LAND PATTERN SO18W Search Results

LAND PATTERN SO18W Result Highlights (5)

Part	Manufacturer	Description
BQ2052SN-A515	Texas Instruments	Primary Lithium Gas Gauge W/High-Speed 1-Wire (HDQ) Interface, 3 Prgmable LED Patterns 16-SOIC -20 to 70
CSD83325L	Texas Instruments	12V, N ch NexFET MOSFET™, dual LGA, 5.9mOhm 6-PICOSTAR
CSD87501L	Texas Instruments	30V, N ch NexFET MOSFET™, dual common drain LGA, 5.5mOhm 10-PICOSTAR
CSD87381P	Texas Instruments	30V, Nch synchronous buck NexFET MOSFET™, 3x2.5 LGA, 15A 5-PTAB -55 to 150
CSD23381F4	Texas Instruments	-12V, P ch NexFET MOSFET™, single LGA 0.6x1.0, 175mOhm 3-PICOSTAR -55 to 150

LAND PATTERN SO18W Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
land pattern ssop28 Abstract: SO18W IPC-SM-782 SSOP-20 land pattern so18w SSOP20 LAND PATTERN Contextual Info: SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Factors to consider when determining the dimensions of the solder pads include part dimension tolerances, PCB production tolerances, and accuracy-of-placement tolerances. Figure 2 shows how placement accuracy can affect solder	Original		PDF
land pattern ssop28 Abstract: SO18W SSOP20 LAND PATTERN so24w SO20w package 11-365 land pattern for SSOP smd sot 23/5 IPC-SM-782 SSOP-20 Contextual Info: SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Factors to consider when determining the dimensions of the solder pads include part dimension tolerances, PCB production tolerances, and accuracy-of-placement tolerances. Figure 2 shows how placement accuracy can affect solder	Original		PDF
land pattern ssop28 Abstract: land pattern for SSOP16 SBFA015A SSOP20 LAND PATTERN land pattern so18w SO18 TI smd sot 23/5 IPC-SM-782 so24w land pattern for SSOP56 Contextual Info: Application Report SBFA015A - January 1998 - Revised May 2003 SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Cost and performance requirements continue to push the packaging of electronic systems into smaller and smaller spaces. At one time, the standard center-to-center pin spacing was 100 mils 0.1" on through-hole parts (DIPs).	Original	SBFA015A land pattern ssop28 land pattern for SSOP16 SSOP20 LAND PATTERN land pattern so18w SO18 TI smd sot 23/5 IPC-SM-782 so24w land pattern for SSOP56	PDF

Catalog Datasheet

Type

Document Tags

PDF

land pattern ssop28

Abstract: SO18W IPC-SM-782 SSOP-20 land pattern so18w SSOP20 LAND PATTERN
Contextual Info: SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Factors to consider when determining the dimensions of the solder pads include part dimension tolerances, PCB production tolerances, and accuracy-of-placement tolerances. Figure 2 shows how placement accuracy can affect solder

Original

PDF

land pattern ssop28

Abstract: SO18W SSOP20 LAND PATTERN so24w SO20w package 11-365 land pattern for SSOP smd sot 23/5 IPC-SM-782 SSOP-20
Contextual Info: SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Factors to consider when determining the dimensions of the solder pads include part dimension tolerances, PCB production tolerances, and accuracy-of-placement tolerances. Figure 2 shows how placement accuracy can affect solder

Original

PDF

land pattern ssop28

Abstract: land pattern for SSOP16 SBFA015A SSOP20 LAND PATTERN land pattern so18w SO18 TI smd sot 23/5 IPC-SM-782 so24w land pattern for SSOP56
Contextual Info: Application Report SBFA015A - January 1998 - Revised May 2003 SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Cost and performance requirements continue to push the packaging of electronic systems into smaller and smaller spaces. At one time, the standard center-to-center pin spacing was 100 mils 0.1" on through-hole parts (DIPs).

Original

SBFA015A land pattern ssop28 land pattern for SSOP16 SSOP20 LAND PATTERN land pattern so18w SO18 TI smd sot 23/5 IPC-SM-782 so24w land pattern for SSOP56

PDF