LCR METER FOR ICS PACKAGE Search Results

Contextual Info: MITSUBISHI ICS TV M51415SP PAL/NTSC VIDEO CHROMA DEFLECTION DESCRIPTION PIN CONFIGURATION (TOP VIEW) The M51415SP is a semiconductor integrated circuit for video, chroma, and deflection signal processing. Combined B-V R-Y G-Y -Y OUT OUT OUT OUT GND H. OUT

ic u11

Abstract: MIFARE Card IC Coil Design Guide 74x74 LCR meter for ICs package MIFARE Card Coil Design Guide
Contextual Info: MF0 IC U10 01 MF0 IC U11 01 Bumped sawn wafer on UV-tape Rev. 3.2 — 16 March 2007 Product data sheet 102132 PUBLIC 1. General description 1.1 Scope The MF0 IC U10 01 and the MF0 IC U11 01 are contactless Smart Card ICs designed for card IC coils following the mifare card IC coil design guide and are qualified to work

Contextual Info: Leadless Inductors: NL Series CAL-CHIP LEADLESS INDUCTORS NL322522, NL453232, series for signal circuit applications These revolutionary, high reliability winding type leadless wound chip inductors for autom atic mounting have been developed in response to the trend toward

MIFARE Card Coil Design Guide

Abstract: MF0ICU1 LCR meter for ICs package contactless Functional Specification
Contextual Info: MF0 IC U10 01 120 mm Bumped unsawn wafer on UV-tape contactless single-trip ticket ICs Rev. 3.2 — 16 March 2007 Product data sheet 127632 PUBLIC 1. General description 1.1 Scope The MF0 IC U10 01 is a contactless smart card IC designed for card IC coils following the

uv-tape

Abstract: Philips MF1 IC S50 Philips Mifare 1 S50 Mifare MF1 S50 MF1 S50 mifare s50 mifare s50 MIFARE mifare mf1 ic s50 MF1 IC S50 MF1ICS5005
Contextual Info: INTEGRATED CIRCUITS ADDENDUM Standard Card IC MF1 IC S50 05 Specification “sawn wafer on UV-tape” Revision 3.0 PUBLIC Philips Semiconductors August 2004 Philips Semiconductors Rev. 3.0 August 2004 sawn wafer on UV-tape Standard Card IC MF1 IC S50 05 CONTENTS

MIFARE Card IC Coil Design Guide

Abstract: Philips MF1 IC S50 Mifare MF1 S50 Philips Mifare 1 S50 Philips Mifare 1 S50 specifications philips S50 MF1 S50 mifare s50 MIFARE card MF1 IC S50 S5005
Contextual Info: INTEGRATED CIRCUITS ADDENDUM Standard Card IC MF1 IC S50 05 Wafer Specification Revision 3.0 PUBLIC Philips Semiconductors October 2002 Philips Semiconductors Rev. 3.0 October 2002 Wafer Specification Standard Card IC MF1 IC S50 05 CONTENTS 1 SCOPE 3 2 REFERENCE DOCUMENTS

UV-tape

Abstract: MIFARE Card Coil Design Guide contactless Functional Specification
Contextual Info: MF0 IC U10 01 120 µm Bumped sawn wafer on UV-tape contactless single-trip ticket ICs Rev. 3.2 — 16 March 2007 Product data sheet 124832 PUBLIC 1. General description 1.1 Scope The MF0 IC U10 01 is a contactless Smart Card IC designed for card IC coils following the

Philips Mifare 1 S50

Abstract: Philips MF1 IC S50 MIFARE Card IC Coil Design Guide Philips Mifare 1 S50 specifications Mifare MF1 S50 LA 7124 S50055 LCR meter for ICs package philips S50 mifare mf1 ic s50
Contextual Info: INTEGRATED CIRCUITS ADDENDUM Standard Card IC MF1 IC S50 05 Specification “bumped sawn wafer on UV-tape” Product Specification Revision 3.0 PUBLIC Philips Semiconductors August 2004 Philips Semiconductors Product Specification Rev. 3.0 August 2004 Bumped sawn wafer on UV-tape

ic 748

Abstract: IC 7412 HITAG PROTOCOL 11785 crc ISO-11785 HITAG 2 PROTOCOL IC 723 reliability report of nxp HITAG s HITAG 2 coding algorithm
Contextual Info: HTMS1x01;HTMS8x01 HITAG transponder IC Rev. 3.0 — 28 September 2011 193330 Product short data sheet COMPANY PUBLIC 1. General description The HITAG product line is well known and established in the contactless identification market. Due to the open marketing strategy of NXP Semiconductors there are various

ICODE Coil design guide

Abstract: M92x 156932
Contextual Info: SL2ICS2001DW/V1D I-CODE SLI Label IC bumped wafer specification on UV-tape Rev. 3.0 — 5 February 2008 Product data sheet addendum 150030 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs on an NXP

Contextual Info: SL2 ICS12 I•CODE UID-OTP bumped wafer on UV-tape addendum Rev. 3.0 — 15 May 2007 Product data sheet 134730 PUBLIC 1. General description This specification describes electrical, physical and dimensional properties of Au-bumped, sawn wafers on FFC of I•CODE UID-OTP Smart Label IC.

Contextual Info: SL2ICS5311EW/V7 Wafer addendum Rev. 3.0 — 8 May 2008 Product data sheet 131030 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I-CODE SLI-S Label ICs on an NXP C075EE process

uv-tape

Abstract: ICODE SLI-S SECS II wafer map format
Contextual Info: SL2ICS5301EW/V7L Wafer addendum Rev. 3.0 — 19 March 2008 Product data sheet 153430 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I-CODE SLI-S Label ICs on an NXP C075EE process

Mifare plus commands

Abstract: mifare plus functional specification Mifare PLUS X command reference "M1PLUSx0y1" mifare classic 1k Mifare Plus X 4K UID 7 Byte Mifare plus protocol 14443-3 command read write mifare classic 14443-4 command 14443-4
Contextual Info: MF1SPLUSx0y1 Mainstream contactless smart card IC for fast and easy solution development Rev. 3.1 — 19 April 2010 187031 Product short data sheet PUBLIC 1. General description Migrate classic contactless smart card systems to the next security level! MIFARE Plus

UV-tape

Abstract: wafer map
Contextual Info: SL2 ICS51 Wafer addendum Rev. 3.0 — 21 March 2007 Product data sheet 136630 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I•CODE SLI-L HC Label ICs on an NXP C075EE

SECS II wafer map format

Abstract: C075EE uv-tape ICODE SLI-S ICS5401 SL2ICS54 wafer map format
Contextual Info: SL2 ICS54 Wafer addendum Rev. 3.0 — 21 March 2007 Product data sheet 135930 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I•CODE SLI-S HC Label ICs on an NXP C075EE

SECS II wafer map format

Abstract: C075EE UV-tape
Contextual Info: SL2 ICS50 Wafer addendum Rev. 3.0 — 21 March 2007 Product data sheet 136530 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I•CODE SLI-L Label ICs on an NXP C075EE process

MIFARE Card IC Coil Design Guide

Abstract: Mifare MF1 S50 mifare mf1 ic s50 uv-tape S5005
Contextual Info: MF1 IC S50 05 Sawn wafer on UV-tape addendum Rev. 3.2 — 18 April 2007 Product data sheet 101932 PUBLIC 1. General description The MF1 ICS 50 05 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP

mifare s50 MIFARE

Abstract: MF1 S50 mifare s50 Card Mifare 1 S50 S50 Application Note MF1 IC S50 Mifare MF1 S50 LCR meter for ICs package
Contextual Info: MF1 IC S50 06 Wafer specification addendum Rev. 3.2 — 16 March 2007 Product data sheet 075932 PUBLIC 1. General description The MF1 ICS 50 06 is a contactless smart card IC designed for card IC coils following the mifare card IC coil design guide and is qualified to work properly in NXP reader

Contextual Info: MF1 IC S20 07 Sawn wafer on UV-tape addendum Rev. 1.0 — 17 January 2007 Product data sheet 132310 PUBLIC 1. General description The MF1 ICS 20 20 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP´ reader

mifare plus functional specification

Abstract: Mifare plus commands Mifare PLUS X command reference write perso mifare plus mifare plus functional specification BU-ID Doc. No. 1637 MIFARE PLUS 14443-4 command mifare plus s 2k mifare write perso mifare classic 1k
Contextual Info: MF1SPLUSx0y1 Mainstream contactless smart card IC for fast and easy solution development Rev. 3.2 — 21 February 2011 187032 Product short data sheet PUBLIC 1. General description Migrate classic contactless smart card systems to the next security level! MIFARE Plus

MIFARE Card Coil Design Guide

Abstract: uv-tape mifare s50 mifare s50 MIFARE MF1 IC S50 LA 7124
Contextual Info: MF1 IC S50 07 Sawn bumped wafer on UV-tape addendum Rev. 3.2 — 4 April 2007 Product data sheet 118832 PUBLIC 1. General description The MF1 ICS 50 07 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP´ reader

LA 7124

Abstract: mifare s50 mifare s50 MIFARE mifare mf1 ic s50 MF1 IC S50 CONTACTLESS SMART CARD READER
Contextual Info: MF1 IC S50 07 Sawn wafer addendum Rev. 3.2 — 16 March 2007 Product data sheet 118732 PUBLIC 1. General description The MF1 ICS 50 07 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP´ reader

MIFARE Card Coil Design Guide

Contextual Info: MF1 IC S50 07 Sawn wafer addendum Rev. 3.1 — 24 January 2007 Product data sheet 118731 PUBLIC 1. General description The MF1 ICS 50 07 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP´ reader