K23 SMD Search Results

Contextual Info: VLME/F/K23. Vishay Semiconductors Power Mini SMD LED FEATURES • SMD LEDs with exceptional brightness • Luminous intensity categorized • Compatible with automatic placement e3 equipment • IR reflow soldering • Available in 8 mm tape • Low profile package

PFWB2

Abstract: pfwb4 S1C63000 QFP20-144pin XC40
Contextual Info: CMOS 4-BIT SINGLE CHIP MICROCOMPUTER S1C63708 Technical Manual NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not assume any

smd 3y3

Abstract: SMD K22 smd 1a2 RCA 2A3 JB16 smd 2a3 AL300 AVDD300 DVDD300 6 pin mini din lcd
Contextual Info: A B C D E 14.318MHz Opt AVDD300 DVDD300 Y1 10uh(Opt) VDOUT[15:0] 3 U2 2 20 22 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 O1 O2 O3 O4 O5 O6 O7 O8 ROMD0 ROMD1 ROMD2 ROMD3 ROMD4 ROMD5 ROMD6 ROMD7 VDOUT7 VDOUT6 VDOUT5 VDOUT4 VDOUT3 VDOUT2 VDOUT1 VDOUT0

k72 smd

Abstract: SMD k72 LTW-E500 k72 v1 LTW-E500S-PH1 k38v2 k68 SMD ED-4701 J-STD-020B LTW-E500S
Contextual Info: LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only SMD LAMP LED OFFICE : 90 Chien I Road, Chung Ho Taipei, Taiwan, R.O.C. TEL : +886-2-2222-6181 FAX : +886-2-2226-5872 LTW-E500S-PH1 DATASHEET DATE : 2008/11/21 REV. NO. : Version : I PAGE : BNS-OD-C131/A4

Contextual Info: SMD LED Product Data Sheet LTW-S45T-PH Spec No.: DS22-2011-0689 Effective Date: 08/18/2012 Revision: C LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C. Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660

Contextual Info: SMD LED Product Data Sheet LTW-S45T-PH1 Spec No.: DS22-2012-0081 Effective Date: 05/10/2012 Revision: A LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C. Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660

MT46H64M32

Abstract: marking k22 SMD pop 168 U22-T23 marking code micron label micron lpddr SMD marking code B10 SMD CODE aa23 AB22-AB23 AC18-AC19
Contextual Info: Preliminary‡ 168-Ball x16, x32 LPDDR-SDRAM PoP TI OMAP Features LPDDR-SDRAM 168-Ball Package-on-a-Package (PoP) TI OMAP MT46HxxxMxxLxJG Features Options • Vdd/Vddq = 1.70–1.95V • Bidirectional data strobe per byte of data (DQS) • Internal, pipelined double data rate (DDR)

smd marking K23

Abstract: lpddr SMD transistor MARKING CODE g23 marking k22 SMD 168-ball LPDDR sac105 LPDDR Pop smd transistor ab2 MT46H64M32 SMD transistor k23
Contextual Info: Preliminary‡ 168-Ball x16, x32 Mobile LPDDR PoP TI OMAP Mobile DDR SDRAM Addendum Mobile LPDDR 168-Ball Package-on-Package (PoP) TI OMAP MT46HxxxMxxLxJG Features Options • Vdd/Vddq = 1.70–1.95V • Bidirectional data strobe per byte of data (DQS)

3461As

Contextual Info: IS31IO7326 Debounced 8x8 Key-Scan Controller Evaluation Board Guide Description Recommended Equipment IS31IO7326 is a 64 key, key-scan controller. It offloads the burden of keyboard scanning from the host processor. The IS31IO7326 supports keypad matrix of

MT29C2G24m

Abstract: MT29C2G48 MT29C4G48M SMD MARKING CODE h23 MT29F4G16ABC JW256 MT29F4G16AB MT29C2G24MAKLAJG-6 MCP LPDDR 1Gb 512Mb marking k22 SMD
Contextual Info: Preliminary‡ 168-Ball NAND Flash and LP-DRAM PoP TI-OMAP MCP Features NAND Flash and LP-DRAM 168-Ball Package-on-a-Package (PoP) Combination Memory (TI OMAP ) Features • • • • • • Figure 1: Micron NAND Flash and LP-DRAM components RoHS-compliant, “green” package

Calistoga

Abstract: ALC861 VSS011 DMI0TXP OZ128TN ALC880 SAMA5
Contextual Info: Chapter2 Page 1 of 45 Major Components Chapter2 Major Components 2.1. System Block Diagram ……………………………………………… 3 2.2. Major Component Definition .…….………………………………. 35 2.3. Connector Definition…….………………………………………….

gad5

Abstract: GND35 G20-G24 gad4 7408 pin configuration MDR36 gad9 GAD17 MDR63 GAD21
Contextual Info: 1 2 3 4 5 6 7 8 C130 0.1U 0603B 2 C177 0.1U 0603B 2 2 MDR63 MDR62 MDR61 MDR60 MDR59 MDR58 MDR57 MDR56 MDR55 MDR54 MDR53 MDR52 MDR51 MDR50 MDR49 MDR48 MDR47 MDR46 MDR45 MDR44 MDR43 MDR42 MDR41 MDR40 MDR39 MDR38 MDR37 MDR36 MDR35 MDR34 MDR33 MDR32 MDR31 MDR30

88sa8040

Abstract: M50EI0 ITE 8510 VAA33 K7K27 IT8510E u34c SADQ15 SAMA5 SADQ21
Contextual Info: Chapter2 Page 1 of 37 Major Components Chapter2 Major Components 2.1. System Block Diagram …………………………………………………. 3 2.2. Major Component Definition.…….……………………………….…… 4 2.3. Connector Definition…….………………………………………………. 27

RJ48

Abstract: RJ-48 RPOS13 AA19 AC22 XRT83L314 TTIP11 t1-m6 trs a13 RRING11
Contextual Info: 4 3 2 1 S1 16 15 14 13 12 11 10 9 5 HEADER 8X2 D 1 2 3 4 5 6 7 8 D C5 CLK 5 38 CLKREF56kHz 30 CLKREFE1 U5 3V_SUP 8 4 VCC GND CLK 5 C 5.6MHz 4 XC95144XL GND 16.384MHz 8 VCC CLK H1 1 3 5 3V_SUP + + + 4 + + + 2 4 6 5 32 GND 12.352MHz JTAG P1 R1 CS ALE WR_R/W

ITE 8510

Abstract: K8T890 ICS953201 53sr2 via VT8237A VT8237A CN10A VSUS33 it85 RTL81100CL
Contextual Info: Chapter2 Page 1 of 36 Major Components Chapter2 Major Components 2.1. System Block Diagram …………………………………………………. 3 2.2. Major Component Definition.…….……………………………….…… 22 2.3. Connector Definition…….………………………………………………. 35

SAMA5

Abstract: IT8510 VSS011 16W16 ICH6-6-21-0
Contextual Info: Chapter2 Page 1 of 38 Major Components Chapter2 Major Components 2.1. System Block Diagram …………………………………………………. 3 2.2. Major Component Definition .…….……………………………….…… 29 2.3. Connector Definition…….………………………………………………. 36

VSS011

Abstract: SAMA5 Calistoga v_cpu_io IT8510 VSS286
Contextual Info: Chapter2 Page 1 of 36 Major Components Chapter2 Major Components 2.1. System Block Diagram …………………………………………………. 3 2.2. Major Component Definition .…….……………………………….…… 29 2.3. Connector Definition…….………………………………………………. 36

FCI smd rj45 Connector

Abstract: IXF1104 panasonic rx-d17 J18A harness MCP860 RXA25 stpa smd E25 SMD diode RGMII Intel MDIO mark b14 smd diode
Contextual Info: Intel IXD1104 Demo Board Development Kit Manual August 2003 Document Number: 278809 Revision Number: 001 Revision Date: August 21, 2003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

TZ1001

Abstract: TZ1430 IT8510 z1508 TZ1432 TZ1004 TZ1003 855pm Z1511 TZ1002
Contextual Info: Chapter2 255/259IAX Major Components Rev : A Page 1 - 31 Chapter2 Major Components 2.1. System Block Diagram …………………………………………………. 3 2.2. Major Component Definition.…….……………………………….……

M50EA0

Abstract: SAMA5 CON-32 v_cpu_io SBDQ62 hd61# HA20 ALC880 SBDQ33
Contextual Info: Chapter2 Page 1 of 1 Major Components Chapter2 Major Components 2.1. System Block Diagram …………………………………………………. 3 2.2. Major Component Definition.…….……………………………….…… 27 2.3. Connector Definition…….………………………………………………. 41

9LPR310

Abstract: 9LPR310-CLK SADQ34 U24E SADQ32 ITE8510 VSS011 AMPLIFIER HY 219 SADQ25 U24g
Contextual Info: Chapter 2 Major Components Page 1 of 40 Chapter 2 Major Components 2.1. System Block Diagram …………………………………………………. 3 2.2. Major Component Definition.…….……………………………….…… 31 2.3. Connector Definition…….………………………………………………. 40

IT8512E

Abstract: 88E805x 8512E ITE8512 ICS9lpr310 ITE8512E VSS275 calistoga foxconn M28N-1
Contextual Info: Chapter 2 Page 1 of 41 Major Components Chapter 2 Major Components 2.1. System Block Diagram ………………………………………………. 3 2.2. Major Component Definition…….……………………………….… 33 2.3. Connector Definition…….………………………………………….

8512e

Abstract: 88E805x IT8512E ITE8512E M28N-1 foxconn g41 calistoga foxconn PGA-479-PZ47823 c 337 25 w24
Contextual Info: Chapter 2 Major Components Page 1 of 39 Chapter 2 Major Components 2.1. System Block Diagram …………………………………………………. 3 2.2. Major Component Definition…….……………………………….…… 31 2.3. Connector Definition…….………………………………………………. 39

VSS011

Abstract: ITE 8510 MAX8374 VSS297 CN152 VSS021 VSS081 v_cpu_io ah41 CN153
Contextual Info: Chapter2 Page 1 of 39 Major Components Chapter2 Major Components 2.1. System Block Diagram …………………………………………………. 3 2.2. Major Component Definition…….……………………………….…… 30 2.3. Connector Definition…….………………………………………………. 37