KESTER 182 Search Results

k639

Abstract: Cookson Group solder paste SAC305 alpha metal SAC405 10084 SAC305
Contextual Info: Small Form- Factor Pluggable SFP DWDM (Dense Wavelength Division Multiplexer) Connector and Cage Assembly NOTE i Application Specification 114- 13178 06 JUL 09 Rev D All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless

AMPOMATOR CLS IV

Abstract: machine maintenance checklist 408-8059 565435-5 instruction sheet 408-7424 maintenance manual 565435-5 SN60 SN62 354500-1 356N
Contextual Info: Application Specification Mini Power Drawer Vertical PC Board Receptacles and Panel- Mount Plugs NOTE i 114- 13067 23 OCT 09 Rev A All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless otherwise specified, dimensions have a tolerance of +0.13 and angles have a tolerance of +2_. Figures and

ferrule crimper pull test table

Abstract: ferrule crimper pull test Kester sn62 tinning AMPLIMITE 408-6923 sheet metal press bending machine Tyco manual Semi-automatic for crimping 408-8040 tyco USB connector 90713-1 SN60
Contextual Info: Application Specification 114- 40054 Universal Serial Bus USB Connectors NOTE i 29 OCT 09 Rev A All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2_.

Contextual Info: Application Specification AMPMODU* 50/50 Grid Connectors for SMT PC Board and IDC Ribbon Cable Applications 114- 7010 18 MAR 11 Rev F All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2_.

Kester 182

Contextual Info: Technical Paper Solderability of Lead Free Electrodeposits in Tin/Lead Solder Dr. Robert D. Hilty & Marjorie K. Myers Tyco Electronics Harrisburg, PA Copyright Tyco Electronics, 2004 Publication 503-1001 Revision O 10NOV04 Solderability of Lead Free Electrodeposits in Tin/Lead Solder

Analog-Digital Conversion Handbook

Abstract: Analog-DigitalConversionHandbook S4 diode 6cA Tdc1007j Data Conversion Handbook
Contextual Info: ADI 技术指南合集 第一版 模数转换器 目录 ADC 噪声系数——一个经常被误解的参数 . 1 奈奎斯特准则对数据采样系统设计有何意义 .137 ADC 架构 I：Flash 转换器 .10

electrical LED display module

Contextual Info: These drawings and specifications are the property of Densitron Corporation and may not be reproduced, copied or used without written permission 1. 2. 3. 4. REVISIONS REV DESCRIPTION DATE APPROVED A E0191 Specification subject to change without notice. All dimensions and specifications apply to standard modules. This information may vary for modules with optional

IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies

Abstract: entek Cu-56 CCGA Kester 953 Flux PEAK TRAY bga IBM ccga 23n50 Cu-56 APD-SBSC-101 T- 200x thinner
Contextual Info: Ceramic Column Grid Array Assembly and Rework User’s Guide July 25, 2002  Copyright International Business Machines Corporation 2002. Copyright and Disclaimer All Rights Reserved Printed in the United States of America July 25, 2002. The following are trademarks of International Business Machines Corporation in the United States, or other countries, or

Kester 182

Abstract: 2C40
Contextual Info: These drawings and specifications are the property of Densitron Corporation and may not be reproduced, copied or used without written permission 1. 2. 3. 4. REVISIONS REV. DESCRIPTION DATE APPROVED A E0194 Specification subject to change without notice. All dimensions and specifications apply to standard modules. This information may vary for modules with optional

Avantek amt

Abstract: Avantek amplifier 604AG Avantek aft Avantek 6-18
Contextual Info: APPLICATION NOTES PGM SERIES: GAIN M ODULES IN THE iAVPAK PACKAGE Description The PGM series of packaged amplifier gain modules covers 220 GHz in 17 models, providing eight different frequency bands with gain options that answer a wide variety of needs for

2C40

Contextual Info: These drawings and specifications are the property of Densitron Corporation and may not be reproduced, copied or used without written permission 1. 2. 3. 4. REVISIONS REV. A DESCRIPTION RELEASED ON ECN #E0195 DATE APPROVED 6/9/97 MA Specification subject to change without notice.

2C40

Abstract: E0739
Contextual Info: The information disclosed herein was originated by and is the property of Densitron International. Densitron International reserves all patent, proprietary, design, use, sales, manufacturing and reproduction rights thereto. REVISIONS REV. - DESCRIPTION RELEASED ON ECN #E0739

LM2131

Contextual Info: These drawings and specifications are the property of Densitron Corporation and may not be reproduced, copied or used without written permission 1. 2. 3. 4. REVISIONS REV. DESCRIPTION DATE APPROVED A E0190 Specification subject to change without notice. All dimensions and specifications apply to standard modules. This information may vary for modules with optional

das5v7

Abstract: LCD 1602 application note 2C40
Contextual Info: These drawings and specifications are the property of Densitron Corporation and may not be reproduced, copied or used without written permission 1. 2. 3. 4. REVISIONS REV. DESCRIPTION DATE APPROVED A E0193 Specification subject to change without notice. All dimensions and specifications apply to standard modules. This information may vary for modules with optional

marking code SMD 7z

Contextual Info: Application Specification AMPMODU* 50/50 Grid Connectors 114-7010 for SMT PC Board and IDC Ribbon Cable Applications 10 OCT 08 Rev E All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2 .

AUS308

Abstract: AUS308 thermal kester 256 AUS303 AUS-308 aus5 kester 245 solder wire Lead Free reflow soldering profile BGA
Contextual Info: Challenges in Manufacturing Reliable Lead-Free and RoHS-Compliant Components WP-CHMFGRELLDFR-2.0 White Paper The push for lead-free or RoHS-compliant products is resulting in significant changes in packaging materials. Manufacturers of electronic equipment require materials that

QQ-S-571E

Abstract: 5082-7441 MIL-P-28809 QQS-571-E Kester sn62 tinning HDSP-6300 HDSP-6508 MIL-B-81705 Display hp 5082-7441 QQ-S571E
Contextual Info: Soldering LED Components Application Note 1027 Table of Contents • Introduction . 1 • An Abstract of Key Points . 2 • Leads on LED Components .

AD9970

Abstract: AD9969 ad9272 AD9972 ADV7602 AD9978 ADV7510 AD9977 AD9920 AD9979
Contextual Info: 高速信号处理 产品参考手册 目录 高速模数转换器 ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 多通道ADC与集成解决方案 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

a23 862-1

Abstract: hysol 4323 PPC601 DL10 DL12 DL13 DL14 MPC601 PowerPC 601 601V 244
Contextual Info: Freescale Semiconductor, Inc. MPR601HSU-03 IBM Order Number MPC601EC/D (Motorola Order Number) 1/95 REV 3 Advance Information PowerPC 601 RISC Microprocessor Hardware Specifications The PowerPC 601 microprocessor is the first implementation of the PowerPC™ family of

PPC601

Abstract: PANASONIC Memory card 32kbyte hysol 4323 A23 862-1 DL10 DL12 DL13 DL14 MPC601 PowerPC 601
Contextual Info: MPR601HSU-03 IBM Order Number MPC601EC/D (Motorola Order Number) 1/95 REV 3 Advance Information PowerPC 601™ RISC Microprocessor Hardware Specifications The PowerPC 601 microprocessor is the first implementation of the PowerPC™ family of reduced instruction set computer (RISC) microprocessors. This document contains

Contextual Info: MPR603EHS-01 IBM Order Number MPC603EEC/D (Motorola Order Number) 6/95 TM Advance Information PowerPC 603e” RI Hardware Specific The PowerPC 603e m icroproo reduced instruction set co: pertinent physical charai processor, refer to the oprocessor lementation o f the PowerPC family o f

TC77-XXMXX

Abstract: circuit diagram temperature measurement rtd DS21743 proximity sensor interfacing with microcontroller DS20092 915 transistor Hua Jung Components jerry Silicon temperature sensors AN871
Contextual Info: M AN871 Solving Thermal Measurement Problems Using The TC72 And TC77 Digital Silicon Temperature Sensors Author: Jim Lepkowski, Microchip Technology Inc. INTRODUCTION The TC72 and TC77 are CMOS silicon temperature sensors that provide an accurate digital temperature

panasonic washing machine circuit diagram

Contextual Info: MPR603HSU-02 IBM Order Number MPC603EC/D (Motorola Order Number) 1/95 REV 1 PowerPC A dvance Information PowerPC 603 RIS| Hardware Specifici croprocessor The PowerPC 603 microprocessor iPj*P ijgpementation of the PowerPC™ family of reduced instruction set c o i^ K e r f R Ï^ ^ microprocessors. This document contains

a23 862-1

Abstract: ppc601 601V 244 Epx 5341 hysol 4323 52 signals PowerPC 601 Hysol MPC601 PowerPC 601
Contextual Info: Freescale Semiconductor, Inc. MPR601HSU-03 IBM Order Number MPC601EC/D (Motorola Order Number) CT OR , IN C.2 006 DU ON Advance Information MIC PowerPC 601™ RISC Microprocessor Hardware Specifications LE SE The PowerPC 601 microprocessor is the first implementation of the PowerPC™ family of