JEP 113 Search Results

JEP 113

Abstract: JEP-113
Contextual Info: LEVEL CAUTION This Bag Contains MOISTURE-SENSITIVE DEVICES If blank, see adjacent COLOR: White with blue printing SYMBOL: JEDEC JEP 113 PACKAGED: 250 per roll, 3" diameter core bar code label 1. Calculated shelf life in sealed bag: 12 months at <40°C and <90%

Contextual Info: LEVEL CAUTION This Bag Contains MOISTURE-SENSITIVE DEVICES If blank, see adjacent COLOR: White with blue printing SYMBOL: JEDEC JEP 113 PACKAGED: 250 per roll, 3" diameter core bar code label 1. Calculated shelf life in sealed bag: 12 months at <40°C and <90%

M39012 TNC

Contextual Info: DASH NO. M CODE MADE FROM STAMP: 91836 M39012/29-0022 NOTES: 1. FOR USE WITH Ml 7 /1 13-RG174 & M17/113-RG316 CABLES 2. FOR CRIMPING USE CRIMP DIE KTH-2011 3. FOR CABLING UNSTRUCTIONS SE CP-465 4. MATERIALS: CENTER CONTACT: BER. COP. ASTM-B-196 CRIMP SLEEVE: COMM. BRONZE, ASTM-B-135

Contextual Info: DASH NO. M CODE MADE FROM STAMP: 91836 M39012/29-0022 £ « t NOTES: 1. FOR USE WITH Ml 7/113—RG174 k Ml 7/113-RG316 CABLES 2. FOR CRIMPING USE CRIMP DIE KTH-2011 3. FOR CABLING UNSTRUCTIONS SE CP-465 4. MATERIALS: CENTER CONTACT: BER. COP., ASTM-B-196 CRIMP SLEEVE: COMM. BRONZE. ASTM-B-135

Contextual Info: DASH NO. M CODE MADE FROM STAMP: 91836 M39012/29-0022 NOTES: 1. FOR USE WITH M17/113-RG174 & M17/113-RG316 CABLES 2. FOR CRIMPING USE CRIMP DIE KTH-2011 3. FOR CABLING UNSTRUCTIONS SE C P-465 4. MATERIALS: CENTER CONTACT: BER. COP., ASTM-B-196 CRIMP SLEEVE: COMM. BRONZE, ASTM-B-135

Contextual Info: DASH NO. M CODE MADE FROM YRWK DATE CODE NOTES: 1. 2. 3. 4. FOR USE WITH M l 7 /1 1 9 —RG174, M 1 7/0 94 -R G 1 79, & M 17/113-R G 316 CABLES. FOR CRIMPING USE CRIMP DIE KTH-2081. FOR CABLING INSTRUCTIONS SEE C P-4 0 2 . SAME AS K A -5 9 -2 4 2 EXCEPT FINISH.

Contextual Info: THIS COPY IS PROVIDED ON A RESTRICTED BASIS AND IS NOT TO BE USED IN ANY WAY DETRIMENTAL TO THE INTERESTS OF PANCON. .156 3.96 TYP .15 .045 SQ. 3.8 .08 1.14 2.0 .076/.070 DIA. [1.93/1.78] .45 .13 11.4 3.3 .156 3.96 (TYP) .07 1.8 .18 RECOMMENDED P.C. BOARD LAYOUT

MLAS100-18

Abstract: ITW Pancon CE
Contextual Info: THIS COPY IS PROVIDED ON A RESTRICTED BASIS AND IS NOT TO BE USED IN ANY WAY DETRIMENTAL TO THE INTERESTS OF PANCON. FOR USE W/ MASCON CE OR CT STYLE CONNECTORS ONLY FOR USE W/ POLARIZED AND UNPOLARIZED MASCON CE,CT,CEP,CTP STYLE CONNECTORS SOLID BACK WALL

MIL-B-81705

Abstract: MIL-D-3464 EIA/JEP 124 HYM328025GS-60 MIL-B-81705C MIL-D3464
Contextual Info: GURTUNG UND VERPACKUNG TAPE AND REEL Trockenverpackung Dry Pack Inhalt Contents 1. Einleitung 1. Introduction 155 2. Definitionen und Abkürzungen 2. Definitions and Abbrevations 155 3. Normenbezug 3. Normative References 156 4. Prüfen von Produkten auf Feuchteempfindlichkeit

D 5888 s

Abstract: cd 5888 s
Contextual Info: 13 12 10 -TYP- TO. r f i r a .467 II.86 i r i NOTE 6- 2-CIRCUIT .330 (8.38) .213 (5.40) ' i i i i .335 (8.50) .772 (19.60) r i i i -jYp (2 .0 ) k i I. MATERIAL: UNFILLED POLYESTER, U.L. 94V-0. i 2. HOUSING COLOR: A = M O L D E D BLACK .130 (3.30) •248

TMS664814DGE

Abstract: TM16SR64JPU TM16SR72JPU TM8SR64JPU TM8SR72JPU TMS664814 TMS664814DGE MHZ
Contextual Info: TM8SR64JPU, TM16SR64JPU TM8SR72JPU, TM16SR72JPU SYNCHRONOUS DYNAMIC RAM MODULES SMMS688B – AUGUST 1997 – REVISED FEBRUARY 1998 D D D D D D D D D Organization: – TM8SR64JPU . . . 8 388 608 x 64 Bits – TM16SR64JPU . . . 16 777 216 x 64 Bits – TM8SR72JPU . . . 8 388 608 x 72 Bits

9117 opto

Abstract: BPW 34s radial SFH 5110 JESD22-B102-B OHAY0224 OHAY0225 OHAY0324 OHAY0536 OHAY0734
Contextual Info: GURTUNG UND VERPACKUNG TAPE AND REEL GURTUNG UND VERPACKUNG TAPE AND REEL GURTUNG UND VERPACKUNG TAPE AND REEL SMT-Bauelemente SMT Components Gurtverpackung Tape and Reel SMT-Bauelemente müssen in geeigneter Form verpackt sein, um eine einwandfreie und ökonomische Verarbeitung zu gewährleisten. Hier kann OSRAM Opto Semiconductors, basierend auf der "ln-House-Erfahrung", die Verpackungen in 8 mm-,

TM8TT64JPN8A

Abstract: TM16TT64JPN TM16TT72JPN TM8TT64JPN TM8TT72JPN TMS664814
Contextual Info: TM8TT64JPN, TM16TT64JPN TM8TT72JPN, TM16TT72JPN SYNCHRONOUS DYNAMIC RAM MODULES D D D D D D D D D Organization: – TM8TT64JPN . . . 8 388 608 x 64 Bits – TM16TT64JPN . . . 16 777 216 × 64 Bits – TM8TT72JPN . . . 8 388 608 × 72 Bits – TM16TT72JPN . . . 16 777 216 × 72 Bits

38h8

Abstract: TM2TR64EPH TM2TR72EPH TM4TR64EPH TM4TR72EPH TMS626812B TMS626812
Contextual Info: TM2TR64EPH, TM4TR64EPH TM2TR72EPH, TM4TR72EPH SYNCHRONOUS DYNAMIC RAM MODULES SMMS702B – JANUARY 1998 – REVISED APRIL 1998 D Organization: D D D D D D D D D JEDEC 168-Pin Dual-In-Line Memory – TM2TR64EPH . . . 2 097 152 x 64 Bits – TM4TR64EPH . . . 4 194 304 x 64 Bits

TM4TR64EPH8A

Abstract: TM2TR64EPH TM2TR72EPH TM4TR64EPH TM4TR72EPH TMS626812B TMS626812
Contextual Info: TM2TR64EPH, TM4TR64EPH TM2TR72EPH, TM4TR72EPH SYNCHRONOUS DYNAMIC RAM MODULES SMMS702B − JANUARY 1998 − REVISED APRIL 1998 D Organization: D D D D D D D D D JEDEC 168-Pin Dual-In-Line Memory − TM2TR64EPH . . . 2 097 152 x 64 Bits − TM4TR64EPH . . . 4 194 304 x 64 Bits

TMS626812ADGE

Abstract: SDRAM DIMM 1997 TM2SR72EPN TM4SR72EPN TMS626812A TMS626812
Contextual Info: TM2SR72EPN 2097152 BY 72-BIT TM4SR72EPN 4194304 BY 72-BIT SYNCHRONOUS DYNAMIC RAM MODULES SMMS698A – JUNE 1997 – REVISED FEBRUARY 1998 D D D D D D D D Organization – TM2SR72EPN . . . 2 097 152 x 72 Bits – TM4SR72EPN . . . 4 194 304 x 72 Bits Single 3.3-V Power Supply

TM4SK64KPN

Abstract: TM8SK64KPN TMS664164 1tm4
Contextual Info: TM4SK64KPN 4ā194ā304 BY 64ĆBIT TM8SK64KPN 8ā388ā608 BY 64ĆBIT SYNCHRONOUS DYNAMIC RAM MODULES Ċ SODIMM SMMS709 − APRIL 1998 D D D D D D D D High-Speed, Low-Noise, Low-Voltage TTL − TM4SK64KPN . . . 4 194 304 x 64 Bits − TM8SK64KPN . . . 8 388 608 x 64 Bits

TM4TT64KPN

Abstract: TM8TT64KPN
Contextual Info: TM4TT64KPN 4194304 BY 64-BIT TM8TT64KPN 8388608 BY 64-BIT SYNCHRONOUS DYNAMIC RAM MODULES SMMS699A – MARCH 1998 – REVISED AUGUST 1998 D D D D D D D D Organization – TM4TT64KPN . . . 4 194304 x 64-Bits – TM8TT64KPN . . . 8 388608 × 64 Bits Single 3.3-V Power Supply

TMS626812ADGE

Abstract: TM2CN64EFN TM4CN64EFN TMS626812A TMS626812
Contextual Info: TM2CN64EFN 2097152 BY 64-BIT TM4CN64EFN 4194304 BY 64-BIT SYNCHRONOUS DYNAMIC RAM MODULES SMMS714 – MAY 1998 D D D D D D D D Organization: – TM2CN64EFN . . . 2 097 152 x 64 Bits – TM4CN64EFN . . . 4 194 304 x 64 Bits Single 3.3-V Power Supply ±10% Tolerance

TMS626812ADGE

Abstract: TM2SR72EPN TM4SR72EPN TMS626812A TMS626812
Contextual Info: TM2SR72EPN 2ā097ā152 BY 72ĆBIT TM4SR72EPN 4ā194ā304 BY 72ĆBIT SYNCHRONOUS DYNAMIC RAM MODULES SMMS698A − JUNE 1997 − REVISED FEBRUARY 1998 D Organization D D D D D D D High-Speed, Low-Noise Low-Voltage TTL − TM2SR72EPN . . . 2 097 152 x 72 Bits

TM2SR72EPH

Abstract: TM4SR72EPH TMS626812B pcb warpage TMS626812
Contextual Info: TM2SR72EPH 2097152 BY 72-BIT TM4SR72EPH 4194304 BY 72-BIT SYNCHRONOUS DYNAMIC RAM MODULES SMMS705A – FEBRUARY 1998 – REVISED APRIL 1998 D D D D D D D D Organization – TM2SR72EPH . . . 2 097 152 x 72 Bits – TM4SR72EPH . . . 4 194 304 x 72 Bits Single 3.3-V Power Supply

TM4SK64KPN

Abstract: TM8SK64KPN TMS664164 14H8
Contextual Info: TM4SK64KPN 4194304 BY 64-BIT TM8SK64KPN 8388608 BY 64-BIT SYNCHRONOUS DYNAMIC RAM MODULES — SODIMM SMMS709 – APRIL 1998 D D D D D D D D Organization: – TM4SK64KPN . . . 4 194 304 x 64 Bits – TM8SK64KPN . . . 8 388 608 x 64 Bits Single 3.3-V Power Supply

TM4CN64EFH-10

Abstract: TM2CN64EFH TM4CN64EFH TMS626812B TMS626812
Contextual Info: TM2CN64EFH 2097152 BY 64-BIT TM4CN64EFH 4194304 BY 64-BIT SYNCHRONOUS DYNAMIC RAM MODULES SMMS715 – MAY 1998 D D D D D D D D Organization: – TM2CN64EFH . . . 2 097 152 x 64 Bits – TM4CN64EFH . . . 4 194 304 x 64 Bits Single 3.3-V Power Supply ±10% Tolerance

TM2SN64EPH

Abstract: TM4SN64EPH TMS626812B TMS626812
Contextual Info: TM2SN64EPH 2097152 BY 64-BIT TM4SN64EPH 4194304 BY 64-BIT SYNCHRONOUS DYNAMIC RAM MODULES SMMS706A – MARCH 1998 – REVISED APRIL 1998 D D D D D D D D D Organization: – TM2SN64EPH . . . 2 097 152 x 64 Bits – TM4SN64EPH . . . 4 194 304 x 64 Bits Single 3.3-V Power Supply