KESTER SN63PB37 Search Results

J-STD-004 solder wire rom1

Abstract: kester 285 solder wire J-STD-004 Kester Kester* 1544 kester 245 solder wire kester Sn62Pb36Ag02 Sn62Pb36Ag02 IPC-TM-650 IPC-TM650
Contextual Info: 48 Activated Rosin Cored W ire For Lead-bearing and Lead-free alloys Product Description Reliability Properties Kester 48 Activated Rosin Flux for cored solder wire was developed for lead-free applications to enable soldering of most common metals. Kester

SN62PB36AG02

Abstract: sn63pb37 solder wire J-STD-004 solder wire rom1 sn63pb37 solder wire shelf life kester Sn62Pb36Ag02 J-STD-004 Rosin Activated Core Wire kester 44 rosin SN63PB37 IPC-TM-650
Contextual Info: 44 Activated Rosin Cored Wire Product Description Reliability Properties Kester 44 Rosin Flux is an activated rosin formula for use in flux-cored solder wire. Kester 44 Rosin Flux has virtually dominated the field of activated rosin core solders for well over four decades. An

sn63pb37 solder wire shelf life

Abstract: kester 44 rosin
Contextual Info: 44 Activated Rosin Cored W ire Product Description Reliability Properties Kester 44 Rosin Flux is an activated rosin formula for use in flux-cored solder wire. Kester 44 Rosin Flux has virtually dominated the field of activated rosin core solders for well over four decades. An

ROSIN FLUX TYPE ROL0

Abstract: kester 186 285 solder wire shelf life ROSIN
Contextual Info: 285 Mildly Activated Rosin Cored W ire For Lead-bearing and Lead-free alloys Product Description Kester 285 mildly activated rosin flux is classified as Type ROL0 flux under IPC J-STD-004. This flux was formerly classified as Type RMA per MIL-F-14256. Kester 285 consists of high quality,

Kester 197

Contextual Info: R560 Water-Soluble Solder Paste Product Description Physical Properties Data given for Sn63Pb37, 90% metal, -325+500 mesh Kester R560 is an organic acid, water-soluble solder paste formula specifically designed to reduce voiding in Ball Grid Array (BGA) solder

SN63PB37

Contextual Info: 2009 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 EnviroMark™ 828 Application No-Clean Stencil Printing Water-Soluble Stencil Printing Alloys Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Product

Sn63Pb37

Contextual Info: R276 Dispensable No-Clean Solderpaste for Leaded Alloys Product Description Physical Properties Data given for Sn63Pb37 87% metal, -325+500 mesh Kester R276 is a no-clean solder paste specifically designed for optimal characteristics in all types of dispensing applications. R276 is packaged

kester Sn62Pb36Ag02

Abstract: Sn63pB37 temp profile
Contextual Info: R500 Dispensable Water-soluble Solder Paste for Leaded Alloys Product Description Physical Properties Kester R500 is a water-soluble solder paste formula specifically designed as a consistent dot dispensing paste for automated dispense equipment. This solder paste exhibits excellent wetting

bellcore GR-78

Abstract: sn63pb37 solder wire sn63pb37 solder wire shelf life kester 245 solder wire GR-78 sn63pb37 Sn62Pb36Ag02 ROSIN FLUX TYPE ROL0 245 Rosin Flux Cored Solder Kester 245
Contextual Info: 245 No-Clean Cored W ire Product Description Reliability Properties Kester 245 No-clean Cored Wire was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have

kester 245 solder wire

Abstract: bellcore GR-78 kester 245 sn63pb37 solder wire ROSIN FLUX TYPE ROL0 GR-78 sn63pb37 solder wire shelf life J-STD-004 Kester IPC-TM650
Contextual Info: 245 No-Clean Cored W ire Product Description Reliability Properties Kester 245 No-clean Cored Wire was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have

DOD-STD-2000-1A

Abstract: QQ-S-571 sn96
Contextual Info: E-Bar Oxide Free Extruded Bar Solder Lead-bearing and Lead-free alloys Product Description Complicated electronic assemblies and printed circuit boards require not only conformance to industry material specifications, but also alloys completely free of non-metallic oxides. Kester, in cooperation with the

Sn62Pb36Ag02

Abstract: 959T kester 245 solder wire bellcore GR-78 Kester 275 sn63pb37 solder wire shelf life GR-78 IPC-TM-650 IPC-TM650 j-std-004
Contextual Info: 275 No-Clean Cored W ire For Lead-bearing and Lead-free alloys Product Description Reliability Properties Kester 275 No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the

2331-ZX

Abstract: IPC-TM-650 Sn62Pb36Ag02 IPC-TM650 Kester LIQUID FLUX
Contextual Info: 331 Organic Cored W ire For Lead-bearing and Lead-free alloys Product Description Kester 331 Organic Flux is a water soluble formula for use in flux-cored solder wire. This cored solder version of the popular 2331-ZX Neutral Organic Water Soluble Liquid Flux is more effective than

Contextual Info: 275 No-Clean Cored W ire For Lead-bearing and Lead-free alloys Product Description Reliability Properties Kester 275 No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the

Contextual Info: 952-S Low-Solids No-Clean Flux Product Description Kester 952-S is a halide-free, non-rosin organic flux designed for wave soldering of conventional and surface mount circuit board assemblies. The extremely low solids content 2.0% and nature of the activator system results in practically no

J-STD-004

Abstract: Kester 275 Sn62Pb36Ag02 Sn63pB37 J-STD-004 solder wire sn63pb37 solder wire IPC-TM650 952-D6 Kester Sn63
Contextual Info: 275 No-Clean Cored W ire For Lead-bearing and Lead-free alloys Product Description Reliability Properties Kester 275 No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the

GR-78-CORE

Abstract: ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527
Contextual Info: 2010 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 Application EnviroMark™ 828 No-Clean Stencil Printing Water-Soluble Stencil Printing Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with

Contextual Info: Easy Profile 256 No-Clean Solderpaste Product Description Physical Properties Data given for Sn63Pb37 90% metal, -325+500 mesh Easy Profile® 256 is a no-clean, air or nitrogen reflowable, solder paste specifically designed for maximum robustness in reflow profiling and stencil

sn63pb37 solder wire

Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
Contextual Info: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information

24-7068-1407

Abstract: 24-6337-8817 GR-63-CORE Zone 4 test 2460400010 24-6337-0027 K100LD sn62pb36ag2
Contextual Info: 2013 RECOMMENDED Electronics Assembly Materials Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information 3-7 8-11 12-13 14-15 16 17 18 19 | 800 253 7837 | WWW.kester.com

Antenna Coil 13.56 MHz RFID design

Abstract: 134,2 kHz coil antenna RFID 134.2khz antenna design ti 134.2kHz sn63pb37 solder wire flux 232 RFID reader 134.2 LF antenna design rfid ti lf antenna design rfid reader schematic LF ANTENNA
Contextual Info: S4100 MULTI-FUNCTION READER MODULE 11-06-22-715 10/2003 FEATURES: • USART for I/O Communication • Three General Purpose I/O lines • Dual Frequency Operation o 134.4KHz o 13.56 MHz • Multi-Protocol o TI RFid LF Products o TI RFid HF Tag-It o ISO 15693

EAI-481

Abstract: kester Sn62Pb36Ag02 108505710 108468356 lucent titania lucent DC-DC POWER MODULE
Contextual Info: Data Sheet August 2000 Titania Power Modules Austin Series Non-Isolated SMT DC-DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc to 3.3 Vdc Output, 6A Features • • • • • • The Austin Power Module Series provides precise voltage and fast transient response in

Contextual Info: Applications Guide June 2002 Shindengen Power Modules HAL/HAW Non-Isolated SMT DC - DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A Features • Small size and very low profile ■ Minimal space on printed circuit board ■ Surface mountable

108612920 AUSTIN 3.3V

Abstract: 108505686 Titania Power Modules 108505678 108612961 108468356 EAI-481 titania PEAK tray drawing 108505710
Contextual Info: Data Sheet August 2000 Titania Power Modules Austin Series Non-Isolated SMT DC-DC Power Modules: 3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc to 3.3 Vdc Output, 6A Features • • • • • • The Austin Power Module Series provides precise voltage and fast transient response in