M2003 Search Results

Siliconix

Abstract: M2003
Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR FLAT PACK 14, 16 Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage Solderability 30 240 883 M2003 0.00 Temp Cycle 100 10,000 −65_C−150_C 0.00 Document Number: 72550

Contextual Info: Package Reliability www.vishay.com Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR METAL CAN STRESS SAMPLE SIZE DEVICE HR./CYC CONDITION TOTAL FAILS FAIL PERCENTAGE Pressure Pot 200 19 200 121°, 15 PSIG 0.00 Solderability 45 135 883 M2003 0.00

transistor HR

Abstract: m2003 package diode electronic reliability siliconix j201
Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR METAL CAN Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage Solderability 420 3,360 883 M2003 0.00 Temp Cycle 2,300 662,500 −65_C−150_C 0.00 Document Number: 72454

Omega px139

Abstract: PX139-001D4V PX139-005D4V soil moisture sensors PX139-030D4V Omega process calibrator PX139-015D4V soil ph sensor Strain gage report refractometer
Contextual Info: PX139 Series Pressure Sensors INSTRUCTION SHEET M2003/0602 General Description The OMEGA PX139 Series Pressure Transducer uses state-of the-art micromachined silicon pressure sensors in conjunction with stress-free packaging techniques to provide highly accurate, temperature-compensated

M2003P

Contextual Info: MITSUBISHI ELEK -CLINEARI b2 DE fe GGGmDG 7 T-V3-2S INDUSTRY STANDARD LINEAR ICs MITSUBISHI M2003 SEMICONDUCTORS 7-UNIT 500mA DARLINGTON TRANSISTOR ARRAY WITH CLAMP DIODE DESCRIPTION The M2003, 7-channel sink driver, consists of 14 NPN transistors PIN CONFIGURATION TOP VIEW

72458

Abstract: M2003
Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR PLCC Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage HAST 200 20,000 130_C, 85%RH 0.00 Pressure Pot 300 28,800 121_, 15 PSIG 0.00 Solderability 45 360 883 M2003

K2003

Abstract: OSIRIS b2003 S0210 OSIRIS xuk 2 xuz a118 K2004 Z145 XUZ C50 Osiconcept photo-electric sensors
Contextual Info: References 1 Photo-electric sensors Osiris 1 Accessories 3D fixing kit 1 Description 1 XUZ B2003 XUZ M2003 XUZ K2003 2 XUZ X2003 XUZ M2004 XUZ K2004 3 XUZ 2001 4 For use with sensor type Ball-joint mounted fixing XUB or XUZ C50 bracket for mounting on M12 XUM or XUZ C50

cerdip

Abstract: sidebraze M2003
Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR CerDIP/SIDEBRAZE Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage SALT ATMOSPHERE 143 3,432 ms883/1009 0.00 Solderability 315 2,760 883 M2003 0.00 Temp Cycle

cerdip

Abstract: sidebraze siliconix j201 transistor HR M2003
Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR CerDIP/SIDEBRAZE Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage Solderability 105 840 883 M2003 0.00 Temp Cycle 500 130,000 −65_C−150_C 0.00 Document Number: 72452

K2003

Abstract: XUZM2004 Schneider xuZ A318 z118 S0210 Z145 B2003 K2004 Z318 Z155
Contextual Info: Photo-electric sensors References Osiris Accessories 3D fixing kit 1 Description XUZ B2003 XUZ M2003 XUZ K2003 XUZ X2003 XUZ M2004 XUZ K2004 XUZ 2001 Use for sensor type Ball-joint brackets for mounting XUB or XUZ C50 on M12 rod XUM or XUZ C50 XUK or XUZ C50

M2003

Abstract: M2004
Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR METAL CAN Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage LEAD INT 121 378 883 M2004 0.00 Solderability 170 1440 883 M2003 0.00 Temp Cycle 1400 445,000

Contextual Info: Package Reliability www.vishay.com Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR TSOP-6 STRESS SAMPLE SIZE DEVICE HR./CYC CONDITION TOTAL FAILS BOND INT 1040 520 000 200 C + N2 FAIL PERCENTAGE 0.00 HAST 4045 408 010 130 C, 85 % RH 0.00

Contextual Info: Package Reliability www.vishay.com Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR DPAK, TO-252, TO-251 STRESS SAMPLE SIZE DEVICE HR./CYC CONDITION TOTAL FAILS BOND INT 40 20 000 200 C + N2 FAIL PERCENTAGE 0.00 HAST 1691 169 100 130 C, 85 % RH

Contextual Info: Package Reliability www.vishay.com Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR SC-89 STRESS SAMPLE SIZE DEVICE HR./CYC CONDITION TOTAL FAILS BOND INT 160 80 000 200 C + N2 FAIL PERCENTAGE 0.00 HAST 1705 180 500 130 C, 85 % RH 0.00 0.00

Contextual Info: Package Reliability www.vishay.com Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR SC-75A STRESS SAMPLE SIZE DEVICE HR./CYC CONDITION TOTAL FAILS BOND INT 160 110 000 200 C + N2 FAIL PERCENTAGE 0.00 HAST 275 27 500 130 C, 85 % RH 0.00 0.00

Contextual Info: Package Reliability www.vishay.com Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR PowerPAIR 6 x 3.7 STRESS SAMPLE SIZE DEVICE HR./CYC CONDITION TOTAL FAILS BOND INT 240 106 720 200 C + N2 0.00 HAST 274 27 625 130 C, 85 % RH 0.00 Pressure Pot

Contextual Info: Package Reliability www.vishay.com Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR TO-220 FullPAK STRESS SAMPLE SIZE DEVICE HR./CYC CONDITION TOTAL FAILS 85/85 625 504 668 85 °C, 85 % RH FAIL PERCENTAGE 0.00 HAST 1090 109 000 130 C, 85 % RH

Contextual Info: Package Reliability www.vishay.com Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR PowerPAIR 6 x 5 STRESS SAMPLE SIZE DEVICE HR./CYC CONDITION TOTAL FAILS BOND INT 280 140 000 200 C + N2 FAIL PERCENTAGE 0.00 HAST 440 44 000 130 C, 85 % RH

L298D

Abstract: SAS251S4 ugn3013 SAS251 UCN4815A ULN3782M UDN2981LW uc3646 mc1417p CA1725E
Contextual Info: AMS-105 GENERAL INFORMATION SEMICONDUCTOR CROSS REFERENCE in Alpha-Numerical Order The suggested Allegro replacement devices are based on similarity as shown in currently published data. Exact replacement in all applications is not guaranteed and the user should compare the specifications of the competitive and recommended Allegro replacement. Special caution must be exercised in attempting to do a reverse cross. In some instances, the competitive device is obsolete; in

FS5C

Contextual Info: MOTOROLA Order this document by MRFIC2003/D SEMICONDUCTOR TECHNICAL DATA The MRFIC Line 900 MHz GaAs Antenna Sw itch MRFIC2003 The MRFIC2003 is an integrated GaAs SPDT Antenna Switch designed for transceivers operating in the 800 MHz to 1.0 GHz frequency range. The design

XUM0APSAM8

Abstract: Osiconcept photo-electric sensors beam break xum0apsal2 Reflex Schneider XUZM2004 M2003 M2004 bk41 520984
Contextual Info: Photo-electric sensors References, dimensions Osiris Universal, Osiconcept® 1 Miniature design, d.c. supply 501543_1 501542_1 Miniature design Three-wire, d.c. supply, solid-state output Function Output N/O or N/C using Osiconcept programming PNP NPN

xub telemecanique

Abstract: telemecanique OSIRIS xuk XUB0APSNM12 telemecanique OSIRIS xux XUX0ARCTT16 XUK0AKSAL2 XUB0BPSNM12 XUK0ARCTL2 XUK0AKSAM12 M18MA230
Contextual Info: Photo-electric sensors General Osiris Osiconcept®: Offering Simplicity through Innovation Principle In proposing the Osiconcept technology, Telemecanique offers simplicity through innovation. 1 Max. sensing distance 2 Max. sensing distance 3 b With Osiconcept, a single product meets all optical detection needs.

Contextual Info: M200 Connectors Female Vertical PC Tail For Board to Board application High Temperature material, Low Profile Twin Beam contacts Dual Entry Suitable for use with M20/M200 male connectors series Please contact sales@harwinasia.com for alternative plating 5.08

Contextual Info: M200 Connectors Female Vertical PC Tail For Board to Board application Low Profile Please contact sales@harwinasia.com for alternative plating 3.00 2.50 36 5.70 2.54 1. SINGLE ROW A 2.54mm .100” PITCH Suitable for use with M20/M200 male connectors series