MATERIAL COMPOSITION Search Results

material composition

Contextual Info: Material Composition Specification SOD-923 Case Pb lead -free plating Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 mg Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% Material

E 70 5059

Abstract: material composition 223-18 74 AG 393 6363
Contextual Info: Material Composition Specification SMDIP Case Pb lead -free plating* Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 mg Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% Material Component

Contextual Info: HM79S-63470LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire SOLDER Lead Free Solder 3 4 ADHESIVE Epoxy Resin Element Composition CAS No Material Mass Composition

Contextual Info: M Series Pin and Socket Connectors Catalog 82003 Revised 8-96 Material Specifications Contacts Material Specifications The material composition and construction of AMP contacts encompass vary­ ing price ranges and performance characteris­ tics. Specific materials and

Contextual Info: HM78-10150LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire 3 SOLDER Lead Free Solder 4 ADHESIVE Epoxy Resin Element Composition CAS No Material Mass Composition g

Contextual Info: HM79-103R3LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire 3 SOLDER Lead Free Solder Element Composition CAS No Material Mass Composition g (g) Iron Oxide Copper Oxide

Contextual Info: HM12-10001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)

Contextual Info: HM41-11510LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core NY UEW-H 2 WIRE Triple Insulation 3 4 BODY SOLDER Holder Lead Free Solder CAS No Material Mass mg Composition (mg) Nickel Zinc Ferrite Manganese Zinc

Contextual Info: HM31-20050LF summary material content, BI Technologies Corporation Index Item Material Name Element Composition Ferric Oxide Zinc Oxide Nickel Oxide Cupric Oxide Material Mass mg Composition (mg) 1309-37-1 8051-03-4 1313-99-1 1317-38-0 2410 2048.5 120.5

Contextual Info: HM12-03501LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)

Contextual Info: HM12-15001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)

Contextual Info: HM31-21050LF summary material content, BI Technologies Corporation Index Item Material Name Element Composition Ferric Oxide Zinc Oxide Nickel Oxide Cupric Oxide Material Mass mg Composition (mg) 1309-37-1 8051-03-4 1313-99-1 1317-38-0 1870 1589.5 93.5 93.5

Contextual Info: HM12-01001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)

Contextual Info: HM41-20105LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core NY UEW-H 2 WIRE Triple Insulation 3 4 BODY SOLDER Holder Lead Free Solder CAS No Material Mass mg Composition (mg) Nickel Zinc Ferrite Manganese Zinc

Contextual Info: HM41-21010LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core NY UEW-H 2 WIRE Triple Insulation 3 4 BODY SOLDER Holder Lead Free Solder CAS No Material Mass mg Composition (mg) Nickel Zinc Ferrite Manganese Zinc

Contextual Info: HM12-02502LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)

methanol

Contextual Info: 21-Jul-09 HM72A-06R47LFTR summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Tooled Part 2 COIL Wire 3 LEAD Lead Frame Ink 4 MARKING Ink Element Composition CAS No Material Mass Composition g (g) Iron Magnesium Silicon

Contextual Info: HM41-10812LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core NY UEW-H 2 WIRE Triple Insulation 3 4 BODY SOLDER Holder Lead Free Solder CAS No Material Mass mg Composition (mg) Nickel Zinc Ferrite Manganese Zinc

Contextual Info: HM12-16001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)

Contextual Info: HM41-12020LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core NY UEW-H 2 WIRE Triple Insulation 3 4 BODY SOLDER Holder Lead Free Solder CAS No Material Mass mg Composition (mg) Nickel Zinc Ferrite Manganese Zinc

Contextual Info: HM54-44R42VLF summary material content, BI Technologies Corporation Index Item Material Name Element Composition CAS No Material Mass mg Composition (mg) 7439-89-6 - 1730 1712.7 10.38 6.92 1 CORE Toroid Core Iron Binder Lubricant 2 WIRE NY UEW-H Copper Polyurethane (PU)

Contextual Info: HM12-07001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)

Contextual Info: HM69-10R025LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE NP2 2 COIL Copper Strip 3 SOLDER Lead Free Solder Element Composition CAS No Material Mass Composition g (g) Fe2O3 Mn3O4 ZnO 1309-37-1 1317-35-7 1314-13-2

Contextual Info: BHCL 322522 summary material content, BI Technologies Corporation Index 1 Item CORE Material Name Element Composition CAS No Material Mass mg Composition (mg) 11.00 6.490 1.320 0.990 2.200 Ferrite Fe2O3 NiO CuO ZnO 1309-37-1 1313-99-1 1317-38-0 1314-13-2