M-PRINT 1.60 Search Results

N connector termination instruction

Abstract: I0007
Contextual Info: DWG NO. SH C T R P 0 2 2 -I This print and associated documents and the contained inform ation are the confidential property of ELECTRONIC CABLE SPECIALISTS. Disclosure of, a n d /o r reproduction of, all or part thereof or m anufacture of any part from information contained on this print not specifically per­

inkjet printer circuit

Abstract: tl7705 Nippon capacitors stl motor control 64 lead
Contextual Info: MC68322 Printer Processor User's Manual ^ M O TO RO LA Introduction Signal Descriptions The Core Bus Operation ^ Interrupt and Exception Handling System Integration Module DRAM Controller DMA Interface Parallel Port Interface Print Engine Interface RISC Graphics Processor

Contextual Info: Mini-Circuits - Specification for Frequency Mixer - TUF-2MHSM Frequency Mixers Notes: • L = 50-100 MHz; M = 100-500 MHz • For Surface Mount Environmental Specifications, print this page • General Quality Control Procedures and LO Power Level 13 dBm without notice.

Contextual Info: REVISION E DO NOT SCALE FROM THIS PRINT NOTES: ISD2-XX-D-X DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] 1. C REPRESENTS A CRITICAL DIMENSION. 2. LATCH RETENTION FORCE: 2.22N [.5LB] 3. PARTS TO BE PACKAGED IN TUBES. OPTION -M: METAL RETENTION LATCH -S: DUAL SCREW DOWN

Contextual Info: REVISION A DO NOT SCALE FROM THIS PRINT NOTES: DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] 1. C REPRESENTS A CRITICAL DIMENSION. 2. LATCH RETENTION FORCE: 2.22N [.5LB] 3. PARTS TO BE PACKAGED IN TUBES. ISD2-XX-D-M METAL RETENTION LATCH No OF POSITIONS -02 THRU -50

Contextual Info: REVISION G DO NOT SCALE FROM THIS PRINT NOTES: ISD2-XX-D-X DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] 1. C REPRESENTS A CRITICAL DIMENSION. 2. LATCH RETENTION FORCE: 2.22N [.5LB] 3. PARTS TO BE PACKAGED IN TUBES. OPTION -M: METAL RETENTION LATCH -S: DUAL SCREW DOWN

Contextual Info: REVISION B DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] "E" 0.20[.008] "F" 0.20[.008] VHDCP-XX-01-M-EM MOUNTING OPTION -EM: EDGE MOUNT No OF POSITIONS -36, -50, -68 TOTAL CL DO NOT SCALE FROM THIS PRINT LEAD STYLE -01 C1 "A" 0.15[.006] C2 "B" 0.15[.006]

96724

Contextual Info: Mini-Circuits - Specification for Frequency Mixer - ZP-2MH Frequency Mixers Notes: • +13 dBm LO, up to +9 dBm RF • Absolute maximum power, voltage and current ratings: a. RF power, 200mW b. Peak IF current, 40mA print this page • L = 50-100 MHz; M = 100-500 MHz

Contextual Info: REVISION F DO NOT SCALE FROM THIS PRINT NOTES: DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] 1. REPRESENTS A CRITICAL DIMENSION. 2. LATCH RETENTION FORCE: 2.22N [.5LB] 3. PARTS TO BE PACKAGED IN TUBES. iM r, o f po p y ISD2-XX-D-X OPTION -M: METAL RETENTION LATCH

Contextual Info: REVISION D ALL DIMENSIONS ARE REFERENCES SEE XC-309-01-XX FOR CONTROLLING PRINT CC09X-01-XX DESIGNED & DIMENSIONED IN MILLIMETERS SUPPLIED -R: REEL -M: MINI REEL PLATING -T: TIN PLATING -GF: 3u" MIN Au/50u" Ni IN CONTACT AND TAIL LEAD STYLE -01 DO NOT SCALE FROM

Contextual Info: REVISION A DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] MTCA-XXX-XX-X-DV No OF POSITIONS -085 PER ROW DO NOT SC A LE FRO M THIS PRINT LEAD STYLE -02: 1.6 [.063] TH IC K C A R D P L A TIN G -S (SELEC TIVE ,00076[.000030] GOLD

mods-f

Abstract: 8P8C connector
Contextual Info: REVISION M MODS-F-8P8C-X-XX-X-X-TH-X DESIGNED & DIMENSIONED IN MILLIMETERS TYPE -F POSITIONS/CONTACTS -8P8C: 8 POS/8 CON C1 DO NOT SCALE FROM THIS PRINT E & I OPTION -R: RoHS COMPLIANT PLATING -L: .000015" GOLD -S: .000030" GOLD -U: .000050" GOLD SEE NOTE 4

Contextual Info: REVISION M DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] LSHM-1XX-XX-X-RH-A-X-X-TR PACKAGING -TR: TAPE & REEL SEE NOTE 5 OPTION -K: POLYAMIDE FILM (USE K-DOT-.177-.281-.005) No OF POSITIONS *-05, *-10, -20, -30, -40, -50 DO NOT SCALE FROM THIS PRINT LEAD STYLE

96724

Contextual Info: Mini-Circuits - Specification for Frequency Mixer - TUF-2MH Frequency Mixers Notes: • 15 dB min. 8.5 to 10 GHz • L = 50-100 MHz; M = 100-500 MHz • General Quality Control Procedures and Environmental print this page LO Power Level 13 dBm TUF-2MH Specifications are given in Mini- Circuits Guarantees

Contextual Info: REVISION M DESIGNED & DIMENSIONED IN MILLIMETERS [INCHES] DO NOT SCALE FROM THIS PRINT TEMX-1XX-XX-XX.X-XX-D-XX-XX BODY OPTION FIG 1 TEM-110-02-03.0-XX-D SHOWN -02: SURFACE MOUNT STACK HEIGHT -03.0: (6MM STACK HEIGHT) (T-1M58-03.0-XX) -04.0: (7MM STACK HEIGHT) (T-1M58-04.0-XX)

Contextual Info: DO NOT SCALE FROM THIS PRINT MPSC-XX-XX-XX-01-XX-X-RA-XX DESIGNED & DIMENSIONED IN MILLIMETERS REVISION M "C" SEE TABLE 2, SHEET 2 41.40 1.630 REF 3.56 .140 REF (TYP) OPTION -SD: SCREW DOWN (SEE FIG 1) -LC: LOCKING CLIP (USE LC-07-TM) (SEE FIG 2, SHT 2)

324 EZ

Abstract: SB-616 ST EZ 648 EZ 648 SB0A-648 SBS-624 SB-422 sb318 sb618 ICA-308-V
Contextual Info: TITLE: UNLESS OTHERMSE NOTED R E V IS IO N DIMENSONS ARE IN MCHE5 BQ DD NDT SCA LE FRDM T H IS PRINT DWG NO: TOLERANCES ARE; ONE PLACE DECIMALS ± THREE PLACE DECIMALS ± ANGLES TWO PLACE DECIMALS ± FOUR PLACE DECIMALS ± ± IC A S S E M B L Y SHEET 1 OF 2

CQFP144

Contextual Info: m > z PIN 1 IDENT C m I < -0- p fo o o 00 S D PLANE FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: CQFP 144 LEAD 2 6 .7 7 X 2 6 .7 7 X 3 .5 0 .6 5 MM PITCH MECHANICAL OUTLINE PRINT VERSION NOT TO SCALE DOCUMENT NO: 9 8 A S B 48 0 0B REV: B CASE NUMBER: 8 6 3 A -0 1

Contextual Info: REVISION E SEAM-XX-XX-X-XX-X-RA-XX-TR "H" REF SEE TABLE 3 "L" REF "A" DO NOT SCALE FROM THIS PRINT 'G' LEAD STYLE -01 .485 12.32 REF "B" REF (SEAM-20-01-X-04-X-RA-GP) (SOME DETAIL OMITTED FOR CLARITY) .760 19.30 REF C "M" REF .100 2.54 REF C .0500 1.270 L

CSB 455 j

Abstract: scr 122 G-455
Contextual Info: m CRYSTAL FILTERS TYPICAL FILTER PACKAGES * .30 i MAX J — c = IL- .100 t .2 5 |— MIN 4 PL t DUT GND GND B .7 5 .150 t IN ^ “ 1 A« .030 GND PIN <2 PLACES B= .030 GLASS SEAL <2 PLACES) CSF OUTLINE CDST 2 POLE 4 POLE 6 POLE 8 POLE 10 POLE PRINT A 2 PDLE

CASH

Contextual Info: DETAIL G A PIN 1 -NDEX A R E A 0.1 c 0.1 c M 1.80 1.60 I ^ 10.11C I A I B I 16 ! 20 PIN 1 INDEX EXPOSED DIE ATT ACH PAD 15 — 1 6 X 0 .4 1 .80 1 .60 |-$-|Q-i |c |a [b1 10 20X 0.25 0.1 5 20X 0.50 0.30 ‘ 0 .0 7 0 A B 0 .0 5 © C © FREESCALE SEMICONDUCTOR,

Schematics 5250

Abstract: schematic 5250
Contextual Info: REV. S ta tu s REVISION 07/26/01 MP TELECOMMUNICATION V.90 MODEM TRANSFORMER A. Electrical Specifications @ 25° C 1. Primary Impedance; 600Q 2. Secondary Impedance; 525Q LO O T O o UL# E208555 LO I 3. Insertion Loss: 1.60dB MAX @ 1KHz, OdBm CJ 4. Frequency Response; ±0.25dB @ 200Hz to 4KHz, OdBm

MS-026

Abstract: 7x7x1 ltr 301
Contextual Info: CONTROL DIMENSIONS ARE SYMBOL MILLIMETER NOM. MAX. MIN. NOM. A - - 1.60 - - 0 .0 6 3 Ai 0 .0 5 - 0 .1 5 0 .0 0 2 - 0 .0 0 6 A2 1 .35 1.40 1.45 0 .0 5 3 0 .0 5 5 0 .0 5 7 9 .0 0 BSC. 0 . 3 5 4 BSC. Di 7 .0 0 BSC. 0 . 2 7 6 BSC.

Contextual Info: A 1 g n '* ’ ^ - ^ 1 —0 .0 5 r n 7 K + .0 0 4 - -i L . 0 7 5 -.0 0 2 J w TYP TYP HOUSING: PPA RESIN, BLACK. CONTACTS: PHOSPHOR BRONZE. RETENTION LEG: BRASS. 2. CONTACT AREA CONNECTOR WILL ACCOMMODATE PRINTED CIRCUIT BOARD THICKNESS OF 0 .7 9 TO 1.60 [.0 3 1 TO .0 6 3 ].