LIT0308 Search Results
LIT0308 Datasheets Context Search
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Contextual Info: Dat asheet Design Recommendation Application notes PCB Components To guarantee the best soldering result in the reflow processes the required paste volume and paste filling level must be optimized for the paste printing process. P C B p i n h e a d e r s f o r t h e S M T p ro c e s s |
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LIT0308 |