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Abstract: MX150
Contextual Info: NOTES: 1. REFER TO MOLEX SALES DRAWING S D -7 57 57 -00 2 FOR THE HEADER ASSEMBLY PRODUCT CUSTOMER SHROUD DESIGN D E T A IL S DETAILS AND RECOMMENDED PCB LAYOUT. 2. KEYING OPTIONS A -D AND SUGGESTED COLORS COMPLY TO THE POLARIZATION STANDARDS ESTABLISHED FOR MATING WITH A MX150 FEMALE CONNECTOR.

Contextual Info: 12 13 10 NOTES: 1. M A T E R I A L : C A G E : N IC K E L S I L V E R , T H I C K N E S S : 0.2 5m m EMI A B S O R B E R : L A R I D Q -ZO RB C O N N E C T O R HOU SI NG : G L A S S RFSB FILLED S IN G L E BAND ABSORBER. THERM OPLASTIC, UL : 9 4 V -0, 2 .0 7 ±0.25

SD-76641-001

Contextual Info: 13 12 10 29.ST2 4 . 13- CKT B9 bi CKT d" SSSISlälS 1.65 CKT CKT A9 A1 4 - 4 0 IN TE R N A L TH R E A D PLA CE S SEE NOTE 5) NOTES: 1. MATERIALS: SHIELD: DEEP DRAWN STEEL HOUSING: GLASS FILLED POLYMER, BLACK, UL 9 4 V -0 CONTACTS: COPPER ALLOY PLATING: SHIELD: 2.54 MICROMETERS BRIGHT TIN (Sn) MINIMUM

SFP molex

Contextual Info: 13 12 10 J I -58.77-57.25- H G F N0TE5 : 1. M A T ER IA L : C A G E : NICKEL SILV ER, 0.25mm THICK CO NNECTOR HOUSING : HIGH TEM P TH ERM O PLA STIC. _g E D aa D a. D JL G L A S S -F IL L E D . U L 94V -0 OVERMOLD TERM IN A L A S S 'Y : HIGH T E M P TH ERM O PLA STIC.