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    CU-106A

    Abstract: 0.4mm pitch BGA IPC-6012A beagleboard 0.4mm pitch BGA routing IPC-6012 IPC-D-317 NAND FLASH LGA reflow profile CU-106A shelf life CBB Capacitor Selection Guide
    Text: Application Report SPRAAV1B – May 2009 PCB Design Guidelines for 0.4mm Package-On-Package PoP Packages, Part I Keith Gutierrez and Gerald Coley . ABSTRACT


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    IMCS 700

    Abstract: No abstract text available
    Text: STRATEGIES TO MITIGATE THE TIN WHISKER PHENOMENON Patrick Lavery, Principal Process Engineer, Vicor Corporation The tin whisker phenomenon is a failure mode associated with all electronic devices that use a number of low melting point elements e.g., Sn, Cd, In in operations such as


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