LQFP80 Search Results

LQFP80

Abstract: LQFP-80
Contextual Info: Philips Semiconductors Package outlines LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm 1997 Jul 15 1 SOT315-1

Al21

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm SOT315-1 c y X A 60 41 40 Z E 61 e E HE A A2 A 3 A1 w M θ bp L pin 1 index 80 Lp 21 detail X 20 1 ZD e v M A w M bp D

LQFP80

Contextual Info: LQ FP 80 SOT315-1 LQFP80; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 15 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape

D4164

Abstract: P-LQFP80 PLQP0080GA-A lqfp80
Contextual Info: JEITA Package Code P-LQFP80-14x20-0.80 RENESAS Code PLQP0080GA-A Previous Code 80P6U-A MASS[Typ.] 1.0g HD *1 D 41 64 65 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 40 bp c HE *2 E c1 b1 Reference

1414A

Contextual Info: MN103S53G Type MN103S53G under development Command ROM (x× 64-bit) 128 K-byte Data RAM (×× 32-bit) 12 K-byte Package LQFP80-P-1414A *Pb-free Minimum Instruction Execution Time 25.0 ns (at 3.0 V to 3.6 V, 40 MHz) Interrupts • RESET • IRQ × 8 • NMI • Timer × 28 • SIF × 10 • I2C × 2

Contextual Info: Package outline LQFP80: plastic low profile quad flat package; 80 leads; body 14 x 14 x 1.4 mm SOT823-1 c y X A 60 61 41 40 ZE e A A2 E HE A 3 A1 θ w M Lp bp pin 1 index L detail X 21 80 20 1 w M bp e v M A ZD B D HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)

SOT315-1

Abstract: LQFP80 MS-026
Contextual Info: PDF: 2003 Mar 28 Philips Semiconductors Package outline LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm SOT315-1 c y X A 60 41 40 Z E 61 e E HE A A2 A 3 A1 w M θ bp Lp L pin 1 index 80 21 1 detail X 20 ZD e v M A w M bp D

Contextual Info: Package outline LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm SOT315-1 c y X A 60 41 40 Z E 61 e E HE A A2 A 3 A1 w M θ bp L pin 1 index 80 Lp 21 1 detail X 20 e ZD w M bp v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)

PLQP0080KB-A

Contextual Info: JEITA Package Code P-LQFP80-12x12-0.50 RENESAS Code PLQP0080KB-A Previous Code 80P6Q-A MASS[Typ.] 0.5g HD *1 D 60 41 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 40 61 bp c HE *2 E c1 b1 Reference

P-LQFP80

Abstract: PLQP0080JA-A lqfp80 P-LQFP80-14X14-0
Contextual Info: JEITA Package Code P-LQFP80-14x14-0.65 RENESAS Code PLQP0080JA-A Previous Code FP-80W / FP-80WV MASS[Typ.] 0.6g HD *1 D 60 41 40 61 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. HE b1 Terminal cross section

LQFP80-P-1212-0

Abstract: 80P6QA
Contextual Info: 80P6Q-A Plastic 80pin 12✕12mm body LQFP EIAJ Package Code LQFP80-P-1212-0.5 Weight g Lead Material Cu Alloy MD e JEDEC Code – HD 61 1 b2 80 ME D 60 l2 HE E Recommended Mount Pad Symbol 41 20 21 40 A F L1 c A2 e y A1 b L Detail F A A1 A2 b c D E e HD HE

LQFP80-P-1212-0

Abstract: LQFP-80P
Contextual Info: 80P6D-A Plastic 80pin 12✕12mm body LQFP Weight g 0.44 JEDEC Code – Lead Material Alloy 42 MD e EIAJ Package Code LQFP80-P-1212-0.50 61 b2 80 ME HD D 60 1 I2 HE E Recommended Mount Pad Symbol 41 20 21 40 A F e A2 L1 c b A A1 A2 b c D E e HD HE L L1 y A1

80P6QA

Contextual Info: MMP Weight g 0.47 JEDEC Code – Lead Material Cu Alloy MD HD b2 D 80 ME EIAJ Package Code LQFP80-P-1212-0.5 Plastic 80pin 12✕12mm body LQFP e 80P6Q-A 61 1 l2 Recommended Mount Pad 60 A A1 A2 b c D E e HD HE L L1 Lp HE E Symbol 41 20 21 40 A L1 F M y L

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LQFP80 package SOT315-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: P-LQFP80-1212-0.50D

sot823

Abstract: LQFP80 MS-026
Contextual Info: PDF: 2003 Jul 15 Philips Semiconductors Package outline LQFP80: plastic low profile quad flat package; 80 leads; body 14 x 14 x 1.4 mm SOT823-1 c y X A 60 61 41 40 ZE e A A2 E HE A 3 A1 θ w M Lp bp pin 1 index L detail X 21 80 20 1 w M bp e v M A ZD B D

MN103S5

Abstract: MN103S53G
Contextual Info: MN103S53G Type MN103S53G under development Command ROM (x× 64-bit) 128 K-byte Data RAM (×× 32-bit) 12 K-byte Package LQFP80-P-1414A *Pb-free Minimum Instruction Execution Time 25.0 ns (at 3.0 V to 3.6 V, 40 MHz) Interrupts • RESET • IRQ × 8 • NMI • Timer × 28 • SIF × 10 • I2C × 2

LQFP80

Abstract: MS-026
Contextual Info: PDF: 2000 Jan 20 Philips Semiconductors Package outline LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm SOT315-1 c y X A 60 41 40 Z E 61 e E HE A A2 A 3 A1 w M θ bp L pin 1 index 80 Lp 21 1 detail X 20 ZD e v M A w M bp D

LPC9221

Abstract: embedded c code to interface lpc2148 with sensor P89V51RD2 microcontroller LPC2148 i2c with sensor LPC925 p89v51rd2 LPC700 LPC2148 p89v51rd2 development board lpc1754
Contextual Info: April 2009 The choice for embedded technologies Our microcontroller offering combines the highest performance in Flash with the lowest power consumption in the smallest packages. A comprehensive portfolio of industryleading performers includes the latest 32-bit LPC3000, LPC2000, LPC1000, LH7A, LH7, and 8-bit LPC900, LPC700 and 80C51 families. We offer an easy migration path from

LPC2148 i2c eeprom c code

Abstract: lcd c program using lpc2378 LPC2468 embedded c code to interface lpc2148 with sensor LPC932A1 LPC922 LPC932A lpc921 lpc935 ac motor control LPC2378 instruction cache
Contextual Info: August 2008 The choice for embedded technologies Our microcontroller offering combines the highest performance in Flash with the lowest power consumption in the smallest packages. A comprehensive portfolio of industryleading performers includes the latest 32-bit LPC3000, LPC2000, LPC1000, LH7A, LH7, and 8-bit LPC900, LPC700 and 80C51 families. We offer an easy migration path from

SBR CODEC

Abstract: speaker with screen LQFP48 LQFP64 LQFP80 PR3000 UCB1100 capacitive multi touch delta sigma a d conversion technique overview circuit diagram of ADC connection to pic
Contextual Info: INTEGRATED CIRCUITS DATA SHEET UCB1100 Advanced modem/audio analog front-end Preliminary specification File under Integrated Circuits, <Handbook> 1997 Apr 11 Philips Semiconductors Preliminary specification Advanced modem/audio analog front-end UCB1100 FEATURES

Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS706-00049-1v0-E 32-bit ARMTM CortexTM-M3 based Microcontroller MB9B320M Series MB9BF324K/L/M, MB9BF322K/L/M, MB9BF321K/L/M  DESCRIPTION The MB9B320M Series are highly integrated 32-bit microcontrollers dedicated for embedded controllers

Contextual Info: Spansion Analog and Microcontroller Products The following document contains information on Spansion analog and microcontroller products. Although the document is marked with the name “Fujitsu”, the company that originally developed the specification, Spansion

AS8202

Abstract: AS8202NF LQFP80 MS-026 dc 722
Contextual Info: AS8202NF Data Sheet TTP-C2NF Communication Controller 1 General Description 40 MHz main clock with support for 10 MHz crystal, 10 MHz oscillator or 40 MHz oscillator The AS8202NF communication controller is an integrated device supporting serial communication