O N D P ER F O R M A N C E FEATURES AND BENEFITS ♦ The industry’s first Variable-Grain-Architecture enables high-density, high-performance designs for a wide range of applications — Architecture adapts to logic to enable synthesis-friendly, high-performance designs

Contextual Info: CHA3688aQDG RoHS COMPLIANT 12.5-30GHz Low Noise Amplifier GaAs Monolithic Microwave IC in SMD leadless package Description The CHA3688aQDG is a three-stage self-biased wide band monolithic low noise amplifier monolithic circuit. The circuit is manufactured with a pHEMT

el 847

Abstract: smd schottky diode s4 85a Diode smd s6 85a marking CODE R SMD DIODE SMB J 36 CA fast recovery diode t3d 54 fast recovery diode t3d 67 IR2113 FULL BRIDGE smd diode code k34 smd diode schottky code marking SJ diode smd marking code M12
Contextual Info: I I n t e r n a t io n a l Rec tifie r Case Outlines Bridges 140 0311} 110 0311) B1 (0.212) ¡Ö24Öj 113(0 ttO) 7 IIP » ) S.MfO.217) UO0.1M) 110(001* Case style D-70 B2 «400 Ml) I.W JIH 140(0 252) 0 30*012) 11.20(0441) • to (0.240) 3 W (P 1 2 2 ) I I— j

Contextual Info: Data Sheet 200-pin DDR SDRAM Modules Kodiak4 Rev.1.1 18.07.2006 – Professional Line SO-DIMM 1GB DDR PC 3200 / 2700 / 2100 in COB Technique – RoHS complaint Options: Grade C Grade E Grade I Grade W 0°C to +70°C 0°C to +85°C -25°C to +85°C -40°C to +85°C

Contextual Info: Data Sheet 200-pin DDR SDRAM Modules Kodiak4 Rev.1.1 18.07.2006 – Professional Line SO-DIMM 512MB DDR PC 3200 / 2700 / 2100 in COB Technique – RoHS complaint Options: Grade C Grade E Grade I Grade W 0°C to +70°C 0°C to +85°C -25°C to +85°C -40°C to +85°C

H5DU5162

Contextual Info: Data Sheet Rev.1.1 09.06.2010 256MB DDR – SDRAM SoDIMM 200PIN SoDIMM Features: SDN03264C1CE1HY-50R 256MB PC-3200 in FBGA Technique RoHS compliant Options: • Frequency / Latency DDR 400 MHz CL3 DDR 333 MHz CL2.5 • Module densities 256MB with 4 dies and 1 rank

MT46V32M16P

Contextual Info: Data Sheet Rev.1.0 26.05.2008 512MB DDR – SDRAM SoDIMM 200PIN SoDIMM Features: SDN06464E1C62MT-50R 512MB PC-3200 in TSOP Technique RoHS compliant Options: 1 Frequency / Latency DDR 400 MHz CL3 DDR 333 MHz CL2.5 1 Module densities 512MB with 8 dies and 2 ranks

Contextual Info: Data Sheet Rev.1.0 29.01.2009 256MB DDR SDRAM SoDIMM Fox 3 200Pin SO-DIMM Features: 1 1 1 1 Frequency / Latency DDR 400 MHz CL3 DDR 333 MHz CL2.5 DDR 266 MHz CL2.5 Module densities 256MB with 8 dies and 1 rank 512MB with 16 dies and 2 ranks Standard Grade

Contextual Info: Data Sheet Rev.1.0 21.05.2008 512MB ECC DDR – SDRAM DIMM 184PIN ECC DIMM Features: SDU06472B5BF1MT-50R 512MB PC-3200 in TSOP Technique RoHS compliant Options: ̇ Frequency / Latency DDR 400 MHz CL3 DDR 333 MHz CL2.5 DDR 266 MHz CL2.5 ̇ Module densities

Contextual Info: Data Sheet Rev.1.0 09.04.2008 512MB DDR – SDRAM DIMM 184PIN DIMM Features: SDU06464B5B61MT-50R 512MB PC-3200 in TSOP Technique RoHS compliant Options: 1 Frequency / Latency DDR 400 MHz CL3 DDR 333 MHz CL2.5 DDR 266 MHz CL2.5 1 Module densities 512MB with 8 dies and 1 rank

Contextual Info: Data Sheet Rev.1.1 18.09.2008 1024MB DDR – SDRAM DIMM 184PIN DIMM Features: SDU12864H1B61MT-50R 1024MB PC-3200 in TSOP Technique RoHS compliant Options: § Frequency / Latency DDR 400 MHz CL3 DDR 333 MHz CL2.5 DDR 266 MHz CL2.5 § Module densities 1024MB with 16 dies and 2 ranks

Contextual Info: Data Sheet Rev.1.0 29.01.2009 512MB DDR SDRAM SoDIMM Fox 3 200Pin SO-DIMM Features: 1 1 Frequency / Latency DDR 400 MHz CL3 DDR 333 MHz CL2.5 DDR 266 MHz CL2.5 Marking -50 -60 -75 1 Module densities 256MB with 8 dies and 1 rank 512MB with 16 dies and 2 ranks

Contextual Info: Mo nd ay ,1 MSP2204 3M ar ch ,2 00 6 10 :1 3: 34 PM MSP2204 Data Sheet Advance rtm in er In co n Multiservice Processor Advance Issue No. 1: January 2006 Do wn l oa de d by C on te nt T ea m of Pa Data Sheet Proprietary and Confidential to PMC-Sierra, Inc., and for its customers’ internal use.

ATT3000

Contextual Info: li M i a AT&T Data Sheet i May 1992 — ^ Microelectronics ATT3000 Series Field-Programmable Gate Arrays FEATURES • High Performance—up to 150 MHz Toggle Rates • User-Programmable Gate Array • I/O functions • Digital logic functions • Interconnections

solder paste alpha WS609

Abstract: WS609 Alpha WS609 solder cc fuji TSSOP YAMAICHI SOCKET Alpha WS609 dell monitor circuit diagram MO-194 scba009c reflow profile
Contextual Info: Thin Very Small-Outline Package TVSOP SCBA009C March 1997 1 IMPORTANT NOTICE Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest

Contextual Info: 11 :4 4: 22 PM DualPHY 1G ASSP Telecom Standard Product Data Sheet Released 6J an ua ry ,2 01 2 PM8374A co n Mo nd ay ,1 DualPHY 1G Data Sheet Released Issue No. 1: May 2004 Do wn lo ad ed [c on tro lle d] by Co nt en tT ea m of Pa rtm in er In 2 CHANNEL PHYSICAL LAYER TRANSCEIVER WITH