MARKING CFA Search Results

A09 N03 MOSFET

Abstract: marking B3A sot23-5 t7G SOT23-6 marking H2A sot-23 ADM2004 marking moy sot-23 A06 N03 MOSFET SOT23-5 D2Q M05 SOT-23 M2A MARKING SOT-23
Contextual Info: Tiny Part Number Cross Reference Package Marking Model Function Package Description Package Marking Model Function Package Description 0Axx 0Bxx 2A0A 2B0A 2C0A 3A0A 3B0A 3C0A 4A0A 4B0A 4C0A 5A0A 5B0A 5C0A 9Jxx 9Lxx 9Mxx 9Rxx 9Sxx 9Txx 9Zxx A00 A01 A02 A04

CF02M591-01

Contextual Info: CF02M591-01 Rev E - Page 1 of 3 Product Family: 7 Watt RF Chip Power Resistor Part Number: CFA1206E50R0FS-T50 Construction: Features: •      High purity alumina substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat

IPC-4101

Abstract: IPC4101 210F JESD22-B102D EIA-638 106G 208H CFA1206E50R0FS thermal imaging
Contextual Info: CF02M591-01 Rev C - Page 1 of 3 Product Family: 7 Watt RF Chip Power Resistor Part Number Series: CFA1206 Series Construction: Features: •      High purity alumina substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat

IPC4101

Contextual Info: CF02M591-01 Rev D - Page 1 of 3 Product Family: 7 Watt RF Chip Power Resistor Part Number Series: CFA1206 Series Construction: Features: •      High purity alumina substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat

Contextual Info: Product Family: 7 Watt RF Chip Power Resistor Part Number Series: CFA1206 Series Construction: Features: • • • • • • High purity alumina substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat Pre-tinned Sn100, matte terminations

IPC-4101

Contextual Info: Product Family: RF Chip Power Resistor Part Number Series: CFA1206E50R0FS Construction: • High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard Features:

Contextual Info: Product Family: RF Chip Power Resistor Part Number Series: CFA2512E50R0JS Construction: • High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard Features:

thermal camera

Abstract: IPC-4101 Sn60Pb40 solder Sn60Pb40 JESD22-B102D J-STD-002B 106G 208H 210F Res 2512
Contextual Info: Product Family: RF Chip Power Resistor Part Number Series: CFA2512E50R0JS Construction: • High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard Features:

TS0747

Abstract: 0747c
Contextual Info: 3M CF Card Header CompactFlash Type I, Low Profile, Surface Mount • • • • • 7E50 Series Meets CFA standards 4.0 mm low profile height Single row solder tails with 0.635 mm spacing Ejector option for easy removal of CF Card See Regulatory Information Appendix RIA

7E50

Abstract: D7E50-8316-03
Contextual Info: 3M CF Card Header CompactFlash Type I, Low Profile, Surface Mount • • • • • 7E50 Series Meets CFA standards 4.0 mm low profile height Single row solder tails with 0.635 mm spacing Ejector option for easy removal of CF Card See Regulatory Information Appendix RIA

ria 261

Abstract: 7E50 D7E50-7316-03 TS-0662-C 4016 3m 3M 4016
Contextual Info: 3M CF Card Header CompactFlash™ Type I, Surface Mount 7E50 Series • Meets CFA standards • Single row solder tails with 0.635 mm spacing • Board component clearance with 1.64 mm standoff • Ejector option for easy removal of CF Card • Retainer clip option permits stability for mobile

Contextual Info: 3M CF Card Header CompactFlash™ Type I, Low Profile, Surfacemount • • • • • 7E50 Series Meets CFA standards 4.0 mm low profile height Single row solder tails with 0.635 mm spacing Ejector option for easy removal of CF Card See Regulatory Information Appendix RIA

pm o2 pin detail

Contextual Info: 3M CF Card Header CompactFlash¥ Type I, Surface Mount 7E50 Series • Meets CFA standards • Single row solder tails with 0.635 mm spacing • Board component clearance with 1.64 mm standoff • Ejector option for easy removal of CF Card • Retainer clip option permits stability for mobile

Contextual Info: Mechanical Dimensions CFA Series Crystal Dimensions are in millimeters 11.5x5.0x13.46 HC-49/U RoHS Compliant 1.8432 to 85.000MHz Electrical SpecificaƟons Frequency Range 1.8432MHz to 85.000MHz OperaƟng Temperature Range -10° to 60°C, -20 to 70°C or –40° to 85°C

Contextual Info: COiNDEINSAIkUKS CfaKAMigiL VIULLtS LLASSL L MOLDED CERAMIC CAPACITORS CLASS 2 TCN 61.62.63.64 Modele n o r m a l is S t a n d a r d m o d e l CN 61 1 CN 61 N , CN 62 CN 62 N I CN 63 Appellation commercial o ! C o m m e r c i a l ty p e TCN 6 1 1 TCN 61 N TCN 62 I TCN 62 N TCN 63

carbon film resistors

Abstract: CFA0207
Contextual Info: CFA0207 Vishay Draloric Carbon Film Resistors, Standard FEATURES • Conformal lacquer coating • Stable film structure • Low performance and low cost applications • General purpose commodity products • Compatible with automatic insertion equipment

marking 2x

Abstract: MARKING CF D7E50-7316-03
Contextual Info: .050″  .050″ CF Card Header Type I, Surface Mount S Single row solder tails — 0.635 mm spacing S Board component clearance — 1.64 mm standoff S Ejector option — easy removal of CF Card from right angle hearder S Meets CFA standards — known reliability

d7e50-7316-03

Abstract: marking 2x N7E50-X516XX-20 4016 3m 3M 4016
Contextual Info: .050″  .050″ CF Card Header Type I, Surface Mount S Single row solder tails — 0.635 mm spacing S Board component clearance — 1.64 mm standoff S Ejector option — easy removal of CF Card from right angle hearder S Meets CFA standards — known reliability

7E50

Abstract: D7E50-8316-03 TS-0747-12
Contextual Info: 3M CF Card Header CompactFlash Type I, Low Profile, Surface Mount S Meets CFA standards S 4.0 mm low profile height S Single row solder tails with 0.635 mm spacing S Ejector option for easy removal of CF Card Date Modified:May 30, 2003 TS-0747-12 Sheet 1 of 3

sandisk m2

Abstract: SanDisk compactflash datasheet 0747 0747 ics 7E50 D7E50-8316-03
Contextual Info: 3M CF Card Header CompactFlash Type I, Low Profile, Surface Mount • • • • • 7E50 Series Meets CFA standards 4.0 mm low profile height Single row solder tails with 0.635 mm spacing Ejector option for easy removal of CF Card RoHS* compliant version PG & PK plating

N7E50-X516XX-20

Abstract: ASTM A150 SanDisk compactflash datasheet sandisk m2 7E50 D7E50-7316-03 4016 3m
Contextual Info: 3M CF Card Header CompactFlash Type I, Surface Mount 7E50 Series S Meets CFA standards S Single row solder tails with 0.635 mm spacing S Board component clearance with 1.64 mm standoff S Ejector option for easy removal of CF Card S Retainer clip option permits stability for

MARKING CF

Abstract: 7E50 D7E50-7316-03 066220 4016 3m
Contextual Info: 3M CF Card Header CompactFlash Type I, Surface Mount 7E50 Series • Meets CFA standards • Single row solder tails with 0.635 mm spacing • Board component clearance with 1.64 mm standoff • Ejector option for easy removal of CF Card • Retainer clip option permits stability for mobile

sandisk m2

Abstract: MARKING CF SanDisk compactflash datasheet 7E50 D7E50-7316-03 64um 4016 3m 3M 4016
Contextual Info: 3M CF Card Header CompactFlash Type I, Surface Mount 7E50 Series • Meets CFA standards • Single row solder tails with 0.635 mm spacing • Board component clearance with 1.64 mm standoff • Ejector option for easy removal of CF Card • Retainer clip option permits stability for mobile

BAAAD

Abstract: EL5102 EL5102IS EL5102IS-T7 EL5103 EL5202 EL5203 EL5302 BAAAE
Contextual Info: EL5102, EL5103, EL5202, EL5203, EL5302 October 3, 2005 Data Sheet 400MHz Slew Enhanced VFAs Features The EL5x02 and EL5x03 families represent high-speed VFAs based on a CFA amplifier architecture. This gives the typical high slew rate benefits of a CFA family along with the