LANDING Search Results

Contextual Info: General Information www.vishay.com Vishay Siliconix Useful Web Links COMPARE MOSFET PACKAGES www.vishay.com/mosfets/tapereel-package-list/ FEATURED MOSFET FAMILIES CHECK DISTRIBUTOR STOCK

AN5452

Abstract: HSIP012-P-0000
Contextual Info: ICs for TV AN5452 IC for landing correction • Overview Unit: mm 5.8±0.25 7.9±0.3 12 11 10 φ3.3 ■ Features • Built-in power amplifier ±200 mA • Low standby current (typ.: 2 mA) • Incorporating 2 circuits 3.5±0.25 1.2±0.25 0.5±0.1 1.2±0.25

CCMJ-14C-EL

Contextual Info: CCM-J The CCMJ-014C-E with an ejector mechanism and landing system opens new opportunities for future on board applications. It offers higher reliability, durability, maximized space savings, and easy installation. Higher performance in the most compact design.

gmZ2A

Abstract: gmFC1A GMZ3 Genesis gmZ2A GENESIS 1100 Genesis microchip dat Genesis Microchip osd tvga GENESIS
Contextual Info: DATA SHEET gmZ3A DAT-1009-A September 1999 Genesis Microchip 165 Commerce Valley Dr. West, Thornhill, ON Canada L3T 7V8 Tel: 905 889-5400 Fax: (905) 889-0035 1871 Landings Drive •Mountain View •CA •USA •94043 •Tel: (650) 428-4277 •Fax: (650) 428-4288

W8X00

Contextual Info: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; SEE TABLE 1 FOR LAND PAD AND SOLDER MASK COORDINATES; SEE TABLE 2 FOR SOLDER PASTE STENCIL COORDINATES. 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES

FR4 SUBSTRATE SHEET

Abstract: 0343
Contextual Info: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. UNDERFILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES

DS1822X

Contextual Info: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. UNDERFILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES

Contextual Info: Amphenol Card Readers C702D Landing Contact Super-flat Full Smart Card Connectors Second generation Push-Pull connectors with a high degree of miniaturization. Electrical - < 30 mΩ - < 40 mΩ - > 109 Ω - 500VAC 1 min Environmental - -25ºC thru 65ºC

en2997

Abstract: abs sensor
Contextual Info: EN2997 Hermetic Connectors Compact Low Profile Connectors with High Hermeticity Performance Adapted to sensor applications under high aeronautical constraints, such as engine & landing gear environments. High performance solution High hermeticity performance

Contextual Info: Insert Magnetic/IC Card Reader 3S4YR-SGR Compact Insert Reader with Magnetic and IC Card Interface Ideally suited for applications using hybrid magnetic stripe and IC cards • Landing-style IC contact supports both ISO and CP8 chip contact locations ■ Red and green LEDs for operation

GWS servo

Abstract: GWS servo mini std GWS mini STD gws micro servo GWS servo heavy duty gws micro servo mini std GWS mini servo sail winch Micro Servo hp mini
Contextual Info: SUB-MICRO SERVO Page 1 of 1 Update : 05/05/06 SUB MICRO MICRO MINI HP & CL STANDARD HEAVY DUTY SAIL WINCH SAT T.O.C Low Profile & Landing Gear retract MENU SUB-MICRO SERIES Model STD BB US MRP$ PICO v v PICO+ F NARO v NARO HP v v NARO+F HP NARO PRO NARO MAX

genesis

Abstract: gmz1cq4 genesis video controller DAT-0001-C Genesis GmFC1 tvga RGB pixel clock MSD-0004 Marking code mps Genesis Gmz1
Contextual Info: BACK Data Sheet gmZ1 DAT-0001-C April 5 1998 Genesis Microchip 200 Town Centre Blvd. •Suite 400 •Markham •ON •Canada •L3R 8G5 •Tel: 905 470-2742 •Fax: (905) 470-9022 2071 Landings Drive •Mountain View •CA •USA •94043 •Tel: (650) 428-4277 •Fax: (650) 428-4288

10.1 inch lcd with led backlight 40 pin connector pinout

Abstract: RV801 34 PIN FRC female CONNECTOR DP701 genesis LED chip Size Genesis Gmz1 AA11SB6C-ADFD AA11SB6C sharp lcd panel pinout JP801
Contextual Info: BACK User Guide Z1FCEV Reference Design FRC LCD Controller Board SED- 0068- C March 1998 Genesis Microchip 200 Town Centre Blvd.•Suite 400•Markham •Ontario •L3R 8G5 •Canada •Tel: 905 470-2742 •Fax: (905) 470-9022 2071 Landings Drive •Mountain View •California •94043 •USA •Tel: (650) 428-4277 •Fax: (650) 428-4288

schematic lcd inverter samsung

Abstract: AA11SB6C-ADFD lt121s1-153 nec lcd inverter schematic schematic logic board lcd monitor samsung 18,5 in samsung lcd inverter pinout LVDS connector 20 pins LCD FUJITSU 12.1 sharp lvds connector pinout RV801 LQ10DS05
Contextual Info: BACK Application Note Interfacing Genesis Microchip gmZ1 Reference Designs to LCD Panels MSD-0021-A Genesis Microchip Inc. 200 Town Centre Blvd, Suite 400, Markham, ON Canada L3R 8G5 Tel: 905 470-2742 Fax: (905) 470-9022 2071 Landings Drive, Mountain View, CA, USA 94043 Tel: (650) 428-4277 Fax (650) 428-4288

Contextual Info: 1136 ITT - CCM Catalog 11/20/00 12:29 PM Page 64 CCM-J The CCMJ-014C-E with an ejector mechanism and landing system opens new opportunities for future on board applications. It offers higher reliability, durability, maximized space savings, and easy installation. Higher

Contextual Info: Smart Card CCM-J T he CCMJ-014C-E with an ejector mechanism and landing system opens new opportunities for future on board applications. It offers higher reliability, durability, maximized space savings, and easy installation. This product delivers higher

iso 7811-1

Abstract: lock solenoid omron MAGNETIC HEAD 7610-5002Sc iso 7811 ISO7810 V4AF-0J-01V omron MAGNETIC card reader HEAD
Contextual Info: R Manual Hybrid Card Reader V4AF Compact Manual Magnetic Stripe and IC Card Reader with RS-232C Interface H Ideal for applications using magnetic and/or smart cards H Supports transmission protocols T=0 and T=1; also supports EMV H Landing contact method ensures longer

Contextual Info: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. U N D ER FILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. NUMBER LAND PAD CONNECTIONS AND CENTER COORDINATES

underfill

Abstract: DS2417X FR4 substrate ds2417
Contextual Info: NOTES: 1. 2. DIMENSIONS: LASER MARK MM [IN C H ] 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR CONNECTIONS AND COORDINATES, SEE TABLE 1 4. PAD UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES MILUMETERS

Contextual Info: CCM Smart Card Connectors CCM02 FEATURES CCM02 Smart Card Connectors are designed for intensive use. Low-profile, landing type contacts with virtually zero insertion force provide an extended life of greater than 200,000operations. Card integrity is enhanced

Contextual Info: SMA_ Phase Adjustable Connectors Amphenol DESCRIPTION SPECIFICATIONS* For phase array radar, test equipment, ILS landing systems and other instrumentation using phase matching techniques, these SMA connectors for semi-rigid coaxial cables and the

iec 512

Abstract: CCM02-1NO-35 Cannon connectors CCM02-1N0-3 CCM02-1N0-32 CCM02-1N0-35 mk marking code
Contextual Info: CCM02 MK I CCM02 MK I is a connector with landing contacts. Features • Available with 8 through hole contacts. • 100,000 card insertion cycles. • The contacts do not touch the card until it is almost fully inserted a minimal wiping action removes any non-conductive material.

Cannon connectors

Abstract: IEC C8 connector CCM01-2253 CECC00802 CCM01-2064 CCM01-2065 CCM01-2251
Contextual Info: CCM01 MK II EMVTM compatible The CCM01 MK II connectors with fixed contacts have been developed for applications where a landing contact mechanism is not required but performance and reliability are still key considerations. Features • Available with 8 contacts which are

CCM02-1NO-32

Contextual Info: CCM02 MK I CCM02 MK I is a connector with landing contacts. Features • Available with 8 through hole contacts. • 100,000 card insertion cycles. • The contacts do not touch the card until it is almost fully inserted a minimal wiping action removes any non-conductive material.