LASER D255 Search Results

-20/lucent laser D2526

Contextual Info: Data Sheet September 1998 group Lucent Technologies Bell Labs Innovations D2570, D2526, D2555 Wavelength-Selected Laser 2000 Direct Modulated Isolated DFB Laser Module Applications • T h re e d irect-m odulated DW DM fam ilies available to m eet a num ber of O C -4 8 /S T M -1 6 applications

lucent laser D2526

Abstract: d2526 lucent Lucent D2570 d2526 -20/lucent laser D2526 2526G lucent tunable laser
Contextual Info: Data Sheet 1998 September m n i• c sa g r o u p ■ ■■i■c r■ov ce l■ec c t r■own y' Lucent Technologies Bell Labs Innovations D2570, D2526, D2555 Wavelength-Selected Laser 2000 Direct Modulated Isolated DFB Laser Module Applications ■ T hree d irect-m odulated DW DM fam ilies available

cw DWDM laser 1610

Abstract: D2570H25 D2555 D2570 STM-16 agere photodiode D2526G910
Contextual Info: AdLib OCR Evaluation systems a ' e re 8 Data Sheet, Rev. 3 July 2001 132570, 132526, D2555 Wavelength-Selected Direct Modulated Isolated DFB Laser Module Applications . Three direct-modulated DWDM families available to meet a number of OC-48/STM-16 applications :

D2570H35

Abstract: D2570H36 D2570H909 D2526t D2526G910 D2570H33
Contextual Info: Data Sheet March 2001 D2570, D2526, D2555 Wavelength-Selected Direct Modulated Isolated DFB Laser Module Applications • Three direct-modulated DWDM families available to meet a number of OC-48/STM-16 applications: — Extended reach 100 km — Very long reach (170 km)

Lucent D2526G910

Abstract: lucent laser D2526 D2526t Lucent D2570 D2526G21 532 nm laser diode D2526G24 D2526G910 LUCENT lucent DFB laser application d2526 lucent
Contextual Info: Data Sheet August 2000 D2570, D2526, D2555 Wavelength-Selected Direct Modulated Isolated DFB Laser Module Applications • Three direct-modulated DWDM families available to meet a number of OC-48/STM-16 applications: — Extended reach 100 km — Very long reach (170 km)

transistor tl 187

Abstract: d2526 triquint 532 nm laser diode 74HC138 MSI CMOS D2570H28 lb 1551 D2526t D2526G910 D257 D2570H34
Contextual Info: Data Sheet, Rev. 3 February 2003 TriQuint Optoelectronics D2570, D2526, D2555 Wavelength-Selected Direct Modulated Isolated DFB Laser Module Applications • uint OR TSrEiMQICONDUCT 0H D257 ® t OR uOiNnDUCT G Q i TrSEMIC 2526 TriQ SE MIC uin O ND t D2

Lucent D2570

Abstract: lucent laser D2526 Lucent D2526G910 D2526t D2526G910 LUCENT D2555-type OPTO ISOLATOR TL D2526 D2555 D2570H25
Contextual Info: Data Sheet February 2000 D2570, D2526, D2555 Wavelength-Selected Direct Modulated Isolated DFB Laser Module Applications • Three direct-modulated DWDM families available to meet a number of OC-48/STM-16 applications: — Extended reach 100 km — Very long reach (170 km)

Agere D2570

Abstract: D2526t D2570H28 D2526 D2555 D2570 STM-16 D25* laser D2570H25 agere photodiode
Contextual Info: Data Sheet, Rev. 3 July 2001 D2570, D2526, D2555 Wavelength-Selected Direct Modulated Isolated DFB Laser Module Applications • Three direct-modulated DWDM families available to meet a number of OC-48/STM-16 applications: — Extended reach 100 km — Very long reach (170 km)

"Air Flow Sensor"

Abstract: 101B SDT101 SDT101B air flow sensor
Contextual Info: THERMAL SENSORS / CIRCUIT PROTECTORS Thermal sensors Thin film platinum sensor AXIAL SDT101 STRUCTURE 1 2 3 4 5 6 Thin Pt film on ceramic core End caps Laser cuts Copper lead wire SnCu type A Ni (type B) Epoxy resin (type A) Polyimide resin (type B) Marking (only type A)

RK73N

Abstract: 10K 103 variable resistor
Contextual Info: RESISTORS TECHNOLOGY OF TOMORROW FLAT CHIP TRIMMABLE THICK FILM RK73N STRUCTURE 1 2 3 4 5 6 7 8 Ceramic substrate Top termination Ag Pd Bottom termination (Ag Pd) Resistive layer Glass layer End termination Diffusion barrier (Ni) End termination (SN 90% / Pb 10 %)

Contextual Info: RESISTORS FLAT CHIP TRIMMABLE THICK FILM RK73N STRUCTURE 1 2 3 4 5 6 7 8 Ceramic substrate Top termination Ag Pd Bottom termination (Ag) Resistive layer Glass layer End termination Diffusion barrier (Ni) End termination IDENTIFICATION TYPE COATING COLOR

RK73N

Abstract: resistor trimmable transistor w2h RK73N2A
Contextual Info: FLAT CHIP TRIMMABLE THICK FILM RK73N STRUCTURE 1 2 3 4 5 6 7 8 Ceramic substrate Top termination Ag Pd Bottom termination (Ag) Resistive layer Glass layer End termination Diffusion barrier (Ni) End termination IDENTIFICATION TYPE COATING COLOR MARKING RK73N

RK73N

Contextual Info: RESISTORS FLAT CHIP TRIMMABLE THICK FILM RK73N STRUCTURE 1 2 3 4 5 6 7 8 Ceramic substrate Top termination Ag Pd Bottom termination (Ag Pd) Resistive layer Glass layer End termination Diffusion barrier (Ni) End termination IDENTIFICATION TYPE COATING COLOR

Contextual Info: RESISTORS FLAT CHIP TRIMMABLE THICK FILM RK73N STRUCTURE 1 2 3 4 5 6 7 8 Ceramic substrate Top termination Ag Pd Bottom termination (Ag Pd) Resistive layer Glass layer End termination Diffusion barrier (Ni) End termination IDENTIFICATION TYPE COATING COLOR

MRGF16X

Contextual Info: NETWORKS Thick Film r-networks MINI FLAT PACKAGE MRGF16 STRUCTURE 2 1 2 3 4 5 1 Molded resin Ceramic substrate Resistive film Inner electrode Terminal 3 4 NETWORKS PASSIVE COMPONENTS 5 IDENTIFICATION COATING COLOR Black TYPE MRGF16 MARKING Products with Pb-free terminations

Contextual Info: RESISTORS TECHNOLOGY OF TOMORROW SURGE CURRENT THICK FILM SG73 RESISTORS FLAT CHIP STRUCTURE 1 2 3 4 5 6 7 8 9 Ceramic substrate Top termination Ag Pd Bottom termination (Ag Pd) Resistive layer Glass layer Protective layer End termination Diffusion barrier (Ni)

Contextual Info: RESISTORS TECHNOLOGY OF TOMORROW SURGE CURRENT THICK FILM SG73 RESISTORS FLAT CHIP STRUCTURE 1 2 3 4 5 6 7 8 9 Ceramic substrate Top termination Ag Pd Bottom termination (Ag) Resistive layer Glass layer Protective layer End termination Diffusion barrier (Ni)

Contextual Info: RESISTORS TECHNOLOGY OF TOMORROW SURGE CURRENT THICK FILM SG73 RESISTORS FLAT CHIP STRUCTURE 1 2 3 4 5 6 7 8 9 Ceramic substrate Top termination Ag Pd Bottom termination (Ag Pd) Resistive layer Glass layer Protective layer End termination Diffusion barrier (Ni)

Contextual Info: RESISTORS TECHNOLOGY OF TOMORROW SURGE CURRENT THICK FILM SG73 RESISTORS FLAT CHIP STRUCTURE 1 2 3 4 5 6 7 8 9 Ceramic substrate Top termination Ag Pd Bottom termination (Ag Pd) Resistive layer Glass layer Protective layer End termination Diffusion barrier (Ni)

Thermal Fuse 125V 5A

Contextual Info: THERMAL SENSORS / CIRCUIT PROTECTORS TECHNOLOGY OF TOMORROW CIRCUIT PROTECTORS CHIP CURRENT FUSE CCF STRUCTURE 1 Fuse elements 2 Fuse body 3 Electrode Cu solder plated Products with Pb-free terminations meet RoHS requirements IDENTIFICATION DIMENSIONS (mm)

Thermal Fuse 125V 5A

Contextual Info: THERMAL SENSORS / CIRCUIT PROTECTORS TECHNOLOGY OF TOMORROW CIRCUIT PROTECTORS CHIP CURRENT FUSE CCF STRUCTURE 1 Fuse elements 2 Fuse body 3 Electrode Cu solder plated Products with Pb-free terminations meet RoHS requirements IDENTIFICATION DIMENSIONS (mm)

notebook Universal LCD inverter

Abstract: IEC60127-4 marking 1F 1f44 1f55
Contextual Info: CIRCUIT PROTECTORS CIRCUIT PROTECTORS universal modular fuse-links CCF-UM STRUCTURE 1 Fuse elements 2 Fuse body 3 Electrode Cu solder plated All these products have Pb-free terminations and meet EU-RoHS and China-RoHS requirements IDENTIFICATION DIMENSIONS (mm)

593 60v

Abstract: UL248-14 E171 1N 50A marking ccf
Contextual Info: THERMAL SENSORS / CIRCUIT PROTECTORS CIRCUIT PROTECTORS CHIP CURRENT FUSE CCF STRUCTURE 1 Fuse elements 2 Fuse body 3 Electrode Cu solder plated Products with Pb-free terminations meet RoHS requirements IDENTIFICATION DIMENSIONS (mm) TYPE COATING COLOR MARKING

593 60v

Abstract: 1N 50A 1304H
Contextual Info: CIRCUIT PROTECTORS CIRCUIT PROTECTORS CHIP CURRENT FUSE CCF STRUCTURE 1 Fuse elements 2 Fuse body 3 Electrode Cu solder plated Products with Pb-free terminations meet EU-RoHS and China-RoHS requirements IDENTIFICATION TYPE DIMENSIONS (mm) COATING COLOR CCF 1 N