LQFP TRAY Search Results

LQFP-48 thermal pad

Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Contextual Info: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /

TQFP 100 pin ic

Abstract: 208ld
Contextual Info: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /

MS-026

Abstract: JEDEC Matrix Tray outlines CS-007 MS-026 lqfp 80 MS026 tray 20 x 14 LQFPPOWERQUAD4 MS-026 lqfp 128
Contextual Info: LEADFRAME data sheet LQFP PowerQuad 4 Features: LQFP PowerQuad® 4 Packages: LQFP PowerQuad® 4 PQ4 is the same Amkor patented, advanced IC packaging technology used in MQFP PQ4s but applied to Low Profile 1.4 mm QFPs (LQFP). Improved power dissipation is

MS-026 lqfp 80

Abstract: DS170G MS-026 JEDEC Matrix Tray outlines LQFPPOWERQUAD2 CS-007
Contextual Info: LEADFRAME data sheet LQFP PowerQuad 2 Features: LQFP PowerQuad® 2 Packages: LQFP PowerQuad® 2 PQ2 is the same Amkor patented, advanced IC packaging technology used in plastic QFPs but applied to Low Profile 1.4 mm QFPs (LQFP). This breakthrough in IC packaging

JEDEC MS-026

Abstract: MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
Contextual Info: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers

lqfp 7x7 tray

Abstract: MS-026 7X748LD amkor
Contextual Info: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers

Techpoint

Abstract: 100L JESD51-2 JESD51-7 lqfp 7x7 tray QFP 128 bonding
Contextual Info: LQFP Low Profile Quad Flat Pack • 7 x 7mm to 28 x 28mm body sizes • 32 to 208 lead counts • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 28 x 28mm STATS ChipPAC’s LQFP is a low profile 1.4mm version of the QFP. The LQFP is a leadframe based, plastic encapsulated

Contextual Info: Philips Semiconductors Product specification LCD row/column driver for dot matrix graphic displays CONTENTS PCF8578 18 SOLDERING Introduction Reflow soldering Wave soldering LQFP VSO Method LQFP and VSO Repairing soldered joints 1 FEATURES 2 APPLICATIONS

LQFP Package tray

Abstract: 128-PIN nec 144 pin LQFP LQFP Package 128-pin LQFP 144 tray
Contextual Info: TRAY CONTAINER UNIT : mm 17.55 135°C MAX 22.63 25.40 17.80 22.63 100.8 A' LQFP 20x20×1.4 25.20 135.9 NEC A 279.4 315.0 322.6 SECTION A-A' 22.63 6.02 (6.35) 7.62 19.85 Applied Package Quantity (pcs) Material 128-pin Plastic LQFP (Fine Pitch) (1.4mm thick)

LQFP Package tray

Abstract: TQFP14X14X1 LQFP "100 pin" PACKAGE LQFP Package 128-pin 128-PIN tray container dimensions TRAY CONTAINER LQFP14 100-PIN PLASTIC LQFP NEC tqfp14x14x1.4
Contextual Info: TRAY CONTAINER 7 15.45 16.7 6x15=90 21.00 A' A 150°C MAX. PPE 105.0 TQFP14X14X1.4 15.40 16.7 20.30 284.2 315.0 322.6 Section A – A' 16.7 5.62 (6.35) 13.85 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 80-pin Plastic LQFP (1.4mm thick) 100-pin Plastic LQFP (1.4mm thick)

ZL50011QCG1

Abstract: GR-1244-CORE MS-026 ZL50011
Contextual Info: ZL50011 Flexible 512 Channel DX with on-chip DPLL Data Sheet Features • March 2006 512 channel x 512 channel non-blocking switch at 2.048 Mbps, 4.096 Mbps or 8.192 Mbps operation Ordering Information 160 Pin LQFP Trays 144 Ball LBGA Trays 160 Pin LQFP* Trays, Bake & Drypack

LQFP Package tray

Abstract: 128-PIN ST-TQ142014TJ-1 NEC 87 tray dimensions
Contextual Info: TRAY CONTAINER A' 15.45 16.64 21.00 150°C MAX. 7 A PPE ST-TQ142014TJ-1 135.9 105 UNIT : mm 22.64 25.40 17.80 279.4 315 322.6 SECTION A-A' 22.64 Applied Package 100-pin Plastic LQFP 1.4mm thick 128-pin Plastic LQFP (1.4mm thick) 5.62 6.35 7.62 19.87 Quantity (pcs)

LQFP1414-8bt Package tray

Abstract: LQFP Package tray h658 LQFP1414-8BT
Contextual Info: TRAY CONTAINER HEAT PROOF 7 A' 15.45 18.0 6x15=90 21.00 A 135°CMAXPPE 105.0 NEC LQFP1414−8BT 15.40 18.0 20.30 284.2 315.0 322.6 < SECTION A – A' > 18.0 5.62 (6.35) 13.85 7.62 135.9 UNIT : mm Applied Package 64-pin Plastic LQFP (1.4mm thick) 80-pin Plastic LQFP (1.4mm thick)

HM-RAE105

Abstract: RPG100 PEAK TRAY qfn 4 x 4 RPG100F RPG100-01 qfn 5 x 5 TRAY PEAK TRAY qfn
Contextual Info: HM-RAE105-1105 PACKAGE [ RPG100 ] 32-pin plastic LQFP 32-pin plastic LQFP Lead pitch 0.80mm Package width x package length 7 x 7 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm MAX Note1 * :These dimensions do not include resin protrusion.

LQFP Package tray

Abstract: JEDEC TRAY DIMENSIONS
Contextual Info: TRAY CONTAINER UNIT : mm 7 x 17=119 NEC 135° C MAX. A' 14.60 17.90 14.30 14.60 108.0 13.95 18.00 LQFP12 × 12× 1.4 135.9 PPE A 286.4 315.0 322.6 SECTION A-A' 14.60 5.62 (6.35) 7.62 11.82 Applied Package 64-pin Plastic LQFP (1.4mm thick) 80-pin Plastic LQFP (Fine Pitch)(1.4mm thick)

MPC5601D

Abstract: MPC5602D MPC560* reference manual JESD51-3 JESD51-7 LQFP100 LQFP64 MPC560 e200Z0 IEEE-ISTO
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5602D Rev. 4, 07/2011 MPC5602D 100 LQFP 14 mm x 14 mm 64 LQFP 10 mm x 10 mm MPC5602D Microcontroller Data Sheet • • • • • • • • • • • • • • • • •

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5602P Rev. 4.1, 09/2011 MPC5602P MPC5602P Microcontroller Data Sheet 100 LQFP 14 mm x 14 mm 64 LQFP (10 mm x 10 mm) • Up to 64 MHz, single issue, 32-bit CPU core complex (e200z0h)

MPC5602P

Abstract: bldc motor eps steering bosch relay equivalent MPC5601P e200Z0h- instruction set 16-CCITT MPC5602 CRC-32 JESD51-2 JESD51-7
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5602P Rev. 4.1, 09/2011 MPC5602P MPC5602P Microcontroller Data Sheet 100 LQFP 14 mm x 14 mm 64 LQFP (10 mm x 10 mm) • Up to 64 MHz, single issue, 32-bit CPU core complex (e200z0h)

LQFP Package tray

Abstract: JEDEC TRAY DIMENSIONS tray container dimensions
Contextual Info: TRAY CONTAINER UNIT : mm 10 x 25=250 113.4 135.9 PPE NEC 135° C MAX. A' 9.60 11.25 12.60 LQFP7 × 7× 1.4 A 9.60 12.20 11.10 292.8 315.0 322.6 SECTION A-A' 9.60 5.62 (6.35) 7.62 6.82 Applied Package 48-pin Plastic LQFP (Fine Pitch)(1.4mm thick) 64-pin Plastic LQFP (Fine Pitch)(1.4mm thick)

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 10, 11/2012 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 MAPBGA 15 mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C SOT-343R ##_mm_x_##mm 100 LQFP (14 x 14 x 1.4 mm)

MPC5604B

Abstract: mpc5604 MPC5603 MPC5602B MPC5607 trace MPC56 MPC560 ic lm 4704 MPC5603B ordering MPC56
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 8, 11/2010 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 15 MAPBGA mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C Microcontroller Data Sheet SOT-343R ##_mm_x_##mm 100 LQFP

MPC5604P

Abstract: sdc 7500 scr values MPC5603 MPC5603P airbag RF NPN POWER TRANSISTOR 2 GHZ
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604P Rev. 4, 7/2009 MPC5604P 144 LQFP 20 x 20 x 1.4 mm 100 LQFP 14 x 14 x 1.4 mm MPC5604P Microcontroller Data Sheet • High performance 64 MHz e200z0h CPU – 32-bit Power Architecture Book E CPU

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 12, 04/2014 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 MAPBGA 15 mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C SOT-343R ##_mm_x_##mm 100 LQFP (14 x 14 x 1.4 mm)

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5602D Rev. 5, 11/2011 MPC5602D 100 LQFP 14 mm x 14 mm 64 LQFP 10 mm x 10 mm MPC5602D Microcontroller Data Sheet • • • • • • • • • • • • • Single issue, 32-bit CPU core complex e200z0h