JEDEC TRAY STANDARD 10 Search Results

MIL-STD-81705

Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
Contextual Info: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes

MIL-STD-81705

Abstract: JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray
Contextual Info: 2 10 Transport Media and Packing 1/16/97 5:51 PM CH10WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 10 TRANSPORT MEDIA AND PACKING 10.1. TRANSPORT MEDIA 10.1.1. Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride (PVC) with an

JEDEC TRAY DIMENSIONS

Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
Contextual Info: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are

MQFP Shipping Trays

Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook
Contextual Info: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are

JEDEC tray standard

Abstract: JEDEC tray standard 13 TSOP40-1020TCM-RH Package tray tsop40 TSOP40-1020JCM-RH
Contextual Info: Product Change Notification Type of Notification: ISSUE DATE LAST BUY DATE NOTIFICATION NO. LAST SHIP DATE March 23, 2005 NA 20050323-02 March, 2005 This is to advise you that the following product s have been discontinued. Product ID (Description): Tray change for all IC’s that are packaged in a TSOP40-P-1020 package.

TB-2082

Abstract: TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS
Contextual Info: AMPHENOL TCS TB-2082 DFM and SMT Assembly Guideline Revision “F“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 J. Proulx J. Proulx 9/17/02

Teradyne connector

Abstract: 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne
Contextual Info: TB-2082 DFM and SMT Assembly Guideline Revision “C“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 Initial Release Update stencil design, JEDEC tray info, add weight

DAEWON tray drawing

Abstract: daewon 7x7 DAEWON JEDEC TRAY IA7 B DAEWON JEDEC TRAY 10 X 10 KY 717 atmel 717 daewon tray 7x7 atmel 367 daewon CABGA
Contextual Info: MIE APPROVAL 02/24/98 KY KW SEE DETAIL 'D' — 6.35 ►0.20 0 A Xd •0.20(0) A ZQ — 7.62 - 311.15-+0.25 -0.13 -132.08- +0.25 -0.13 +0.25 -0.13 - 311.66 - - +0.25 -0.13 - 132.59 - - ^10.20(0)1 A| X(R)| •0-10.20(0)1A|Z(0)| 135.9 92.1 SECTIDN

DAEWON JEDEC TRAY 10 X 10

Abstract: DAEWON JEDEC TRAY DAEWON JEDEC TRAY CABGA 7 X 7 DAEWON tray drawing DAEWON drawing daewon tray 41AL daewon JEDEC TRAY 10 X 10
Contextual Info: M IE APPROVED 06/85/99 SB KVMC — 6.35 rx l /“ SEE DETAIL 'D' 10.20 0 a zq O.gQWlAlXj — 7.62 in 311.15- • +0.25 -0.13 - 132.08- -I +0.25 -0.13 +0.25 -0.13 311.66 -■ +0.25 -0.13 - 132.59- - 0.20(H lA|xq <IH0.20 (R) 1A1Z (R) 92.1 SECTIDN 'X-X*

BOSCH diode

Abstract: BOSCH 0 280 120 400 BD2504 BD2500 BD2501 BD2502 BD2503 BD2505 BD2506 bosch 80 A diode
Contextual Info: BD2500 – BD2506 WTE POWER SEMICONDUCTORS 25A BOSCH TYPE PRESS-FIT DIODE Features ! Diffused Junction ! Low Leakage ! Low Cost ! High Surge Current Capability ! Typical IR less than 10µA

Contextual Info: • Guaranteed 2 points o f contact per readout with standard JEDEC module m o l e x 2.54mm x 12.70mm Flectrical .100 x .500" Pitch Voltage: 2S0V SIMM Classic Current: 1.0A Contact Resistance: 30mC2 max. SIMM Socket Dielectric Withstanding Voltage: 1000V AC

S146

Abstract: S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3
Contextual Info: NEW High-Speed 10+Gbps BGA Mezzanine Connectors IT3 Series •Flexibility Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 10+Gbps systems. With the ability to transmit differential, single-ended,

Contextual Info: • Guaranteed 2 points of contact per readout with standard JEOEC module m o l e x 2.54 x 10.16mm Electrical .1 0 0 x .400" Pitch Voltage: 250V SIMM Classic Current: 1,0A Contact Resistance: 3 0 m & max. SIMM Socket Dielectric Withstanding Voltage: 1000V AC

JEDEC TRAY DIMENSIONS

Abstract: JEDEC tray standard OT-007TM-01 JEDEC tray QFP JEDEC tray JEDEC tray standard 10 TRAY MATERIAL
Contextual Info: 39.57 135°C MAX 77.46 29.22 135.9 OT-007TM-01 UNIT : mm A 50.56 31.10 A' 39.57 252.8 315 322.6 <SECTION A - A'> 4.12 6.35 7.62 39.57 48.8 Tray OT-007TM-01 (JEDEC Tray) Material Carbon PPO Heat Proof Temp. Surface resistance 135°C 12 less than 1 x 10 Ω /

A 1013

Abstract: LD3500 LD3501 LD3502 LD3503 LD3504 LD3505 LD3506 PEAK TRAY
Contextual Info: LD3500 – LD3506 W TE PO WE R SEM IC O ND U C TO RS 35A 10mm LUCAS TYPE PRESS-FIT DIODE Features ! Diffused Junction ! ! ! ! Low Leakage Low Cost High Surge Current Capability Typical IR less than 20µA C Mechanical Data ! ! ! ! ! Case: All Copper Case and Components

L-D2500

Abstract: A 1013 ld2502 LD2500 LD2501 LD2503 LD2504 LD2505 LD2506
Contextual Info: LD2500 – LD2506 W TE PO WE R SEM IC O ND U C TO RS 25A 10mm LUCAS TYPE PRESS-FIT DIODE Features ! Diffused Junction ! ! ! ! Low Leakage Low Cost High Surge Current Capability Typical IR less than 20µA C Mechanical Data ! ! ! ! ! Case: All Copper Case and Components

A 1013

Abstract: LD5000 LD5001 LD5002 LD5003 LD5004 LD5005 LD5006 LD5002R press fit diode
Contextual Info: LD5000 – LD5006 W TE PO WE R SEM IC O ND U C TO RS 50A 10mm LUCAS TYPE PRESS-FIT DIODE Features ! Diffused Junction ! ! ! ! Low Leakage Low Cost High Surge Current Capability Typical IR less than 20µA C Mechanical Data ! ! ! ! ! Case: All Copper Case and Components

Package tray

Abstract: PFW5000 PFW5001 PFW5002 PFW5004 PFW5006 PFW5008 PFW5010
Contextual Info: PFW5000 – PFW5010 W TE PO WE R SEM IC O ND U C TO RS 50A FLAG LEAD 1/2" PRESS-FIT DIODE Features ! Diffused Junction ! ! ! ! Low Leakage Low Cost High Surge Current Capability Typical IR less than 10µA J D Mechanical Data ! ! ! ! ! H Case: All Copper Case and Components

Contextual Info: OGN-SMD Fuseholder Blocks & Clips www.schurter.com/pg02b Fuseholder Open Design, 5 x 20 mm, SMD, var. Covers, IEC 60335-1 250 VAC • 4 W / 10 A VDE · 500 VAC/DC · 10 A (UL/CSA) Description Applications - For appliances in unattended use - Glow wire tests acc. to IEC 60695-2-12 and -13

PF2510

Abstract: PF2500 PF2501 PF2502 PF2504 PF2506 PF2508
Contextual Info: PF2500 – PF2510 W TE PO WE R SEM IC O ND U C TO RS 25A 1/2" PRESS-FIT DIODE Features ! Diffused Junction ! ! ! ! Low Leakage Low Cost High Surge Current Capability Typical IR less than 10µA A DO-21 Dim Min Max A 15.63 16.14 B 12.75 12.83 C 8.89 10.04 D

BD3505

Abstract: BD3500 BD3501 BD3502 BD3503 BD3504 BD3506 Bosch diode
Contextual Info: BD3500 – BD3506 WTE POWER SEMICONDUCTORS 35A BOSCH TYPE PRESS-FIT DIODE Features ! Diffused Junction ! Low Leakage ! Low Cost ! High Surge Current Capability ! Typical IR less than 10µA

BD5002R

Abstract: BD5003 BD5004 BD5005 BD5006 BD5000 BD5001 BD5002
Contextual Info: BD5000 – BD5006 WTE POWER SEMICONDUCTORS 50A BOSCH TYPE PRESS-FIT DIODE Features ! Diffused Junction ! Low Leakage ! Low Cost ! High Surge Current Capability ! Typical IR less than 10µA

press fit diode

Abstract: PF3500 PF3501 PF3502 PF3504 PF3506 PF3508 PF3510
Contextual Info: PF3500 – PF3510 W TE PO WE R SEM IC O ND U C TO RS 35A 1/2" PRESS-FIT DIODE Features ! Diffused Junction ! ! ! ! Low Leakage Low Cost High Surge Current Capability Typical IR less than 10µA A DO-21 Dim Min Max A 15.63 16.14 B 12.75 12.83 C 8.89 10.04 D

PFW2500

Abstract: PFW2501 PFW2502 PFW2504 PFW2506 PFW2508 PFW2510 jedec tray
Contextual Info: PFW2500 – PFW2510 W TE PO WE R SEM IC O ND U C TO RS 25A 1/2" FLAG LEAD PRESS-FIT DIODE Features ! Diffused Junction ! ! ! ! Low Leakage Low Cost High Surge Current Capability Typical IR less than 10µA J D Mechanical Data ! ! ! ! ! H Case: All Copper Case and Components