LAYOUTS AND PIN COUNTS Search Results
LAYOUTS AND PIN COUNTS Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| DE6B3KJ331KA4BE01J | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive |
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| DE6E3KJ102MB4B | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive |
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| DE6E3KJ332MN4A | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive |
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| DE6B3KJ101KA4BE01J | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive |
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| DE6B3KJ331KB4BE01J | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive |
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LAYOUTS AND PIN COUNTS Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
177-140H
Abstract: MIL-DTL-24308 "D-Subminiature Connector" 26 Pin High Density MS3143 MS3114 Ms3449 MS27476 MS27469 MS3440 MS27478
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MIL-DTL-38999 MS27469 231-100-H0 177-140H MIL-DTL-24308 "D-Subminiature Connector" 26 Pin High Density MS3143 MS3114 Ms3449 MS27476 MS3440 MS27478 | |
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Contextual Info: F-212 LPAF–20–03.5–L–06–2 LPAF–20–03.5–L–04–2 1,27mm .050" TM LPAF SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAF Insulator Material: |
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F-212 | |
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Contextual Info: F-211 LPAM–20–01.5–L–06–2 1,27mm .050" LPAM–20–01.5–L–04–2 TM LPAM SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAM Insulator Material: |
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F-211 | |
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Contextual Info: HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS M ates with: LPAF For complete specifications and recommended PCB layouts see www.samtec.com?LPAM Insulator Material: Black LCP 4 or 6 row Terminal Material: Copper Alloy Plating: Au or Sn over 50p“ 1,27pm Ni |
OCR Scan |
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Contextual Info: F-212 SEAM8–30–S02.0–L–06–2 SEAM8–30–S05.0–L–04–2 0,80mm .0315" SEAM8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAF8 For complete specifications and recommended PCB layouts see |
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F-212 charge69 | |
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Contextual Info: F-210-1 LPAF–20–03.5–L–06–2 LPAF–20–03.5–L–04–2 1,27mm .050" TM LPAF SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAF Insulator Material: |
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F-210-1 | |
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Contextual Info: F-211 LPAF–20–03.5–L–06–2 LPAF–20–03.5–L–04–2 1,27mm .050" TM LPAF SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAF Insulator Material: |
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F-211 | |
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Contextual Info: F-211 SEAM8–30–S02.0–L–06–2 SEAM8–30–S05.0–L–04–2 0,80mm .0315" SEAM8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAF8 For complete specifications and recommended PCB layouts see |
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F-211 charg69 | |
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Contextual Info: F-211-1 LPAF–20–03.5–L–06–2 LPAF–20–03.5–L–04–2 1,27mm .050" TM LPAF SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAF Insulator Material: |
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F-211-1 | |
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Contextual Info: F-211 SEAF8–30–05.0–L–06–2 SEAF8–30–05.0–L–04–2 0,80mm .0315" SEAF8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAM8 For complete specifications and recommended PCB layouts see |
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F-211 | |
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Contextual Info: F-212 SEAF8–30–05.0–L–06–2 SEAF8–30–05.0–L–04–2 0,80mm .0315" SEAF8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAM8 For complete specifications and recommended PCB layouts see |
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F-212 | |
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Contextual Info: F-211-1 LPAM–20–01.5–L–06–2 1,27mm .050" LPAM–20–01.5–L–04–2 TM LPAM SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAM Insulator Material: |
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F-211-1 | |
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Contextual Info: F-212 LPAM–20–01.5–L–06–2 1,27mm .050" LPAM–20–01.5–L–04–2 TM LPAM SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAM Insulator Material: |
Original |
F-212 | |
LPAFContextual Info: F-210-1 LPAM–20–01.5–L–06–2 1,27mm .050" LPAM–20–01.5–L–04–2 TM LPAM SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAM Insulator Material: |
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F-210-1 LPAF | |
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Layouts and Pin CountsContextual Info: MIL-DTL-38999 Hermetic Connectors MIL-DTL-38999 Series I, II, III, and IV Hermetic Class Connectors Layouts and Pin Counts Shell Size and Insert Arrangements B MS Series I 9-35 9-98 11-2 11-4 11-5 11-35 11-98 11-99 13-4 13-8 13-35 13-98 15-5 15-15 15-18 15-19 |
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MIL-DTL-38999 MIL-DTL-38999 Layouts and Pin Counts | |
d38999 22d
Abstract: D38999 5D-18 D38999 series I II d38999 d97 D3899
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D38999 MIL-DTL-38999 d38999 22d 5D-18 D38999 series I II d38999 d97 D3899 | |
SEAM8
Abstract: SEAM8-30-S02 Seaf SEAF8
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F-210-1 SEAM8 SEAM8-30-S02 Seaf SEAF8 | |
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Contextual Info: F-211-1 SEAF8–30–05.0–L–06–2 SEAF8–30–05.0–L–04–2 0,80mm .0315" SEAF8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAM8 For complete specifications and recommended PCB layouts see |
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F-211-1 | |
Seaf
Abstract: SEAM8 SEAF8
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F-210-1 Seaf SEAM8 SEAF8 | |
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Contextual Info: F-211-1 SEAM8–30–S02.0–L–06–2 SEAM8–30–S05.0–L–04–2 0,80mm .0315" SEAM8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAF8 For complete specifications and recommended PCB layouts see |
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F-211-1 cha69 | |
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Contextual Info: F213 Rev 8AUG13 SEAM8–30–S02.0–S–06–2–K SEAM8–30–S05.0–S–04–2–K (0,80 mm) .0315" SEAM8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Mates with: SEAF8 Up to 180 I/Os 4 and 6 row For complete specifications and recommended PCB layouts see |
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8AUG13) | |
Layouts and Pin CountsContextual Info: D38999 QPL Hermetics MIL-DTL-38999 Series I, II, III, and IV Hermetic Class Connectors Layouts and Pin Counts Shell Size and Insert Arrangements MS Series I B MS Series II 9-35 9-98 11-2 11-4 11-5 11-35 11-98 11-99 13-4 13-8 13-35 13-98 15-5 15-15 15-18 15-19 |
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D38999 MIL-DTL-38999 Layouts and Pin Counts | |
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Contextual Info: SEAM8–30–S02.0–S–06–2–K SEAM8–30–S05.0–S–04–2–K 0,80 mm .0315" SEAM8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Up to 500 I/Os Mates with: SEAF8 7 mm and 10 mm Stack Heights For complete specifications and recommended PCB layouts see |
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Contextual Info: F-213 SEAM8–30–S02.0–S–06–2–K–TR SEAM8–30–S05.0–S–04–2–K–TR 0,80 mm .0315" SEAM8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Mates with: SEAF8 Up to 180 I/Os 4 and 6 row For complete specifications and recommended PCB layouts see |
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F-213 | |