LAND PATTERN 0805 Search Results

land pattern 0805

Abstract: 0402 land pattern land pattern 1812 0402 0603 0805 1206 0402 0603 0805 land
Contextual Info: APPLICATION NOTE RECOMMENDED LAND PATTERN NMC CHIP CERAMIC CAPACITOR Land Pattern NMC C < >< D > A < > B Solder Resist 1. Flow Soldering SIZE 0402 0603 0805 1206 1210 1812 2225 A NA 0.8 ~ 1.0 0.8 ~ 1.4 1.8 ~ 2.4 1.8 ~ 2.4 2.5 ~ 3.2 N/A B NA 2.6 ~ 3.2 3.0 ~ 4.0

1206 land pattern

Abstract: NOMCA MPMA HTRN
Contextual Info: Land Patterns www.vishay.com Vishay Dale Thin Film Vishay Dale Thin Film Land Patterns 1. Scope This technical note provides sample land patterns for Vishay Dale Thin Film SMT resistive products. The following drawings are based on IPC-SM-782 Surface Mount Design and Land Pattern Standard. These drawings are for reference only Vishay Thin

land pattern 0805

Abstract: 0402 0603 0805 land
Contextual Info: 4/2/02 http:www.niccomp.com Technical Inquiries: tpmg@niccomp.com SOLDERING LAND PATTERNS PRODUCTS: NRC SERIES, THICK FILM CHIP RESISTORS SOLDERING LAND PATTERN DIMENSIONS mm SIZE 0201 0402 0603 0805 1206 1210 2010 2512 A 0.3~0.4 0.5~0.6 0.8~1.0 1.2~1.4

01005 land pattern

Abstract: 0402 land pattern
Contextual Info: NMC SERIES - LAND PATTERN DIMENSIONS Component Outline D Solder Resist A C Land Pads B 1. Flow Soldering Dimension mm A B C D 0603 0.8 ~ 1.0 2.6 ~ 3.2 0.7 ~ 0.8 0.8 ~ 1.2 Size 1206 1.8 ~ 2.4 4.2 ~ 5.2 1.2 ~ 1.6 0.9 ~ 1.7 1210 1.8 ~ 2.4 4.2 ~ 5.2 1.8 ~ 2.5

W709

Abstract: 0805FT
Contextual Info: 0805FT MINIATURE RF CHIP INDUCTORS Designed for Wireless Products Wirewound ferrite core construction High Inductance values and low RDC Tin/lead terminations Industry standard 0805 2012 surface mount land pattern Electrical Specifications @ 25°C Part Number

Contextual Info: WIRE-WOUND RF CHIP INDUCTORS - 0805FT SERIES Wirewound ferrite core construction High Q values and self resonant frequency Industry standard 0805 2012 surface mount land pattern See page 3 for Competition Cross Reference Electrical Specifications @ 25°C

Contextual Info: WIRE-WOUND RF CHIP INDUCTORS - 0805CD SERIES Wirewound ceramic core construction High Q values and self resonant frequency Industry standard 0805 2012 surface mount land pattern See page 3 for Competition Cross Reference Electrical Specifications @ 25°C

Contextual Info: Ver. 201306 Multilayer Power Inductor CIG21L Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances

Contextual Info: WIRE-WOUND RF CHIP INDUCTORS - 0805CM SERIES Wirewound ceramic core construction High Q values and self resonant frequency Industry standard 0805 2012 surface mount land pattern See page 3 for Competition Cross Electrical Specifications @ 25°C Part Number

0071.3061.A2

Contextual Info: WIRE-WOUND RF CHIP INDUCTORS - 0805CM SERIES Wirewound ceramic core construction High Q values and self-resonant frequency Industry standard 0805 2012 surface mount land pattern Refer to page 3 for Competition Cross Reference Electrical Specifications @ 25°C

Contextual Info: WIRE-WOUND RF CHIP INDUCTORS - 0805CM SERIES Wirewound ceramic core construction High Q values and self-resonant frequency Industry standard 0805 2012 surface mount land pattern Refer to page 3 for Competition Cross Reference Electrical Specifications @ 25°C

Contextual Info: Ver. 201207 Multilayer Power Inductor CIG21F Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Much lower Profile than any other series (0.5mm max) Low DC resistance Magnetically shielded structure

Contextual Info: Ver 201305 Chip Bead For EMI Suppression CIB/CIM21 Series 2012/ EIA 0805 APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN 0.8~1.2mm Perfect shape for automatic mounting, with no directionality.

Contextual Info: Ver. 201007 Multilayer Power Inductor CIG21F Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Much lower Profile than any other series (0.5mm max) Low DC resistance Magnetically shielded structure

Contextual Info: Ver. 201306 Multilayer Power Inductor CIG21F Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Much lower Profile than any other series (0.5mm max) Low DC resistance Magnetically shielded structure

Contextual Info: Ver. 201207 Multilayer Power Inductor CIG21W Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Low Profile (1.0mm max) Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances

A1t smd

Abstract: A2t diode smd SMD a1T Transistor A1t smd transistor smd A1T a1t diode RFBLN2012090A1T smd diode A1T smd transistor a1t VINCENT
Contextual Info: Walsin Technology Corporation SMD Balun-Unbalance Transformer RFBLN2012090A□T Series Patent Pending Multi Layer Chip BALUN – 2012 0805 For ISM Band 2.4GHz Application SOLDER LAND PATTERN FEATURES ƒ ƒ ƒ ƒ ƒ ƒ Figure LTCC ( Low Temperature Cofired Ceramics ) Technology

Contextual Info: Ver. 201306 Multilayer Power Inductor CIG21C Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Suit for small DC-DC converter and choke uses Magnetically shielded structure Free of all RoHS-regulated substances

inductor 2r2

Abstract: CIG21C2R2MNE
Contextual Info: Ver. 201011 Multilayer Power Inductor CIG21C Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Suit for small DC-DC converter and choke uses Magnetically shielded structure Free of all RoHS-regulated substances

land pattern 0805

Abstract: CIG21LR47MNE CIG21L4R7MNE CIG21LR47M CIG21L1R0MNE CIG21L3R3MNE land pattern 0805 inductor land pattern inductor 0805 CIG21L2R2MNE
Contextual Info: Ver. 201007 Multilayer Power Inductor CIG21L Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Super Low DC resistance Low Profile (1.0mm max) Magnetically shielded structure Free of all RoHS-regulated substances

Contextual Info: Ver. 201207 Chip Bead For High Current CIC21 Series 2012/ EIA 0805 APPLICATION Noise Suppression in power line FEATURES RECOMMENDED LAND PATTERN 0.8~1.2mm CIC series is used for high current. ) 0.9~1.6mm 0.6~1.2mm 0.6~1.2mm DIMENSION Type 21 Dimension [mm]

Contextual Info: Ver. 201207 Multilayer Power Inductor CIG21C Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Suit for small DC-DC converter and choke uses Magnetically shielded structure Free of all RoHS-regulated substances

Contextual Info: Ver. 201207 Multilayer Power Inductor CIG21L Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Super Low DC resistance Low Profile (1.0mm max) Magnetically shielded structure Free of all RoHS-regulated substances

Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Absolute Maximum Ratings Ambient Temperature 25°C : Properties Test conditions Power dissipation Peak Forward Current duty/10@1kHz Continuous Forward Current Reverse Voltage ESD Threshold/ Human Body Modell