LAND PATTERN FOR SOIC 16 Search Results

max232 free

Abstract: MAX249 AUO-M201.1F pdf MAX222CPN 90-0108 MAX232EJE 8 PIN Plastic DIP land pattern max233acw
Contextual Info: 19-4323; Rev 15; 1/06 +5V-Powered, Multichannel RS-232 Drivers/Receivers Next-Generation Device Features The MAX220–MAX249 family of line drivers/receivers is intended for all EIA/TIA-232E and V.28/V.24 communications interfaces, particularly applications where ±12V is

200123K

Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
Contextual Info: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These

si8540

Abstract: IA2410 sot-23 MARKING CODE G1 marking 611 mark G1 SOT-23
Contextual Info: Si8540 H I G H - S ID E C URRENT S ENSE A MPLIFIER Features  Complete, unidirectional high-side current sense capability  0.2% full-scale accuracy  +5 to +36 V supply operation  85 dB power supply rejection  90 µA max supply current 9 µA shutdown current

SC1302A

Abstract: SC1302B SC1302C
Contextual Info: SC1302A/B/C/D/E/F Dual High Speed Low-Side MOSFET Driver POWER MANAGEMENT Description Features ‹ +4.5V to +16.5V operation ‹ Fast rise and fall times 20ns typical with 1000pf load ‹ Dual MOSFET driver ‹ 2A peak drive current ‹ 40ns propagation delay

1206 land pattern

Abstract: NOMCA MPMA HTRN
Contextual Info: Land Patterns www.vishay.com Vishay Dale Thin Film Vishay Dale Thin Film Land Patterns 1. Scope This technical note provides sample land patterns for Vishay Dale Thin Film SMT resistive products. The following drawings are based on IPC-SM-782 Surface Mount Design and Land Pattern Standard. These drawings are for reference only Vishay Thin

D8025

Abstract: SC1302A SC1302B SC1302C
Contextual Info: SC1302A/B/C/D/E/F Dual High Speed Low-Side MOSFET Driver POWER MANAGEMENT Description Features ‹ +4.5V to +16.5V operation ‹ Fast rise and fall times 20ns typical with 1000pf load ‹ Dual MOSFET driver ‹ 2A peak drive current ‹ 40ns propagation delay

C1316C

Abstract: LPCC-16 land pattern for msOP 8 SOIC 8 pcb pattern jedec package MO-220 QFN-32 16 soic smd pcb footprint land pattern for TO 92 qfn 32 land pattern qfn32 land pattern land pattern for msOP 10
Contextual Info: Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and Packaging Electronic Circuits surface

land pattern for TSsOP 16

Abstract: 8 PIN Plastic DIP land pattern maxim 1584 land pattern for TSSOP 24 pin land pattern for TSSOP land pattern for SOIC 16
Contextual Info: 19-1539; Rev 0; 2/00 High-Speed, Single-Supply, Quad, SPST Analog Switches Features Applications Test Equipment Sample-and-Hold Circuits Disk Drives Guidance and Control Systems Tape Drives Military Radios Audio and Video Communications Systems Switching PBX, PABX

SOIC127P1032X265-16AN

Abstract: soic16 land pattern SI8606 RF transmitter SOIC 8 narrow body pcb pattern narrow body SOIC 8 pcb pattern
Contextual Info: Si860x B IDIRECTIONAL I 2 C I SOLA TORS WITH U NIDIRECTIONAL D IGITA L C HANNELS Features  Independent, bidirectional SDA and SCL isolation channels Open drain outputs with 35 mA sink current  High electromagnetic immunity  Wide operating supply voltage

qfn 32 land pattern

Abstract: hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782
Contextual Info: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and

Contextual Info: SC1302A/B/C/D/E/F Dual High Speed Low-Side MOSFET Driver POWER MANAGEMENT Description Features ‹ +4.5V to +16.5V operation ‹ Fast rise and fall times 20ns typical with 1000pf load ‹ Dual MOSFET driver ‹ 2A peak drive current ‹ 40ns propagation delay

SI8606

Abstract: Si86 SOIC127P1032X265-16AN
Contextual Info: Si860x B IDIRECTIONAL I 2 C I SOLA TORS WITH U NIDIRECTIONAL D IGITA L C HANNELS Features  Independent, bidirectional SDA and SCL isolation channels Open drain outputs with 35 mA sink current  High electromagnetic immunity  Wide operating supply voltage

tssop 16 exposed pad stencil

Abstract: C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern
Contextual Info: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and

Contextual Info: SC1302A/B/C/D/E/F Dual High Speed Low-Side MOSFET Driver POWER MANAGEMENT Description Features ‹ +4.5V to +16.5V operation ‹ Fast rise and fall times 20ns typical with 1000pf load ‹ Dual MOSFET driver ‹ 2A peak drive current ‹ 40ns propagation delay

SOIC127P1032X265-16AN

Contextual Info: Si860x B IDIRECTIONAL I 2 C I SOLA TORS WITH U NIDIRECTIONAL D IGITA L C HANNELS Features  Independent, bidirectional SDA and SCL isolation channels Open drain outputs with 35 mA sink current  High electromagnetic immunity  Wide operating supply voltage

SC1302E equivalent

Contextual Info: SC1302A/B/C/D/E/F Dual High Speed Low-Side MOSFET Driver POWER MANAGEMENT Description Features ‹ +4.5V to +16.5V operation ‹ Fast rise and fall times 20ns typical with 1000pf load ‹ Dual MOSFET driver ‹ 2A peak drive current ‹ 40ns propagation delay

SC1302A

Abstract: SC1302B SC1302C
Contextual Info: SC1302A/B/C/D/E/F Dual High Speed Low-Side MOSFET Driver POWER MANAGEMENT Description Features ‹ +4.5V to +16.5V operation ‹ Fast rise and fall times 20ns typical with 1000pf load ‹ Dual MOSFET driver ‹ 2A peak drive current ‹ 40ns propagation delay

SOD-323 land pattern

Abstract: SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern
Contextual Info: Application Note Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and

si87xx

Abstract: LGA8 si8710 SI8710CD-B-IS si8711 GW marking code diode K 2611 MOSFET VOLTAGE RATING HCPL-261X ACPL-W611 Pin-compatible, drop-in upgrades for popular
Contextual Info: Si87xx 5 K V L E D E M U L A T O R I N P U T , O P E N C O LL EC TO R OUTPUT ISOLATORS Features  Pin-compatible, drop-in upgrades for  popular high-speed digital  optocouplers   Performance and reliability  advantages vs. optocouplers Resistant to temperature, age and 

A 3120 opto

Abstract: A 3120 opto coupler HPCL 3120 narrow body SOIC 8 pcb pattern AVAGO MARKING E4 IGBT driver hcpl3120 HPCL0302 SI8221CC-A-IS HPCL3120 HPCL-0302
Contextual Info: S i 8 2 2 0/21 0 . 5 A N D 2 . 5 A M P I S O D R I V E R S W I T H O PT O I N P U T 2.5, 3.75, AND 5.0 KVRMS Features  Functional upgrade for HCPL-0302, HCPL-3120, TLP350, and similar opto-drivers  60 ns propagation delay max (independent of input drive current)

HPCL-3120

Abstract: HPCL3120 A 3120 opto HPCL 3120 SOIC127P1032X265-16AN 3120 8 pin optocoupler A 3120 opto coupler opto cross reference avago si8220bb-a-is 60601-1
Contextual Info: S i 8 2 2 0/21 0 . 5 A N D 2 . 5 A M P I S O D R I VE R S W I T H O P T O I N P U T 2.5, 3.75, AND 5.0 KV RMS Features  Functional upgrade for HCPL-0302, HCPL-3120, TLP350, and similar opto-drivers  60 ns propagation delay max (independent of input drive current)

Contextual Info: S i 8 7 1 x/2x 5 K V L E D E MU LAT OR I NPUT , L O G I C O UTPUT I SOLATORS Features  High Speed: dc to 15 Mbps   2.5 to 5.5 V logic output  Pin-compatible, drop-in upgrades for popular high-speed digital  optocouplers   Performance and reliability

Contextual Info: Si87xx 5 K V LED E MULATOR I N PU T , O PEN C OLLECTOR O UTPUT I SOLA TORS Features  Pin-compatible, drop-in upgrades for  popular high-speed digital  optocouplers   Performance and reliability  advantages vs. optocouplers Resistant to temperature, age and 

Contextual Info: S i 8 2 2 0/21 0 . 5 A N D 2 . 5 A M P I S O D R I VE R S W I T H O P T O I N P U T 2.5, 3.75, AND 5.0 KV RMS Features  Functional upgrade for HCPL-0302, HCPL-3120, TLP350, and similar opto-drivers  60 ns propagation delay max (independent of input drive current)