LQFP-176 U Search Results

176pin

Contextual Info: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE 176 PIN PLASTIC FPT-176P-M03 Lead pitch 0.40mm Package width x package length 20 × 20mm Lead shape Gullwing Sealing method Plastic mold 176-pin plastic LQFP FPT-176P-M03 176-pin plastic LQFP (FPT-176P-M03)

Contextual Info: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE 176 PIN PLASTIC FPT-176P-M02 Lead pitch 0.50mm Package width x package length 24 × 24mm Lead shape Gullwing Sealing method Plastic mold 176-pin plastic LQFP FPT-176P-M02 176-pin plastic LQFP (FPT-176P-M02)

Contextual Info: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 176 PIN PLASTIC FPT-176P-M03 176-pin plastic LQFP Lead pitch 0.40 mm Package width x package length 20 × 20 mm Lead shape Gullwing Sealing method Plastic mold FPT-176P-M03 176-pin plastic LQFP

176pin

Contextual Info: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 176 PIN PLASTIC FPT-176P-M02 176-pin plastic LQFP Lead pitch 0.50 mm Package width x package length 24 × 24 mm Lead shape Gullwing Sealing method Plastic mold FPT-176P-M02 176-pin plastic LQFP

MS-026-BGA

Abstract: ST BGA ST176
Contextual Info: 176-Lead Low Profile Quad Flat Package [LQFP] ST-176 Dimensions shown in millimeters a 0.75 0.60 0.45 26.20 26.00 SQ 25.80 1.60 MAX 133 132 176 1 PIN 1 24.20 24.00 SQ 23.80 TOP VIEW (PINS DOWN) 0.15 0.05 SEATING PLANE VIEW A ROTATED 90° CCW 0.20 0.09 7°

176pin

Contextual Info: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 176 PIN PLASTIC To Top / Package Lineup / Package Index FPT-176P-M03 176-pin plastic LQFP Lead pitch 0.40 mm Package width x package length 20 × 20 mm Lead shape Gullwing Sealing method

FPT-176P-M07

Abstract: 176-pin 176pin
Contextual Info: LOW PROFILE QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 176 PIN PLASTIC FPT-176P-M07 176-pin plastic LQFP Lead pitch 0.50 mm Package width x package length 24.0 × 24.0 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm MAX

55FK

Abstract: C166SV2 K/SPI/RS232 core C166
Contextual Info: Product Brief XE166xH Series – High Line Real-Time Signal Controller Main Features cont’d The XE167xH (LQFP-144) and XE169xH (LQFP-176) microcontroller series are based on Infineon’s popular and well-established C166SV2 architecture. The devices offer new safety features for safety integrity level

176pin

Contextual Info: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 176 PIN PLASTIC To Top / Package Lineup / Package Index FPT-176P-M02 176-pin plastic LQFP Lead pitch 0.50 mm Package width x package length 24 × 24 mm Lead shape Gullwing Sealing method

Contextual Info: 176-PIN PLASTIC LQFP FINE PITCH (20x20) A B 132 133 89 88 detail of lead end S P C T D R L U Q 176 1 F G 45 44 H I J M K M N S NOTE Each lead centerline is located within 0.07 mm of its true position (T.P.) at maximum material condition. S ITEM MILLIMETERS

Contextual Info: 176-PIN PLASTIC LQFP FINE PITCH (20x20) A B 132 133 89 88 detail of lead end S P C T D R L U Q 45 44 176 1 F G H I J M K M N S NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. S ITEM MILLIMETERS

pj 88 LV

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5646C Rev. 4, 07/2011 MPC5646C 176-pin LQFP 24 mm x 24 mm MPC5646C Microcontroller Datasheet On-chip modules available within the family include the following features: • • •

Contextual Info: 176 PIN PLASTIC LQFP FINE PITCH (20x20) A B 132 133 89 88 detail of lead end S P C T D R L U Q 45 44 176 1 F G H I J M K M N S S NOTES 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition.

CX23883

Abstract: cx24108 CX23880 CX22702 cx23888 CX23882 CX2388x Conexant CX24108 driver conexant broadcast decoder cx23881 19 CX24110
Contextual Info: CX23880/CX23881/CX23882/CX23883 PCI Audio/Video Broadcast Decoder Data Sheet 101069A August 2002 Ordering Information Model Number Package Operating Temperature CX23880/CX23881/CX23882/CX23883 176-pin LQFP 0 to +70 oC Revision History Revision Level Date A

MPC5645

Abstract: MPC5646 mpc5646c MPC5644B PJ6N e200z4d e200z0 LQPF176 PCR130 MPC5645B
Contextual Info: Freescale Data Sheet: Technical Data Document Number: MPC5646C Rev. 5.1, 08/2012 MPC5646C 176-pin LQFP 24 mm x 24 mm MPC5646C Microcontroller Datasheet On-chip modules available within the family include the following features: • e200z4d dual issue, 32-bit core Power Architecture

Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A68A-1 ST-TQ242414TJ-1 TQFP 20x20 1.4mm 176 pin LQFP 24 × 24 Terminal Spacing Linear = 0.5 A B 132 133 89 88 detail of lead end C D S Q 176 1 R 45 44 F G H I M J P K M N NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of

Contextual Info: CONFIDENTIAL ADVANCE INFORMATION Crescendo III SoundBar SoC Product Brief Analog Reinvented rd The Crescendo III SoundBar is a 3 -generation SoC that integrates all soundbar audio and microcontroller MCU functions in a 176-pin Low Profile Quad Flat Pack (LQFP) package.

MPC5645B

Abstract: MPC5646C KH 6004 pin diagram e200z4d MPC5646C propagation delay MPC5644C PJ6N e200Z0h- instruction set linflex MPC564
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5646C Rev. 4, 07/2011 MPC5646C 176-pin LQFP 24 mm x 24 mm MPC5646C Microcontroller Datasheet On-chip modules available within the family include the following features: • e200z4d dual issue, 32-bit core Power Architecture

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5645S Rev. 7, 02/2012 MPC5645S 416 TEPBGA 27 mm x 27 mm MPC5645S Microcontroller Data Sheet 176 LQFP 24 mm x 24 mm 1 The MPC5645S represents a new generation of 32-bit microcontrollers targeting single-chip automotive instrument

d965 TRANSISTOR equivalent

Abstract: transistor D998 MPC5645 linflex uart example transistor pcr 606 j SC667 SMD transistor k23 d965 equivalent transistor pcr 606 j circuits d998 transistor
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5645S Rev. 7, 02/2012 MPC5645S 416 TEPBGA 27 mm x 27 mm MPC5645S Microcontroller Data Sheet 176 LQFP 24 mm x 24 mm 1 The MPC5645S represents a new generation of 32-bit microcontrollers targeting single-chip automotive instrument

A2 diode

Abstract: transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4
Contextual Info: : Available, : Under development Plastic QFP Fine Pitch Nominal Dimensions (mm) Lead Pitch Classification (mm) Pin Counts 48 64 72 80 88 100 120 144 160 176 208 216 240 256 272 304 376 QFP 7x7 TQFP QFP 10 × 10 TQFP QFP 12 × 12 TQFP QFP 14 × 14 LQFP 0.5

SUN 472

Abstract: RTL 602
Contextual Info: 0.5µmASICs MSM12R/13R/98R Package Menu Product Name MSM98R I/O SOG Part Number Pads MSM98RB01 QFP 44 80 128 LQFP TQFP 64 80 100 160 208 240 304 44 ● ❍ ❍ ● 64 80 100 128 144 176 PBGA 208 256 352 420 96 ● ● ❍ ❍ ● 104 ● ● ● ● ● ●

LQFP176-P-2424

Contextual Info: 176P6Q-A Plastic 176pin 24✕24mm body LQFP EIAJ Package Code LQFP176-P-2424-0.50 Weight g Lead Material Cu Alloy MD HD ME e JEDEC Code – b2 Under Development D 176 133 I2 1 132 Recommended Mount Pad 44 HE E Symbol 89 45 88 A L1 e b y A1 c A2 F L Detail F

30r0080

Abstract: MSM92RB01 MSM92RB02 MSM92RB03 MSM92RB04 MSM92RB05 MSM92RB06 MSM92RB07 MSM92RB08 MSM92RB09
Contextual Info: 0.5µm ASICs MSM30R/32R/92R Package Menu Product Name MSM92R I/O SOG Part Number Pads QFP 44 64 80 PBGA LQFP TQFP 44 64 80 100 128 160 208 240 304 FBGA 100 128 144 176 208 256 352 420 560 144 224 MSM92RB01 80 ● ❍ ❍ ● MSM92RB02 96 ❍ ● ❍ ❍ ●