LQFP-64 10X10 Search Results

HY57V641620

Abstract: hy57v64162 CD164
Contextual Info: SC9821C CD SC9821C CD * 16 4 16 * 3 5 16 6 2 LQFP-64-10x10-0.5 * * CD-DA * SDRAM/DRAM * 16.9344MHz * * / 1M/4M/8M/16Mx16 SDRAM / 1M/4M x16 DRAM SC9821C LQFP-64-10X10-0.5 * CD 1.0 Http: www.silan.com.cn 2006.07.21 20 SC9821C VCCInt 1.4 ~ +2.3 V VCCIO 2.9~ 4.2

Contextual Info: FAX# 408 944-0970 TITLE 64 LEAD LQFP 10x10mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # LQFP10x10-64LD-PL-1 Rev A ECN 022312HC06 Originator E. dlSantos Change New release UNIT MM Reason Per George C.

Contextual Info: Freescale Semiconductor Data Sheet: Advanced Information Document Number: MC9S08MM128 Rev. 2, 04/2010 MC9S08MM128 series Covers: MC9S08MM128, and MC9S08MM64, MC9S08MM32, and MC9S08MM32A 64-LQFP 10mm x 10mm 8-Bit HCS08 Central Processor Unit CPU – – –

Contextual Info: Freescale Semiconductor Data Sheet: Advanced Information Document Number: MC9S08JE128 Rev. 3, 04/2010 An Energy-Efficient Solution from Freescale MC9S08JE128 series Covers: MC9S08JE128 and MC9S08JE64 – 64-LQFP 10mm x 10mm 8-Bit HCS08 Central Processor Unit CPU

ADC12

Abstract: HCS08 VDACR100 MC9S08je
Contextual Info: Freescale Semiconductor Data Sheet: Advanced Information Document Number: MC9S08JE128 Rev. 3, 04/2010 An Energy-Efficient Solution from Freescale MC9S08JE128 series Covers: MC9S08JE128 and MC9S08JE64 – 64-LQFP 10mm x 10mm 8-Bit HCS08 Central Processor Unit CPU

Contextual Info: Freescale Semiconductor Data Sheet: Advanced Information Document Number: MC9S08MM128 Rev. 2, 04/2010 An Energy-Efficient Solution from Freescale MC9S08MM128 series Covers: MC9S08MM128, and MC9S08MM64, MC9S08MM32, and MC9S08MM32A 64-LQFP 10mm x 10mm 8-Bit HCS08 Central Processor Unit CPU

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MC9S08MM128 Rev. 3, 10/2010 An Energy-Efficient Solution from Freescale MC9S08MM128 series Covers: MC9S08MM128, and MC9S08MM64, MC9S08MM32, and MC9S08MM32A 64-LQFP 10mm x 10mm 8-Bit HCS08 Central Processor Unit CPU

MC9S08MM128RM

Abstract: MC9S08MM128 ADC16 HCS08 rx2 433 160 mc9s08
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MC9S08MM128 Rev. 3, 10/2010 An Energy-Efficient Solution from Freescale MC9S08MM128 series Covers: MC9S08MM128, and MC9S08MM64, MC9S08MM32, and MC9S08MM32A 64-LQFP 10mm x 10mm 8-Bit HCS08 Central Processor Unit CPU

LPL1

Abstract: A333
Contextual Info: 64-PIN PLASTIC LQFP FINE PITCH (10x10) HD D detail of lead end 48 A3 33 49 c 32 L Lp θ L1 E HE (UNIT:mm) ITEM D E HD HE A A1 A2 A3 b 17 64 1 16 ZE e ZD b x M S A2 A S y S NOTE Each lead centerline is located within 0.08 mm of its true position at maximum material condition.

mm1764

Abstract: P64GB-50-UEU-1
Contextual Info: 64-PIN PLASTIC LQFP FINE PITCH (10x10) HD D detail of lead end 48 33 49 A3 32 c θ E L Lp HE L1 (UNIT:mm) 17 64 1 ITEM D 16 ZE e ZD b x M S A E 10.00±0.20 HD 12.00±0.20 HE 12.00±0.20 A 1.60 MAX. A1 0.10±0.05 A2 1.40±0.05 A3 b A2 c S y S NOTE Each lead centerline is located within 0.08 mm of

MM912G634DV1AE

Abstract: 51413 15x10-6 125c59 Operational transconductance amplifier 54-031 S12CPMU
Contextual Info: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 10.0, 1/2013 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are

CTR31 PCB Controller

Abstract: MM912G634 fet ifr 634 MM912G634CV1AE TSG 3255 TC0800 54113 uns tread MM912 D flip flop
Contextual Info: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 5.0, 9/2011 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are

bc 494 b f.m transmitter

Abstract: SCR SS 3328 CTR31 PCB Controller 51-6332 Tl 5153 dp1203 N203 57210 54123 application as pulse generator TSG 3255
Contextual Info: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 7.0, 3/2012 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are

Contextual Info: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 7.0, 3/2012 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are

dual coil latching relay

Abstract: MOSFET K 4202 mosfet 4914 LIN conformance fet ifr 634 TSG 3255
Contextual Info: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 3.0, 5/2011 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are

Contextual Info: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 9.0, 12/2012 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are

dual coil latching relay

Abstract: hall sensor 41 hall 44132 rain light sensor ctr31 D2D DIODE B2k marking 3 PIN hall effect sensor n 177 4205 mosfet TSG 3255
Contextual Info: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 4.0, 5/2011 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are

Digital Alarm Clock using 8051 interrupt

Abstract: Digital Alarm Clock using 8051 digital clock with alarm using 8051 MCS51 ASSEMBLER p752h sc9351 MCS51 of 8051 LDO MARKING of tcon register of 8051
Contextual Info: SC9351 AUDIO SYSTEM CONTROL MCU DESCRIPTION SC9351 is an 8051-based MCU with built-in 64KByte FLASH, 8KByte 2 RAM and abundant on-chip periphery modules including I C, UART, SPI, ADC and RTC, etc. FEATURES * In system programming ISP LQFP-64-10x10-0.5 * 2.7-3.6V supply voltage for chip core, together with internal or

lqfp 10X10

Contextual Info: 64-PIN PLASTIC LQFP 10x10 A B 48 detail of lead end 33 32 49 S P C T D R 64 U 17 Q 16 1 L F G J H I M ITEM A K B S N S M MILLIMETERS 12.0±0.2 10.0±0.2 C 10.0±0.2 D 12.0±0.2 F 1.25 G 1.25 H 0.22±0.05 I 0.08 J 0.5 (T.P.) NOTE K 1.0±0.2 Each lead centerline is located within 0.08 mm of

SC9820P

Contextual Info: SC9820P CD MP3 SC9820P Mp3 CD * DISC-MAN CD-ROM ECC MP3 EDC LQFP-64-10x10-0.5 * ISO/IEC 11172-3 L3 L2 L1 * ISO/IEC 13818-3 L3 L2 L1 * ISO/IEC 11172-3 L3 L2 L1 MP3 * ISO/IEC 13818-3 L3 L2 L1 MP3 * MP3 48K/44.1K/32K 24K/22.05K/16K * / / 12K/11.025/8K SC9820P

QFP JEDEC tray

Abstract: nec 44 pin LQFP LQFP Package tray NEC lqfp 52 JEDEC TRAY QFP JEDEC tray standard qfp tray standard nec 44pin QFp Package tray tray qfp 160 jedec
Contextual Info: TRAY CONTAINER HEAT PROOF 7 A' 15.20 13.10 12.5 PPE 135°C MAX NEC 15.70 A 8x20 = 160 13.00 109.9 LQFP 10×10×1.4 12.5 288.8 315.0 322.6 SECTION A-A' 12.50 Applied Package 6.12 (6.35) 9.90 7.62 135.9 UNIT : mm Quantity (pcs) 64-pin Plastic QFP (1.4mm thick)

SC9822P

Abstract: msc80
Contextual Info: SC9822P ESP CD MP3 SC9822P Mp3 CD DISC-MAN * MP3 CD-ROM ECC EDC LQFP-64-10x10-0.5 * ISO/IEC 11172-3 L3 L2 L1 * ISO/IEC 13818-3 L3 L2 L1 * ISO/IEC 11172-3 L3 L2 L1 MP3 * ISO/IEC 13818-3 L3 L2 L1 MP3 * MP3 48K/44.1K/32K 24K/22.05K/16K * / / 12K/11.025/8K SC9822P

MC9S08JE64

Contextual Info: Freescale Semiconductor Data Sheet: Advanced Information Document Number: MC9S08JE128 Rev. 3, 04/2010 MC9S08JE128 series Covers: MC9S08JE128 and MC9S08JE64 – 64-LQFP 10mm x 10mm 8-Bit HCS08 Central Processor Unit CPU – – – Up to 48-MHz CPU above 2.4 V, 40 MHz CPU above 2.1 V, and

TQ32

Abstract: ablestik amkor amkor cabga Nitto ASE LQFP 208 CABGA 6x6
Contextual Info: Atmel Lead Pb -Free Plan Jul-00 Subcontractor Oct-00 Jan-01 Apr-01 Jul-01 Package AIC(Malaysia) 32 lead TSOP AIC(Malaysia) 8 lead SOIC Amkor(Korea) 81 ball CABGA Amkor(Korea) 44 lead TQFP Amkor(Phillip.) 5 X 8 LAP (replaces 8 lead SOIC) Amkor(Korea) 64 lead 10 X 10 LQFP*