MARK W1 TSOP Search Results

AM29LV004T

Abstract: EDI7F33512V
Contextual Info: EDI7F33512V 512Kx32 FLASH DESCRIPTION FIG. 1 The EDI7F33512, EDI7F233512 and EDI7F433512 are organized as 512Kx32 and 2x512Kx32 and 4x512Kx32 respectively. The modules are based on AMD's AM29LV004T - 512Kx8 Flash Device in TSOP packages which are mounted on an FR4 substrate.

1.5528

Abstract: EDI7F33512C AM29F040 2192
Contextual Info: EDI7F33512C 512Kx32 Flash DESCRIPTION FIG. 1 The EDI7F33512, EDI7F233512 and EDI7F433512 are organized as 512Kx32 and 2x512Kx32 and 4x512Kx32 respectively. The modules are based on AMD's AM29F040 - 512Kx8 Flash Device in TSOP packages which are mounted on an FR4 substrate.

E28F008SA

Abstract: EDI7F341MC
Contextual Info: EDI7F341MC 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F341MC and EDI7F2341MC are organized as one and two banks of 1Mx32 respectively. The modules are based on Intel's E28F008SA - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.

EDI7F342MC

Abstract: E28F016S5
Contextual Info: EDI7F342MC 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MC and EDI7F2342MC are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's E28F016S5 -2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate BLOCK DIAGRAMS

1mx8

Abstract: E28F008SA EDI7F341MC
Contextual Info: EDI7F341MC 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F341MC and EDI7F2341MC are organized as one and two banks of 1Mx32 respectively. The modules are based on Intel's E28F008SA - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.

28F016S3

Abstract: EDI7F342MV
Contextual Info: EDI7F342MV 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MV and EDI 7F2342MV are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's 28F016S3- 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.

28F016S3

Abstract: EDI7F342MV
Contextual Info: EDI7F342MV 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MV and EDI 7F2342MV are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's 28F016S3- 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.

1mx8

Abstract: AM29LV008T EDI7F2331MV EDI7F331MV
Contextual Info: EDI7F331MV 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F331MV and EDI7F2331MV are organized as one and two banks of 1Mx32 respectively. The modules are based on AMDs AM29LV008T - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS

EDI7F331MV

Abstract: AM29LV008T EDI7F2331MV
Contextual Info: EDI7F331MV 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F331MV and EDI7F2331MV are organized as one and two banks of 1Mx32 respectively. The modules are based on AMDs AM29LV008T - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS

1.5528

Abstract: 1mx8 MARK J3 AM29F080 EDI7F331MC
Contextual Info: EDI7F331MC 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F331MC and EDI7F2331MC are organized as one and two banks of 1Mx32 respectively. The modules are based on AMDs AM29F080 - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS

AM29LV017B

Abstract: EDI7F332MV 15607
Contextual Info: EDI7F332MV 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F332MV and EDI7F2332MV are organized as one and two banks of 2Mx32 respectively. The modules are based on AMDs AM29LV017B- 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS

MARK J3

Abstract: AM29F016 EDI7F332MC amd AM29F016
Contextual Info: EDI7F332MC 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F332MC and EDI7F2332MC are organized as one and two banks of 2Mx32 respectively. The modules are based on AMDs AM29F016 - 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS

3402 transistor

Abstract: EDI7F4342MV
Contextual Info: EDI7F4342MV 4x2Mx32 FLASH MODULE FEATURES DESCRIPTION • 4x2Mx32 The EDI7F4342MV is organized as four banks of 2Mx32. The module is based on Intel's E28F016S3 - 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. • Based on Intel's E28F016S3 Flash Device

1mx8

Abstract: AM29F080 EDI7F4331MC
Contextual Info: EDI7F4331MC 4x1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F4331MC is organized as four banks of 1Mx32. The module is based on AMDs AM29F080 - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAM EDI7F4331MC-BNC:4x1Mx32 80 PIN SIMM

AM29LV008T

Abstract: EDI7F4331MV
Contextual Info: EDI7F4331MV 4x1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F4331MV is organized as four banks of 1Mx32. The module is based on AMDs AM29LV008T - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAM EDI7F4331MV-BNC: 4x1Mx32 80 PIN SIMM

Contextual Info: EDI9F37512C 512Kx37 Static RAM CMOS, High Speed Module FEATURES DESCRIPTION n 512Kx37 bit CMOS Static RAM The EDI9F37512C is a high speed 20 megabit Static RAM module organized as 512K words x 37 bits. This module is constructed from five 512Kx8 Static RAMs in TSOP packages on an epoxy laminate

BGA-80P-M01

Abstract: LGA-80 FPT-8P-M02 LGA-28 lcc 910 fpt 120 240 FPT-16P-M06 FPT-24P-M01 BGA63 FPT-8P-M01
Contextual Info: Taping Dimensions 6.4 Taping Dimensions 6.4.1 Embossed tapes standard: conforms with JIS (1) Reel dimensions W2 W1 B A r D C E (Dimensions in mm) Tape width 12mm 16mm 24mm 32mm 44mm Symbol 330 ± 2.0 A 254 ± 2.0 B 100 +2.0 −0 C 13 ± 0.2 D 21 ± 0.8 2 ± 0.5

Contextual Info: 1.8V MULTI-QUEUE FLOW-CONTROL DEVICES 8 QUEUES 36 BIT WIDE CONFIGURATION 589,824 bits 1,179,648 bits 2,359,296 bits 4,718,592 bits FEATURES • • • • • • • • • • Choose from among the following memory density options: IDT72P51339  Total Available Memory = 589,824 bits

Diode Mark ON B14

Contextual Info: 1.8V MULTI-QUEUE FLOW-CONTROL DEVICES 32 QUEUES 36 BIT WIDE CONFIGURATION 589,824 bits 1,179,648 bits 2,359,296 bits 4,718,592 bits FEATURES • • • • • • • • • • Choose from among the following memory density options: IDT72P51539  Total Available Memory = 589,824 bits

Diode Mark ON B14

Abstract: Q127 T6714
Contextual Info: 1.8V MULTI-QUEUE FLOW-CONTROL DEVICES 128 QUEUES 36 BIT WIDE CONFIGURATION 1,179,648 bits 2,359,296 bits 4,718,592 bits FEATURES • • • • • • • • • • Choose from among the following memory density options: IDT72P51749  Total Available Memory = 1,179,648 bits

Q127

Contextual Info: 1.8V MULTI-QUEUE FLOW-CONTROL DEVICES 128 QUEUES 36 BIT WIDE CONFIGURATION 1,179,648 bits 2,359,296 bits 4,718,592 bits FEATURES • • • • • • • • • • Choose from among the following memory density options: IDT72P51749 ⎯ Total Available Memory = 1,179,648 bits

Contextual Info: 1.8V MULTI-QUEUE FLOW-CONTROL DEVICES 32 QUEUES 36 BIT WIDE CONFIGURATION 589,824 bits 1,179,648 bits 2,359,296 bits 4,718,592 bits FEATURES • • • • • • • • • • Choose from among the following memory density options: IDT72P51539 ⎯ Total Available Memory = 589,824 bits

Contextual Info: 1.8V MULTI-QUEUE FLOW-CONTROL DEVICES 128 QUEUES 36 BIT WIDE CONFIGURATION 1,179,648 bits 2,359,296 bits 4,718,592 bits • FEATURES • • • • • • • • • Choose from among the following memory density options: IDT72P51749  Total Available Memory = 1,179,648 bits

Contextual Info: 1.8V MULTI-QUEUE FLOW-CONTROL DEVICES 8 QUEUES 36 BIT WIDE CONFIGURATION 589,824 bits 1,179,648 bits 2,359,296 bits 4,718,592 bits • FEATURES • • • • • • • • • Choose from among the following memory density options: IDT72P51339  Total Available Memory = 589,824 bits