M-BOND 200 EQUIVALENT Search Results
M-BOND 200 EQUIVALENT Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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TMP89FH46LDUG |
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8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP48-P-0707-0.50D |
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TMP89FM46DUG |
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8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP48-P-0707-0.50D |
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TMP89FS60UG |
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8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP64-P-1010-0.50D |
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TMP89FH46DUG |
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8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP48-P-0707-0.50D |
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TMP89FM46ADUG |
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8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP48-P-0707-0.50D |
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M-BOND 200 EQUIVALENT Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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RFLW5N1500Contextual Info: RFLW 5N Vishay Electro-Films High Frequency Wire Bondable RF Spiral Inductor, 0.050" x 0.050" FEATURES • High frequency • Wire bond assembly • Small size: 0.050" x 0.050" x 0.020" • Low DCR, high Q • Low parasitic capacitance, high SRF • Equivalent circuit model enclosed |
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11-Mar-11 RFLW5N1500 | |
RFLW5N1500Contextual Info: RFLW 5N Vishay Electro-Films High Frequency Wire Bondable RF Spiral Inductor, 0.050" x 0.050" FEATURES • High frequency • Wire bond assembly • Small size: 0.050" x 0.050" x 0.020" • Low DCR, high Q • Low parasitic capacitance, high SRF • Equivalent circuit model enclosed |
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2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12 RFLW5N1500 | |
RFLW5N1500Contextual Info: RFLW 5N Vishay Electro-Films High Frequency Wire Bondable RF Spiral Inductor, 0.050" x 0.050" FEATURES • High frequency • Wire bond assembly • Small size: 0.050" x 0.050" x 0.020" • Low DCR, high Q • Low parasitic capacitance, high SRF • Equivalent circuit model enclosed |
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2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 RFLW5N1500 | |
60cmq
Abstract: 403CNQ IOR 445
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I75S060A SC200ROI5SW SC200S030SWB SC200H045SWB SC200S045SWB S045SWB H045SWB 60cmq 403CNQ IOR 445 | |
Contextual Info: V I S H AY I N T E R T E C H N O L O G Y, I N C . RFLW KEY BENEFITS • Wire bond assembly • Small size: 0.030" x 0.030" x 0.020" or 0.050" x 0.050" x 0.020" • Low DCR, high Q • Low parasitic capacitance, high SRF • Equivalent circuit model • S parameter files available for download |
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VMN-PT0227-1007 17-Jun-10 | |
1N4150UR-1Contextual Info: MINI-MELF-SMD Silicon Diode 1N4150UR-1 Applications Switching Used in general purpose applications, where a low current controlled forward characteristic and fast switching speed are important. BKC can produce generic equivalents to JAN/ TX/ TXV and S level per |
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1N4150UR-1 MIL-S-19500/ LL-34/35 DO-35 Mil-S-19500/231 031-A MSC0960 1N4150UR-1 | |
DIODE Z54Contextual Info: MINI-MELF-SMD Applications LL4150 or LL4150-1 10 Silicon Diode Switching Used in general purpose applications, where a low current controlled forw ard characteristic and fast sw itching speed are im portant. BKC can produce generic equivalents to JAN/ TX; TXV and S level per |
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LL4150 LL4150-1 MIL-S-19500/ LL-34/35 DO-213AA DO-35 10-REF 031-A DIODE Z54 | |
TGA8722-SCC
Abstract: s32a
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TGA8722-SCC 20-GHz 15-dB 16-dB 13-dBm 15-dBm TGA8722-SCC 20-GHz. s32a | |
Contextual Info: TGS8630-XCC DC TO 12-GHz SPDT SWITCH AP PR O VAL 5026 On-Chip Driver Compatible With CMOS or Open-Collector TTL Typical Insertion Loss . . . 2.3 dB at 12 GHz High Isolation . . . 46 dB Through 12 GHz Useable Bandwidth Through 18 GHz Size: 3,454 x 2,007 x 0,102 mm |
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TGS8630-XCC 12-GHz 46-dB 1016x0 0040x0 | |
MBD2057-C18Contextual Info: FEATURES • • • • • Rugged Germanium Planar Construction Excellent Temperature Stability No DC Bias Required Wide Video Bandwidth MIL-STD-19500 & 883 Capability M A X IM U M RATINGS Storage Tem perature. -6 5 to +125°C Operating T e m p e ra tu re . -6 5 to +110°C |
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MIL-STD-19500 MBD2057-C18 | |
MBD3057-C18
Abstract: MBD5057-C18 back Tunnel diode MBD-3057-C18 MIL-STD-195 MBD5057 MBD2057-C18 MBD-1057-C18 MBD1057
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MIL-STD-195 MBD-1057-C18 MBD-1057-T80 MBD-1057-T54 MBD-1057-H20 MBD-1057-E26 MBD-2057-C18 MBD-2057-T80 MBD-2057-T54temperature, MBD3057-C18 MBD5057-C18 back Tunnel diode MBD-3057-C18 MBD5057 MBD2057-C18 MBD1057 | |
MBD3057-C18
Abstract: back Tunnel diode
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MBD3057-C18
Abstract: MBD2057-C18 MBD-1057-C18 mbd1057-c18 MBD-2057-C18 back Tunnel diode mbd 1057 MBD-3057-C18 MBD-3057-H20 "back diode"
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MSTF-2ST-10R00J-G
Abstract: Au Sn eutectic M570 bond wire gold soft solder die bonding 84-1LMI
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D35BV102KPX MSTF-2ST-10R00J-G Au Sn eutectic M570 bond wire gold soft solder die bonding 84-1LMI | |
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TP-1010
Abstract: TP1041 54LVTH162244 pda jog x 0602 ma 54LVTH162244RP TM2018 TP1007
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16-BIT 54LVTH162244RP 00Rev0 TP-1010 TP1041 54LVTH162244 pda jog x 0602 ma 54LVTH162244RP TM2018 TP1007 | |
i236Contextual Info: Application Not High-Volume Commercial Plastic Packaged GaAs Monolithic Devices Abstract In d eveloping a new product line o f high volum e com m ercial plastic packaged G aA s m onolithic devices, it has becom e evi dent that norm al design, fabrication, and evaluation tech |
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I-236 i236 | |
LL4150 SMD
Abstract: DO-213AA LL4150 LL4150-1
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LL4150 LL4150-1 MIL-S-19500/ LL-34/35 DO-213AA DO-35 031-A LL4150 SMD DO-213AA LL4150 LL4150-1 | |
Contextual Info: TGA8061-SCC Low-Noise Amplifier 100-MHz to 3.5-GHz Frequency Range 3-dB Bandwidth Exceeds 5 Octaves 2.4-dB Noise Figure with Low Input and Output SWR 18-dB Gain 15-dBm Output Power at 1-dB Gain Compression Operates from Single 12 V Supply 1,524 x 1,524 x 0,102 mm 0.060 x 0.060 x 0.004 in. |
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TGA8061-SCC 100-MHz 18-dB 15-dBm A8061-SCC | |
DO-213AA
Abstract: LL4150 LL4150-1
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LL4150 LL4150-1 MIL-S-19500/ LL-34/35 DO-213AA DO-35 031-A DO-213AA LL4150 LL4150-1 | |
Contextual Info: TGA8320-SCC Gain Block Amplifier DC to 8-GHz Frequency Range L, S, and C-Band 9.5-dB Gain 1.3:1 Input/Output SWR 17-dBm Output Power at 1-dB Gain Compression Typical Noise Figure is 5-dB 1,066 x 1,219 x 0,152 mm (0.042 x 0.048 x 0.006 in.) PHOTO ENLARGEMENT |
OCR Scan |
TGA8320-SCC 17-dBm TGA8320-SCC 16-dB | |
TP-1010
Abstract: TP1007 TP-1012 54LVTH162245RP TM500 TP1008 TM2023 TP-1007 TP1033
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54LVTH162245RP 00Rev0 TP-1010 TP1007 TP-1012 54LVTH162245RP TM500 TP1008 TM2023 TP-1007 TP1033 | |
RR-63Contextual Info: inteT RELIABILITY REPORT RR-63 August 1989 4 Static RAM Reliability Report MADHU NIMGAONKAR COMPONENTS CONTRACTING DIVISION QUALITY AND RELIABILITY ENGINEERING Order Number: 240544-001 4-63 SRAM RELIABILITY DATA SUMMARY CONTENTS PAGE 1.0 IN T R O D U C T IO N .4-65 |
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RR-63 RR-63 | |
Contextual Info: TGA8061-SCC “ H 1 100-MHz to 3.5-GHz Frequency Range 3-dB Bandwidth Exceeds 5 Octaves 2.4-dB Noise Figure with Low Input and Output SWR 18-dB Gain 15-dBm Output Power at 1-dB Gain Compression Operates from Single 12 V Supply 1,524 x 1,524 x 0,102 mm 0.060 x 0.060 x 0.004 in. |
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TGA8061-SCC 100-MHz 18-dB 15-dBm A8061-SCC | |
5082-0024Contextual Info: HEWLETT-PACKARD i CMPNTS EOE D □ 44475ÔM QDGStbT HIGH RELIABILITY SCHO TTKY CHIP FOR M EDICAL APPLICATIO NS U'/jT] H E W L E T T vlWJj P A C K A R D 2 CJ HSCH-1111 Features JAN-TXV EQUIVALENT HIGH BREAKDOWN VOLTAGE PICO -SECO N D SW ITCHING SPEED LOW TURN-ON |
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HSCH11 MIL-S-19500 IL-STD-750 IL-STD-883 D-883 5082-0024 |