LQFP144 DIMENSION Search Results

LQFP144

Abstract: LQFP-144
Contextual Info: PACKAGE DIMENSIONS LQFP144 ＧＤ－Ｑ１４４０１Ｙ－０２ UNIT : mm Ver.2008-08-28

100P6S-A

Abstract: LQFP100-P-1414-0 LQFP144-P-2020-0 QFP100-P-1420-0 PAD108
Contextual Info: Under development Preliminary specification Specifications in this manual are tentative and subject to change. Package Dimensions M32C/84 Group Package Dimensions Recommended EIAJ Package Code LQFP144-P-2020-0.50 Plastic 144pin 20✕20mm body LQFP Weight g

100P6S-A

Abstract: LQFP100-P-1414-0 LQFP144-P-2020-0 QFP100-P-1420-0 PAD108
Contextual Info: Under development Preliminary specification Specifications in this manual are tentative and subject to change. Package Dimensions M32C/85 Group Package Dimensions Recommended EIAJ Package Code LQFP144-P-2020-0.50 Plastic 144pin 20✕20mm body LQFP Weight g

Contextual Info: SPC56EL60x, SPC56EL54x SPC564L60x, SPC564L54x 32-bit Power Architecture microcontroller for automotive SIL3/ASILD chassis and safety applications Datasheet - production data LQFP100 14 x 14x 1.4 mm LQFP144 (20 x 20 x 1.4 mm) LFBGA257 (14 x 14 mm) • Nexus Class 3+ interface

Contextual Info: SPC560B54x SPC560B60x, SPC560B64x 32-bit MCU family built on the Power Architecture for automotive body electronics applications Datasheet - production data • Dedicated diagnostic module for lighting LQFP100 LQFP144 14 x 14 x 1.4 mm (20 x 20 x 1.4 mm)

APC 2020 B electric diagram

Abstract: SPC563M64 LQFP100 tray dimension SPC563M54L3 SPC563M60L3 SPC563Mxx eTPU microsecond bus bosch LBGA208 LQFP100
Contextual Info: SPC563Mxx 32-bit Power Architecture based MCU for automotive powertrain applications Preliminary data Features • LQFP144 20 mm x 20 mm ™ Single issue, 32-bit PowerPC Book E compliant e200z335 CPU core complex – Includes variable length encoding VLE

100P6S-A

Abstract: LQFP100-P-1414-0 LQFP144-P-2020-0 QFP100-P-1420-0 PAD108
Contextual Info: Package Dimensions M32C/83 Group Package Dimensions Recommended EIAJ Package Code LQFP144-P-2020-0.50 Plastic 144pin 20✕20mm body LQFP Weight g 1.23 JEDEC Code – Lead Material Cu Alloy MD e 144P6Q-A b2 D ME HD 144 109 1 l2 Recommended Mount Pad 108 36

PLQP0144KA-A

Abstract: BP 109 transistor BP 109 20X20 LQFP144 LQFP144 DATASHEET FP-144L
Contextual Info: JEITA Package Code P-LQFP144-20x20-0.50 RENESAS Code PLQP0144KA-A Previous Code 144P6Q-A / FP-144L / FP-144LV MASS[Typ.] 1.2g HD *1 D 108 73 109 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 72

stm32f407xx

Abstract: STM32f4xx reference manual
Contextual Info: STM32F405xx STM32F407xx ARM Cortex-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet - production data FBGA • LQFP64 10 x 10 mm LQFP100 (14 × 14 mm) LQFP144 (20 × 20 mm)

STM32f4xx reference manual

Contextual Info: STM32F405xx STM32F407xx ARM Cortex-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet - production data FBGA • LQFP64 10 x 10 mm LQFP100 (14 × 14 mm) LQFP144 (20 × 20 mm)

38C8

Abstract: LQFP144-P-2020-0 mitsubishi package PAD108
Contextual Info: MITSUBISHI MICROCOMPUTERS 38C8 Group SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER PACKAGE OUTLINE MMP EIAJ Package Code LQFP144-P-2020-0.50 Plastic 144pin 20✕20mm body LQFP Weight g 1.23 JEDEC Code – Lead Material Cu Alloy MD e 144P6Q-A b2 D 144 ME HD 109 1 l2

BP 109 transistor

Abstract: LQFP144
Contextual Info: JEITA Package Code P-LQFP144-20x20-0.50 RENESAS Code PLQP0144KB-A Previous Code FP-144F/FP-144FV MASS[Typ.] 1.4g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 108 73 109 72 bp c c1 HE Reference

BP 109 transistor

Abstract: LQFP144
Contextual Info: JEITA Package Code P-LQFP144-20x20-0.50 RENESAS Code PLQP0144KC-A Previous Code FP-144H/FP-144HV MASS[Typ.] 1.4g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 108 73 109 72 bp c c1 HE Reference

Contextual Info: SPC56EL60x, SPC56EL54x SPC564L60x, SPC564L54x 32-bit Power Architecture microcontroller for automotive SIL3/ASILD chassis and safety applications Datasheet - production data LQFP100 14 x 14x 1.4 mm LQFP144 (20 x 20 x 1.4 mm) LFBGA257 (14 x 14 mm) • Nexus Class 3+ interface

100P6S-A

Abstract: LQFP100-P-1414-0 LQFP144-P-2020-0 QFP100-P-1420-0 JEDEC Code PAD108
Contextual Info: Package Dimensions M32C/82 Group Package Dimensions 144P6Q-A Plastic 144pin 20✕20mm body LQFP Weight g 1.23 JEDEC Code – Lead Material Cu Alloy MD e EIAJ Package Code LQFP144-P-2020-0.50 b2 D ME HD 144 109 1 l2 Recommended Mount Pad 108 36 A A1 A2 b c

LQFP-144

Abstract: LQFP144 LQFP144 dimension LQFP144 DATASHEET
Contextual Info: PACKAGE DIMENSIONS LQFP144 0.22±0.05 0.08 M 73 108 109 72 +0.10 -0.05 20.00typ 0.10 0.10 22.00 ±0.40 0.50 +0.10 -0.05 144 37 1 36 0.17±0.05 20.00typ 1.00typ 0.37typ 0° 10 ° NOTE1 0.08 0.05MIN 1.25 1.70MAX 22.00±0.40 0.50±0.10 ＧＤ－Ｑ１４４０１Ｙ－０２

Contextual Info: STM32F415xx STM32F417xx ARM Cortex-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, crypto, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet - production data FBGA • LQFP64 10 x 10 mm LQFP100 (14 × 14 mm) LQFP144 (20 × 20 mm)

PAD108

Contextual Info: MMP EIAJ Package Code LQFP144-P-2020-0.50 Plastic 144pin 20✕20mm body LQFP Weight g 1.23 JEDEC Code – Lead Material Cu Alloy MD e 144P6Q-A b2 D 144 ME HD 109 1 l2 Recommended Mount Pad 108 36 A A1 A2 b c D E e HD HE L L1 Lp HE E Symbol 73 37 72 A L1 F

BGA-132

Abstract: manual STM32 touch sensing STM32L151RD STM32 F4 touch frame STM32L15x STM32L152 STM8L15 STM8 detail registers I2C
Contextual Info: STM32L151xD STM32L152xD Ultralow power ARM-based 32-bit MCU with 384 KB Flash, RTC, LCD, USB, analog functions, 10 serial ports, memory I/F Features • ■ ■ ■ ■ ■ LQFP144 20 x 20 mm LQFP100 14 × 14 mm LQFP64 10 × 10 mm Operating conditions – Operating power supply range: 1.65 V to

Contextual Info: Package outline LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm SOT486-1 c y X A 73 72 108 109 ZE e E HE A A2 A 3 A1 θ wM Lp bp L pin 1 index 144 detail X 37 1 36 v M A ZD wM bp e D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)

sot486

Abstract: SOT486-1
Contextual Info: PDF: 1999 Nov 03 Philips Semiconductors Package outline LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm SOT486-1 c y X A 73 72 108 109 ZE e E HE A A2 A 3 A1 θ wM Lp bp L pin 1 index detail X 37 144 1 36 v M A ZD wM bp e

LQFP144

Abstract: MS-026 136E23
Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm SOT486-1 c y X A 73 72 108 109 ZE e E HE A A2 A 3 A1 θ wM Lp bp L pin 1 index detail X 37 144 1 36 v M A ZD wM bp e

LQFP144-P-2020-0

Abstract: LQFP144-P-2020 LQFP144 DATASHEET
Contextual Info: 144P6Q-A Plastic 144pin 20✕20mm body LQFP EIAJ Package Code LQFP144-P-2020-0.50 Weight g Lead Material Cu Alloy MD e JEDEC Code – HD 144 b2 ME D 109 1 108 l2 36 Symbol HE E Recommended Mount Pad 73 37 72 A L1 F c A1 b A2 e y L Detail F A A1 A2 b c D E

BP 109 transistor

Abstract: LQFP144 DATASHEET LQFP144 MS-026
Contextual Info: PDF: 2000 Mar 15 Philips Semiconductors Package outline LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm SOT486-1 c y X A 73 72 108 109 ZE e E HE A A2 A 3 A1 θ wM Lp bp L pin 1 index detail X 37 144 1 36 v M A ZD wM bp e