LAAD Search Results

17ti

Contextual Info: A ll dimensions expressed as —4?.c^- $— millimeters. 0 85 Q.Oft IO.S3S>-\ RAO \ m i I W A X 7«0 i F 3 ii* m it n p n r n ] fiiifn r m 1.211 ( t S i T M A X * _ W U J U J L iJ L h J U J L iJ lil Package 1 16-Laad Hermetic DIP N S Package Number J1 6 A

208H

Contextual Info: 2. M e c h a n ic a l D im e n s i o n s : S ch e m atic: 3.2 Max 0.2 118r i Notesi 1. SDlderabllity: Laads shall m ast M IL -ST D -2 0 2 G , Method 208H for solderabillty. 2. Rammablirty: U L94V-0 3. Electrical Specification: OCL: 10 u H ± 2 0 % 3 . AST M

CMNT3906E

Contextual Info: ¡ei S e m ic o n d u c to r C o rp . S i V C E S A T H f t W 60V, 200mA TLP Tiny Laadlass Package fEMTOminr CET3904E (NPN) CET3906E (PNP) CMBT3904E (NPN) CMBT3906E (PNP) SOT-883L SOT-923 TEÌSL0B 1.05mm x 0.65mm x 0.4mm ( g / t ) 1.1 mm x 0.65mm x 0.41 mm

Contextual Info: 1. Mechanical Dimensions: 3. E l e c t r i c a l S p e c i f i c a t i o n s : @25°C OCL: 40.0uH±20% @0.1 MHz, 1.0V DCR: 0 .2 1 6 O hm s Max Isat: 2.00 Adc O B 7 .5 0 Max Notes! 1 , Solderablllty: Laade shall m ast M IL -S T D -2 0 2 G , Method 2D8H fo r solderability.

Contextual Info: 1. M e c h a n ic a l D im e n s i o n s : 2. S c h e m a tic : I—12.Q±D.3 3. E l e c t r i c a l S p e c i f i c a t i o n : 1 . Soldsrab illtyi Laada shall m e e t M IL - S 7 D - 2 0 2 , Method 20BD fo r saldBrabllity, OCL: 47u H ±2 0 % @1 KHz, 0.1V

jh capacitors

Abstract: n 332 ab
Contextual Info: MINIATURE ALUMINUM ELECTROLYTIC CAPACITORS • Ammo TAPING • Lead Taping Capacitors for Automatic Insertion DIMENSIONS Unit;mm A pplicable Drawing No. I Id Symbol Tolerance D escription 03 04 I 0 6.3 05 05 7 , 9, 11 08 9, 11.5 1 5,2 0 L *Note 5 5 ,7 Laad Dia.

2SK1973

Abstract: d 5072 transistor 2S01766 2S02211 2s01664 2sb1516 2S01781K 2sc4912 2SA103G 2SK2307
Contextual Info: Transistor Quick reference I Laadad p P a g e lli Package-Application Vceo V * * y,CES * * *w CER Vn«w Application EM3 UMT 2SC4081LN 40 Low Noise I 50 25 60 Package | Part No. f 2SA1037AKLN(E) SMT / 2SA1774 \2 S C 4 6 1 7 120 2SC4723 /2SA 1576A V2SC3722K

V5.5MLA1206T23

Contextual Info: b3E D • 43G5571 004fl4b2 ITT « H A S ML Series 33 HARR IS SE MI C O N D SE CT OR Multilayer Transient Surface Mount Surge Suppressors AuQust 1993 Features • Laadless Chip Form - Zero Lead Inductance • Multilayer Surface Mount Surge Suppressor • +125°C Continuous Operating Temperature

Contextual Info: PACKAGE OUTLINES A k - .<25 — Lead C eniar to Canter o - o T irt « 1 (+ ) 0 / Clearance hole lo r num ber 6 screw 1 K-25 4 MAX. C r— .<25 — I Laad C antar to Cantar T o (- ) o X T " ' T Claaranca hole for num ber 6 screw m (M .60 (*)Oy 6 0 -1

7ROM

Abstract: 7R0M vw-1 inductor
Contextual Info: 1. Mechanical Dimensions: 3. E l e c t r i c a l S p e c i f i c a t i o n s : @25°C OCL: 7.00uH±20% @1MHz, 1.0V DCR: 0 .0 2 4 O hm s Max Isat: 6.00 Adc O B 7 .5 0 Max Notes! 1, Solderablllty: Laade shall m ast M IL -S T D -2 0 2 G , Method 2D8H fo r solderability.

208H

Contextual Info: 1. M ech an ical D im en sion s: 2. S c h e m a tic : 1 o- 4 O- 3. E l e c t r i c a l S p e c i f i c a t i o n s : _d DCL: 1.5m H ±2 0% @1QKHz 0.1V, OAdc DCL: 950uH Typ @1 OKHz 0.1V, O.BAdc 1 DCR: 0 .4 6 0 Ohms Typ E 0 .2 5 0 B 0 .6 9 0 Max 1. Solderablllty: Laads shall m eat M IL -S T D -2 0 2 G .

tms4256

Abstract: TMS4266
Contextual Info: INSTR TM4256EL9, TM4256GU9 262,144 BY 9-BIT DYNAMIC BAM MODULES 7“-ifc-23-/7 25E D SEPTEMBER 1986 — REVISED M ARCH 1968 A SIC /MEMORY 262,144 x 9 Organization TM4266EL9 . . . L SMQLE-IN-UNE PACKAGE (TOP VIEWl_ Slngla 5-V Supply (10% Tolerance)

Contextual Info: 4. EXPLANATION OF RATINGS AND STANDARDS 4 -1 M axim um R ating* In general, the maximufn rating value should not be exceeded in order to guarantee the life and reliability of integrated circuit products. The Absolute Maximum Rating should not be exceeded even for a moment.

AX2022

Abstract: TACT2150 D6142
Contextual Info: TACT2150 512 X 8 CACHE ADDRESS COMPARATOR D 2 9 9 3 . JA N U A R Y 1 9 8 7 - R E V IS E D SEPTEM BER 1967 Address to MATCH Valid Time TACT2150-20 . . . 20 ns max TACT2150-30 . . . 30 ns max DW, JD . OR NT PACKAGE 300-Mil 24-Pin Ceramic Side-Brazed or Plastic Dual-In-Line or Small Outline

1ss nec

Contextual Info: PRELIM INARY DATA S H E E T MOS IN TEGRATED CIRCUIT MC-428LFF72 3.3 V OPERATION 8 M-WORD BY 72-BIT DYNAMIC RAM MODULE BUFFERED TYPE, HYPER PAGE MODE EDO Description Th e M C-428LFF72 1« • 6.388,608 words by 72 bits dynam ic RAM m oduli on which 8 pieces of 84 M DRAM :

27c eeprom

Abstract: 27C291 74TTL
Contextual Info: 0^1755 DG77HS TMS27C291, TMS27C292 16,384-BIT UV ERASABLE PROGRAMMABLE READ-ONLY MEMORIES TMS27PC291 16,384-BIT PROGRAMMABLE READ ONLY MEMORY SEPTEMBER 1988-R EV ISED APRIL 1988 • Single 5-V Power Supply • Pin Compatible with Existing 2K x 8 BIpolar/High-Speed CMOS EPROMs

KBU605 S

Abstract: KBP205G s8250 SB807 SB606 tec w04
Contextual Info: : : IJJB IJ [ i U M i Y m\&mm& SURGE TORT NUMBER .The Surge line of bridge rectifiers providep numerous benefits for engineers who fiee0 to maintain a tight control over power tn their prirtect arcuit boards -Highly automated, high volume manu­ facturing allows us to provide extremely

Siemens A 1458

Abstract: FET marking code 365
Contextual Info: SIEMENS CLY15 GaAs FET Datasheet * Power am plifier for mobile phones * For frequencies from 400 MHz to 2.5 GHz 'O p e ra tin g voltage range: 2.7 to 6 V * P ^ at V 0=3V, f= 1.8 GHz typ. 31.5 dBm * Efficiency better 50% s s ~ /7 / d ^ ESD: G Electrostatic discharge sensitive device,

IC HXJ 2038

Abstract: 1N52398 DB5T tfk 102 cny 70 hxj 2038 rca 40361 transistor rca 40362 TFK 680 CNY 70 Diode Equivalent 1N34A 2n5952 equivalent
Contextual Info: The Engineering Staff of TEXAS INSTRUMENTS INCORPORATED Components Group The T ransistor and Diode Data Book for Design Engineers T e x a s In s t r u m e n t s IN CO RPO RATED TYPE NUMBER INDEX GLOSSARY TRANSISTOR SELECTION GUIDES TRANSISTOR INTERCHANGEABILITY

LM373

Abstract: MC1303L LM566 "direct replacement" transistor BD 540 LYS MFC6030 LM566 equivalent LM3039 SN72558P LM370 SN72741P
Contextual Info: Edge Index by Product Family Here is the new Linear Data Handbook from National. It gives complete specifications for devices useful in building nearly all types of electronic systems, from communica­ tions and consumer-oriented circuits to precision instrumentation and computer designs.

siemens sab 82532

Abstract: 82258 SA 82532 SAB 80286 csc 2323 sab80286 STT 3 SIEMENS 80286 microprocessor pin out diagram ESCC2 siemens sab 82525
Contextual Info: SIEM ENS Enhanced Serial Communication Controller ESCC2 SAB 82532 Preliminary Data 1.1 CMOS 1C General Features S erial Interface • Two independent full duplex serial channels - On chip clock generation or external clock source - On chip DPLL for clock recovery of each

TI597

Contextual Info: am îec BTH—060—01-L-D BTH-120-01-F -D BTH -030-01-F-D II Mates with: BSH M ate ria ls : In s u la to r M a te ria l: L iq u id C ry s ta l P o ly m e r T e rm in al M a te ria l: P h o s p h o r B ro n z e C u rr e n R a tin g : T e s tin g N ow ! P la tin g

FMD3005

Abstract: pf500a
Contextual Info: Pulse* FEE A T E C H N I T R O L C O M P A N Y FM D S ériés Surface Mount Inductors Inductances CMS Key Features Caractéristiques E lectrical s p e c ific a tio n s at 25°C Suited for main reflow soldering processes: IR and vapor phase I dc amps L nH

Contextual Info: ThomasëBetts TWo-Piece Connectors Inverse DIN TYPE R/2 MALE CONNECTOR SERIES 21 T O LR92984 E60980 P h y s ic a l P r o p e r t ie s I n s u la tio n M a t e r ia l: Glass filled thermoplastic rated UL 94V-0 1.7561 C o l o r : Gray 2.54 C o n t a c t s : Copper alloy, nickel plate overall,