LQFP32 PACKAGE Search Results

MB95F334K

Abstract: MB95F334 LQFP32 LQFP32 footprint MB95F334KPMC-G-SNE2 MB95F330 MB95F334HPMC-G-SNE2 mb95f334kpmc mother MB95F333K
Contextual Info: Fujitsu Microelectronics Shanghai Co., Ltd. Application Note MCU-AN-500061-E-11 F²MC-8FX FAMILY 8-BIT MICROCONTROLLER MB95330 SERIES LQFP32 PGM ADAPTOR APPLICATION NOTE LQFP32 PGM ADAPTOR V1.1 Revision History Revision History Date 2009-11-03 2009-11-26

EP116

Abstract: EP105 LVE164 LVEP210 ECLLQFP32EVB LQFP32 RO4003 capacitor 0.1 mf EP1968 EP451
Contextual Info: ECLLQFP32EVB Evaluation Board Manual for High Frequency LQFP32 http://onsemi.com EVALUATION BOARD MANUAL INTRODUCTION ON Semiconductor has developed an evaluation board for the devices in 32-lead LQFP package. These evaluation boards are offered as a convenience for the customers

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LQFP32 package SOT401-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: ECLLQFP32EVB Evaluation Board User's Manual for High Frequency LQFP32 http://onsemi.com EVAL BOARD USER’S MANUAL INTRODUCTION ON Semiconductor has developed an evaluation board for the devices in 32−lead LQFP package. These evaluation boards are offered as a convenience for the customers

Contextual Info: L99H01 Motor bridge driver for automotive applications Datasheet - production data Applications • Wiper • Power door • Seat belt tensioner • Seat positioning LQFP32 7x7mm PowerSSO-36 • Valve tronic • Park break • 2H motors Features Description

Contextual Info: Philips Semiconductors CMOS and NMOS 8-bit microcontroller family 3300 FAMILY CMOS continued TYPE 3359A ROM 2 RAM SPEED (MHz) 64 1-16 PACKAGE DIL28 S028 LQFP32 3745A 4.5k (OTP) 256 1-16 FUNCTIONS OM5501/2 16 I/O lines, 8-bit timer, RTC, VDD 1.8V-6V 2 Programmable

32P6U-A

Contextual Info: R8C/11 Group Appendix 1. Package Dimensions Appendix 1. Package Dimensions 32P6U-A MMP Plastic 32pin 7✕7mm body LQFP Weight g JEDEC Code – Lead Material Cu Alloy MD b2 HD D 32 ME e EIAJ Package Code LQFP32-P-0707-0.80 25 I2 24 Recommended Mount Pad Symbol

STM8S103FX

Abstract: stm8sp103 STM8S103K3 STM8S103F3 STM8S103Kx STM8S103 UFQFPN20-pin stm8s103xx STM8S103F2 adc example sTM8s
Contextual Info: STM8S103K3 STM8S103F3 STM8S103F2 Access line, 16 MHz STM8S 8-bit MCU, up to 8 Kbytes Flash, data EEPROM,10-bit ADC, 3 timers, UART, SPI, I²C Interrupt management Nested interrupt controller with 32 interrupts LQFP32 7x7 UFQFPN32 5x5 • • Up to 27 external interrupts on 6 vectors

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LQFP32 package SOT358-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: L99H01 Motor bridge driver for automotive applications Datasheet - production data Applications • Wiper • Power door • Seat belt tensioner • Seat positioning LQFP32 7x7mm PowerSSO-36 • Valve tronic • Park break • 2H motors Features Description

PLQP0032GB-A

Abstract: P-LQFP32 32P6U-A lqfp32 91ze 1D24
Contextual Info: JEITA Package Code P-LQFP32-7x7-0.80 RENESAS Code PLQP0032GB-A Previous Code 32P6U-A MASS[Typ.] 0.2g HD *1 D 24 17 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 16 25 bp c c1 HE *2 E b1 Reference

Contextual Info: C8051F93x/92x C8051F930 D EVELOPMENT K IT U S E R ’ S G UIDE 1. Relevant Devices The C8051F930 Development Kit is intended as a development platform for the microcontrollers in the C8051F93x-C8051F92x MCU family. Notes: 1. The target board included in this kit is provided with a pre-soldered C8051F930 MCU LQFP32 package .

5401 DM transistor

Contextual Info: STM8S003K3 STM8S003F3 Value line, 16 MHz STM8S 8-bit MCU, 8 Kbytes Flash, 128 bytes data EEPROM, 10-bit ADC, 3 timers, UART, SPI, I²C Interrupt management Nested interrupt controller with 32 interrupts • • Up to 27 external interrupts on 6 vectors LQFP32 7x7

LQFP32-P-0707-0

Abstract: 32P6U-a
Contextual Info: R8C/10 Group Appendix 1. Package Dimensions Appendix 1. Package Dimensions 32P6U-A MMP Plastic 32pin 7✕7mm body LQFP Weight g JEDEC Code – Lead Material Cu Alloy MD b2 HD D 32 ME e EIAJ Package Code LQFP32-P-0707-0.80 25 I2 24 Recommended Mount Pad Symbol

STM8S903

Abstract: 903K3 5401 DM stm8s903k STM8 S 903 K 3 T 6 C TR pm0051 UM04 ic 8038 STM8 CPU programming manual switching regulator ic LM 5304
Contextual Info: STM8S903K3 16 MHz STM8S 8-bit MCU, up to 8 Kbytes Flash, 1 Kbyte RAM, 640 bytes EEPROM,10-bit ADC, 2 timers, UART, SPI, I²C Preliminary data Features Core • ■ 16 MHz advanced STM8 core with Harvard architecture and 3-stage pipeline LQFP32 7x7 VFQFPN32 5x5

STM8S

Abstract: 5401 DM transistor STM8S003F3 UFQFPN20-pin PWM generation STM8s stm8s003 STM8S003K3 STM8S00 5401 DM STM8 CPU programming manual
Contextual Info: STM8S003K3 STM8S003F3 Value line, 16 MHz STM8S 8-bit MCU, 8 Kbytes Flash, 128 bytes data EEPROM, 10-bit ADC, 3 timers, UART, SPI, I²C Interrupt management Nested interrupt controller with 32 interrupts • • Up to 27 external interrupts on 6 vectors LQFP32 7x7

stm8s003

Abstract: STM8S003F3 STM8S003F STM8S003K3 5401 DM transistor UFQFPN20-pin stm8s00 5401 DM transistor equivalent 505a PWM generation STM8s
Contextual Info: STM8S003K3 STM8S003F3 Value line, 16 MHz STM8S 8-bit MCU, 8 Kbytes Flash, 128 bytes data EEPROM, 10-bit ADC, 3 timers, UART, SPI, I²C Interrupt management Nested interrupt controller with 32 interrupts • • Up to 27 external interrupts on 6 vectors LQFP32 7x7

UFQFPN20-pin

Abstract: 5401 DM transistor stm8s00 pwm example sTM8s PEAK tray drawing 3x3 STM8 CPU programming manual PM0051 STM8 spi programming manual
Contextual Info: STM8S003K3 STM8S003F3 Value line, 16 MHz STM8S 8-bit MCU, 8 Kbytes Flash, 128 bytes data EEPROM, 10-bit ADC, 3 timers, UART, SPI, I²C Interrupt management Nested interrupt controller with 32 interrupts • • Up to 27 external interrupts on 6 vectors LQFP32 7x7

JEP95

Abstract: bc 7-25 LQFP32 LQFp32 weight A2MA
Contextual Info: ZMD-Standard April 2002 Package LQFP32 7 x 7 MDS 738 Supersedes Edition 11.95 Dimensions in millimetres Based on JEDEC JEP95: MO-136 BC 1 Dimensions Detail Z A A2 Z G c LP HE 32 e E b 0,2 M A1 0,1 1 D HD Dimensions of Sub-Group B1 Dimensions of Sub-Group C1

a1716

Abstract: LQFP32 MS-026 SOT358-1
Contextual Info: PDF: 2003 Mar 28 Philips Semiconductors Package outline LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm SOT358-1 c y X 24 A 17 16 25 ZE e E HE A A2 A 1 A 3 wM θ bp Lp pin 1 index L 32 9 detail X 1 8 e ZD v M A wM bp D B HD v M B

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm SOT358-1 c y X 24 A 17 25 16 ZE e E HE A A2 A 1 A 3 wM θ bp Lp L pin 1 index 32 9 detail X 8 1 e ZD v M A wM bp D B HD v M B

LQFP32 package

Abstract: lqfp32 MS-026
Contextual Info: PDF: 2000 Jan 20 Philips Semiconductors Package outline SOT401-1 LQFP32: plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm c y X A 17 24 ZE 16 25 e A A2 E HE A 3 A1 w M pin 1 index θ bp 32 Lp 9 L 1 8 detail X ZD e v M A w M bp D B HD

LQFP-32P

Contextual Info: 32P6B-A Plastic 32pin 7✕7mm body LQFP EIAJ Package Code LQFP32-P-77-0.80 Weight g Lead Material Alloy 42 MD e JEDEC Code – b2 ME HD D 32 25 I2 1 24 E HE Recommended Mount Pad Symbol 17 8 9 16 A L1 e y b A1 c A2 F L Detail F A A1 A2 b c D E e HD HE L L1

LQFP32 package

Abstract: LQFP32 MS-026 A1725
Contextual Info: PDF: 2000 Jan 20 Philips Semiconductors Package outline LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm SOT358-1 c y X 24 A 17 25 16 ZE e E HE A A2 A 1 A 3 wM θ bp Lp L pin 1 index 32 9 detail X 1 8 e ZD v M A wM bp D B HD v M B