LASER DICING Search Results
LASER DICING Datasheets Context Search
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650nm 5mw laser
Abstract: ird300 laser range finder schematics 500mW 808nm infrared laser diode driver circuit 650nm laser diode 200mw circuit diagram of radar range finder LD-808-500G t15f-xyz-wm LD-808-1000G LD-650-5A
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1550nm 650nm 5mw laser ird300 laser range finder schematics 500mW 808nm infrared laser diode driver circuit 650nm laser diode 200mw circuit diagram of radar range finder LD-808-500G t15f-xyz-wm LD-808-1000G LD-650-5A | |
tunable lasers diode applications
Abstract: United Epitaxy Company infrared laser diode nir source ir laser dh 499 cryocooler US Lasers
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QB-PS-A01
Abstract: JDSU laser power supply JDSU QB-PS Q301 Q333-HD Q20x q202h umbilical Q201-HD
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498-JDSU 5378-JDSU QB-PS-A01 JDSU laser power supply JDSU QB-PS Q301 Q333-HD Q20x q202h umbilical Q201-HD | |
254 nm uv LED
Abstract: Chiller umbilical connector UV diode 250 nm r134a Q302 Q303-HD 532 nm laser diode umbilical Q3-04
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498-JDSU 5378-JDSU 254 nm uv LED Chiller umbilical connector UV diode 250 nm r134a Q302 Q303-HD 532 nm laser diode umbilical Q3-04 | |
VCSEL-ULM850-14-TT-FContextual Info: 14 Gbps VCSEL 850 nm 1x4 1x12 chip Vertical Cavity Surface-Emitting Laser Cathode on top side Unsealed 85% r.H./85°C certified Suitable for wirebond and flipchip process Preliminary ELECTRO-OPTICAL CHARACTERISTICS Chip Temperature = 25°C unless otherwise stated. |
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Ith25 ULM850-14-TT-N0104Y ULM850-14-TT-N0112Y VCSEL-ULM850-14-TT-F | |
water jet cutting machine control schematic
Abstract: sic wafer 100 mm silicon mems microphone UCHIYA GaAs wafer dicing Chip free mems microphone TLASC0022EA DSASW005159 MEMS front of fabrication process
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TLAS9005E01 water jet cutting machine control schematic sic wafer 100 mm silicon mems microphone UCHIYA GaAs wafer dicing Chip free mems microphone TLASC0022EA DSASW005159 MEMS front of fabrication process | |
TLASC0022EAContextual Info: Stealth Dicing Technical Information for MEMS 2 Table of Contents 1. Introduction 2. Problems with dicing in MEMS fabrication processes 2.1 Grinding wheel type blade dicing 2.2 Making dicing a completely dry process 3. Stealth dicing technology 3.1 Basic principle of stealth dicing |
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TLAS9005E04 TLASC0022EA | |
Adwill D-175
Abstract: UE-111AJ lintec adwill UV tape D-175 UV tape D-175 adwill Lintec UV tape Lintec nitto UE111AJ nitto UV tape D175 lintec
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AN106920 AN106920lusion Adwill D-175 UE-111AJ lintec adwill UV tape D-175 UV tape D-175 adwill Lintec UV tape Lintec nitto UE111AJ nitto UV tape D175 lintec | |
Contextual Info: Dicing Improvements: Yield Enhancement, Throughput Increase and Die Size Reduction in M/A-COM’s GaAs Fab Robert Fox M/A-COM : Tyco Electronics, 100 Chelmsford Street, Lowell, MA 01851 USA phone: 978-656-2523, email: foxr@tycoelectronics.com ABSTRACT A strong wafer dicing operation is vital to the |
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Contextual Info: Stealth Dicing Technical Information for MEMS ステルスダイシング技術資料 2 目 次 1. はじめに 2. MEMS製造工程用ダイシング技術と課題 2.1 砥石切削型ブレードダイシング 2.2 ダイシング工程の完全ドライプロセス化 |
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TLAS9005J05 | |
FBU 4J
Abstract: TLASC0023JA mems UCHIYA DSASW005159 laser dicing
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TLASC0022JA TLAS9005J03 FBU 4J TLASC0023JA mems UCHIYA DSASW005159 laser dicing | |
D2050
Abstract: laser dicing
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receiver avalanche 1550 fiber 2.5
Abstract: ORTEL DFB laser 1612 EMCORE TOSA for 10G ER
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ic 555 use with metal detector
Abstract: DVD optical pick-up assembly CD laser pickup assembly bolometer detector Light Detector laser
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Light Detector laser
Abstract: short distance measurement ir infrared diode
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KOTH0001E15 Light Detector laser short distance measurement ir infrared diode | |
led flip-chip
Abstract: finger print sensor fine world LED top layer reflector LED lights manufacturing technology result of 200 prize bond mems projector Nanotec panasonicdenkocojp gpa antenna
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AKCT1B106E 201005-2YT led flip-chip finger print sensor fine world LED top layer reflector LED lights manufacturing technology result of 200 prize bond mems projector Nanotec panasonicdenkocojp gpa antenna | |
Fluke 8502A
Abstract: 8502a dupont 951 green tape dupont 951 paste resistor thick film 6 mil poly 850C Paste Dupont palladium
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500/250/arc xenon flash lampsContextual Info: Electron Tube Products Condensed Catalog HAMAMATSU PHOTONICS K.K. Development and production centers for light sensors, light sources, and application-specific products utilizing light to support a wide range of needs in medical diagnosis/treatment, chemical analysis, |
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OTH0016E06 500/250/arc xenon flash lamps | |
Contextual Info: Technology introduction CHAPTER 13 1 Semiconductor process technology 1-1 Silicon process technology 1-2 Compound semiconductor process technology 2 Assembly technology 2-1 2-2 2-3 2-4 2-5 Packages for diverse needs Flip chip bonding Dicing Module products |
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Contextual Info: CUSTOM HYBRID THICK FILM AND THIN FILM CIRCUITS O o B • ■ ■ RAPID PROTOTYPING VOLUME PRODUCTION TIMELY DELIVERY COST-EFFECTIVE PRICING NICRO-PRECISION TS D E I ^0^7^14 □OOGGDb S MPT's lorge capacity, high thruput, load-lock produc tion system with: Microprocessor Controller, DC or RF |
OCR Scan |
TaN-50-100 | |
R7600U-300
Abstract: UV LED 300 nm uvtron R11715-01 CD laser pickup assembly R11410 R928, hamamatsu
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OTH0022E02 R7600U-300 UV LED 300 nm uvtron R11715-01 CD laser pickup assembly R11410 R928, hamamatsu | |
Contextual Info: V i s h ay I n t e rt e c h n o l o g y, I n c . Resistors - Guide for RF and UWave Substrates AND TEC I INNOVAT O L OGY RF and UWave Substrates N HN THIN FILM SUBSTRATES O 19 62-2012 Thin Film Design Guide for RF and UWave Substrates This guide provides a roadmap for the design process covering the following information: |
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VMN-PL0456-1207 | |
Thin Film Resistors SiCr
Abstract: SiCr thin film TI SAC305 hfss 80Au-20Sn 3 to 10 GHz bandpass filter sac305 thermal conductivity 184394 ansoft SAC305 reflow bga
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L9657
Abstract: S10604
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SE-17141 52/1A RU-113054 L9657 S10604 |